IP Library › Assignment 050808/0461
Patent Assignment
Reel/Frame 050808/0461

Assignment of Assignor's Interest

Recorded: 2019-10-23 Pages: 4
Assignor
VIA TECHNOLOGIES, INC.
Executed: 2019-10-22
Assignee
VIA LABS, INC.
7F, 529-1, ZHONGZHENG RD., XINDIAN DIST.,, NEW TAIPEI CITY, 231, TAIWAN
Covered Properties (9)
Electrical Connector and Electronic Assembly Having a Lead Arrangement
Patent: 8,303,315 →
Application: 12/615,455 →
Publication: US 2011/0070751
Electric Connector and Electric Assembly
Patent: 8,083,546 →
Application: 12/685,871 →
Publication: US 2011/0021043
Cable Assembly and Electronic Device
Patent: 8,976,510 →
Application: 13/039,272 →
Publication: US 2011/0249380
Differential Signal Pair Transmission Structure, Wiring Board and Electronic Module
Patent: 8,552,308 →
Application: 13/275,320 →
Publication: US 2012/0243184
Capacitor Structure
Patent: 8,582,276 →
Application: 13/414,725 →
Publication: US 2013/0148258
Universal Serial Bus Hub and Control Method Thereof
Application: 14/138,151 →
Publication: US 2014/0298053
Circuit Layout Structure, Circuit Board and Electronic Assembly
Patent: 9,210,800 →
Application: 14/533,098 →
Charger and Power Delivery Control Chip and Charging Method Thereof
Application: 15/488,525 →
Publication: US 2018/0062400
Electronic Apparatus Capable of Collectively Managing Different Firmware Codes and Operation Method Thereof
Application: 15/876,205 →
Publication: US 2018/0210744
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2009
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023505/0051 →
Assignment of Assignor's Interest Jan 12, 2010
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023769/0766 →
Assignment of Assignor's Interest Mar 4, 2011
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 025900/0237 →
Assignment of Assignor's Interest Oct 19, 2011
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 027082/0598 →
Assignment of Assignor's Interest Mar 9, 2012
From: CHEN, CHIEN-SHENG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 027832/0645 →
Assignment of Assignor's Interest Jan 2, 2014
From: CHEN, YI-TE; SHIH, TERRANCE SHIYANG; LIN, HSIAO-CHYI
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031876/0454 →
Assignment of Assignor's Interest Nov 6, 2014
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 034112/0718 →
Assignment of Assignor's Interest Apr 17, 2017
From: WANG, TZE-SHIANG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 042022/0894 →
Assignment of Assignor's Interest Jan 22, 2018
From: SHIH, TERRANCE SHIYANG; HSU, CHIN-SUNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 044683/0389 →