Electrical connector and electronic assembly having a lead arrangement
A lead arrangement suitable for an electrical connector includes a lead lane. The lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, and a ground lead positioned between the two pairs of first and second differential signal leads. Each of the first and second differential signal leads has a surface mounting segment for being soldered onto a surface pad of a circuit board. The ground lead has a via passing segment for being soldered into a through via of the circuit board.
1. A lead arrangement adapted for an electrical connector, the lead arrangement comprising:
a first lead lane comprising:
a pair of first differential signal leads;
a pair of second differential signal leads; and
a first ground lead positioned between the two pairs of differential signal leads,
wherein each of the pair of first differential signal leads and the pair of second differential signal leads comprises a surface mounting segment adapted for being soldered to a surface pad of a circuit board, the first ground lead comprises a via passing segment adapted for being soldered into a through via of the circuit board, the pair of first differential signal leads is a pair of differential signal transmitting leads T x + and T x − in a universal serial bus (USB) 3.0 architecture, and the pair of second differential signal leads is a pair of differential signal receiving leads R x + and R x − in the USB 3.0 architecture.
2. A lead arrangement adapted for an electrical connector, the lead arrangement comprising:
a first lead lane comprising:
a pair of first differential signal leads;
a pair of second differential signal leads; and
a first ground lead positioned between the two pairs of differential signal leads; and
a second lead lane positioned side-by-side with the first lead lane, the second lead lane comprising:
a second ground lead;
a power lead; and
a pair of third differential signal leads positioned between the second ground lead and the power lead,
wherein each of the pair of first differential signal leads and the pair of second differential signal leads comprises a surface mounting segment adapted for being soldered to a surface pad of a circuit board, the first ground lead comprises a via passing segment adapted for being soldered into a through via of the circuit board, each of the second ground lead, the power lead, and the pair of third differential signal leads comprises another via passing segment adapted for being soldered into another through via of the circuit board.
3. The lead arrangement according to claim 2 , wherein the pair of third differential signal leads is a pair of differential signal transmitting/receiving leads D + and D − in the USB 3.0 architecture for being compatible USB 1.0 architecture or USB 2.0 architecture.
4. The lead arrangement according to claim 2 , wherein the pair of first differential signal leads is a pair of differential signal transmitting leads T x + and T x − in the USB 3.0 architecture, and the power lead is positioned side-by-side with and adjacent to the pair of differential signal transmitting leads T x + and T x − .
5. The lead arrangement according to claim 2 , wherein the pair of second differential signal leads is a pair of differential signal receiving leads R x + and R x − in the USB 3.0 architecture, and the second ground lead is positioned side-by-side with and adjacent to the differential signal receiving leads R x + and R x − .
6. An electrical connector comprising:
a metal housing;
an insulating base connected to the metal housing; and
a lead arrangement disposed on the insulating base, the lead arrangement comprising:
a first lead lane comprising:
a pair of first differential signal leads;
a pair of second differential signal leads; and
a first ground lead positioned between the two pairs of differential signal leads,
wherein each of the pair of first differential signal leads and the pair of second differential signal leads comprises a surface mounting segment adapted for being soldered to a surface pad of a circuit board, the first ground lead comprises a via passing segment adapted for being soldered into a through via of the circuit board, the pair of first differential signal leads is a pair of differential signal transmitting leads T x + and T x − in a USB 3.0 architecture, and the pair of second differential signal leads is a pair of differential signal receiving leads R x + and R x − in the USB 3.0 architecture.
