SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor device semiconductor device allowing for use of a test circuit that withstands only low voltages and has a small circuit area. A high-voltage operational circuit, which is operated at a high voltage, is connected to first and second pads. A multiplexer used to test the high-voltage operational circuit is connected to a third pad in addition to the first and second pads. Fuses are arranged on wires connecting the first and second pads to the multiplexer. An inspection board connects the third pad to ground after testing the high-voltage operational circuit, provides a breakage signal to the multiplexer, and applies voltage to the first or second pad. The multiplexer, which receives the breakage signal, connects the first or second pad with the third pad so that current flows therebetween. This breaks the corresponding fuse and insulates the multiplexer from the high-voltage operational circuit.
1 . A semiconductor device comprising:
an operational circuit;
a test circuit for conducting a test on the operational circuit, wherein the operational circuit operates at voltage that is higher than a test voltage used by the test circuit; and
a wire breakage facilitation unit, arranged on part of a wire connecting the operational circuit and the test circuit, for insulating the test circuit from the operational circuit, wherein the wire breakage facilitation unit is connected to the operational circuit when the test circuit conducts a test and disconnected from the operational circuit when the operational circuit operates.
2 . The semiconductor device of claim 1 , wherein the wire breakage facilitation unit is a fuse.
3 . The semiconductor device of claim 2 , further comprising:
a plurality of electrodes that are connectable to an external device and through which current that is large enough to break the fuse flows.
4 . A method for manufacturing a semiconductor device including:
an operational circuit;
a test circuit for testing the operational circuit, wherein the operational circuit operates at higher voltage than the test circuit; and
a wire breakage facilitation unit arranged on part of a wire connecting the operational circuit and the test circuit;
the method comprising:
breaking the wire breakage facilitation unit after the test circuit tests the operational circuit, thereby insulating the test circuit from the operational circuit.
5 . The method of claim 4 , wherein:
the wire breakage facilitation unit is a fuse;
the test circuit, when receiving a breakage signal, connects a wire connected to the fuse and a wire connected to an electrode, which is connectable to an external device; and
said breaking the wire breakage facilitation unit includes:
providing the breakage signal to the test circuit; and
having current flow to the wire on which the fuse is arranged to break the fuse.