7. An electrical connector comprising:
a metal housing;
an insulating base connected to the metal housing; and
a lead arrangement disposed on the insulating base, the lead arrangement comprising:
a first lead lane comprising:
a pair of first differential signal leads;
a pair of second differential signal leads; and
a first ground lead positioned between the two pairs of differential signal leads; and
a second lead lane positioned side-by-side with the first lead lane, the second lead lane comprising:
a second ground lead;
a power lead; and
a pair of third differential signal leads positioned between the second ground lead and the power lead,
wherein each of the pair of first differential signal leads and the pair of second differential signal leads comprises a surface mounting segment adapted for being soldered to a surface pad of a circuit board, the first ground lead comprises a via passing segment adapted for being soldered into a through via of the circuit board, each of the second ground lead, the power lead, and the pair of third differential signal leads comprises another via passing segment adapted for being soldered into another through via of the circuit board.
8. The electrical connector according to claim 7 , wherein the pair of third differential signal leads is a pair of differential signal transmitting/receiving leads D + and D − in the USB 3.0 architecture for being compatible USB 1.0 architecture or USB 2.0 architecture.
9. The electrical connector according to claim 7 , wherein the pair of first differential signal leads is a pair of differential signal transmitting leads T x + and T x − in the USB 3.0 architecture, and the power lead is positioned side-by-side with and adjacent to the pair of differential signal transmitting leads T x + and T x − .
10. The lead arrangement according to claim 7 , wherein the pair of second differential signal leads is a pair of differential signal receiving leads R x + and R x − in the USB 3.0 architecture, and the second ground lead is positioned side-by-side with and adjacent to the differential signal receiving leads R x + and R x − .
11. An electronic assembly comprising:
a circuit board comprising a plurality of surface pads and a plurality of through vias; and
an electrical connector comprising:
a metal housing;
an insulating base connected to the metal housing; and
a lead arrangement disposed on the insulating base, the lead arrangement comprising:
a first lead lane comprising:
a pair of first differential signal leads;
a pair of second differential signal leads; and
a first ground lead positioned between the two pairs of differential signal leads,
wherein each of the pair of first differential signal leads and the pair of second differential signal leads comprises a surface mounting segment being soldered to a surface pad of a circuit board, the first ground lead comprises a via passing segment being soldered into one of the through vias of the circuit board, the pair of first differential signal leads is a pair of differential signal transmitting leads T x + and T x − in a USB 3.0 architecture, and the pair of second differential signal leads is a pair of differential signal receiving leads R x + and R x − in the USB 3.0 architecture.
12. An electronic assembly comprising:
a circuit board comprising a plurality of surface pads and a plurality of through vias; and
an electrical connector comprising:
a metal housing;
an insulating base connected to the metal housing; and
a lead arrangement disposed on the insulating base, the lead arrangement comprising:
a first lead lane comprising:
a pair of first differential signal leads;
a pair of second differential signal leads; and
a first ground lead positioned between the two pairs of differential signal leads, and
a second lead lane positioned side-by-side with the first lead lane, the second lead lane comprising:
a second ground lead;
a power lead; and
a pair of third differential signal leads positioned between the second ground lead and the power lead,
wherein each of the pair of first differential signal leads and the pair of second differential signal leads comprises a surface mounting segment being soldered to a surface pad of a circuit board, the first ground lead comprises a via passing segment being soldered into one of the through vias of the circuit board, each of the second ground lead, the power lead, and the pair of third differential signal leads comprises another via passing segment adapted for being soldered into another of the through vias of the circuit board.
13. The electronic assembly according to claim 12 , wherein the pair of third differential signal leads is a pair of differential signal transmitting/receiving leads D + and D 31 in the USB 3.0 architecture for being compatible USB 1.0 architecture or USB 2.0 architecture.
14. The electronic assembly according to claim 12 , wherein the pair of first differential signal leads is a pair of differential signal transmitting leads T x + and T x − in the USB 3.0 architecture, and the power lead is positioned side-by-side with and adjacent to the pair of differential signal transmitting leads T x + and T x − .
15. The electronic assembly according to claim 12 , wherein the pair of second differential signal leads is a pair of differential signal receiving leads R x + and R x − in the USB 3.0 architecture, and the second ground lead is positioned side-by-side with and adjacent to the differential signal receiving leads R x + and R x − .