IP Library Granted Patent US 8,083,546
Granted Patent B2
US 8,083,546 · App. 12/685,871 · Granted Dec 27, 2011

Electric connector and electric assembly

Assignee: VIA Technologies, Inc.
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Quick Facts
Patent No.
US 8,083,546
App. No.
12/685,871
Granted
Dec 27, 2011
Kind
B2
Abstract

An electric assembly includes a circuit board and an electric connector. The circuit board comprises a first surface and a second surface opposite thereto. The electric connector includes a metallic case, an insulating base, first leads and second leads. The insulating base is connected with the metallic case. The first leads are disposed on the insulating base and soldered to the first surface. The first leads includes a pair of first differential signal leads, a pair of second differential signal leads and a ground lead located between the pair of first differential signal leads and the pair of second differential signal leads. The second leads are disposed on the insulating base and soldered to the second surface. The second leads include a power lead, a second ground lead and a pair of third differential signal leads located between the power lead and the second ground lead.

Claims (46)

1. An electric connector suitable for being mounted on a circuit board, the circuit board having a first surface and a second surface opposite to the first surface, and the circuit board comprising a first circuit disposed on the first surface and a second circuit disposed on the second surface, the electric connector comprising:

a metallic case;

an insulating base connected with the metallic case;

a plurality of first leads disposed on the insulating base and soldered to the first surface, wherein the first leads comprises:

a pair of first differential signal leads;

a pair of second differential signal leads; and

a first ground lead located between the pair of first differential signal leads and the pair of second differential signal leads,

wherein the pair of first differential signal leads and the pair of second differential signal leads of the first leads are soldered to the first circuit; and

a plurality of second leads disposed on the insulating base and soldered to the second surface, wherein the second leads comprises:

a power lead;

a second ground lead; and

a pair of third differential signal leads located between the power lead and the second ground lead,

wherein the pair of third differential signal leads of the second leads are soldered to the second circuit.

2. The electric connector as claimed in claim 1 , wherein the pair of first differential signal leads is a pair of transmitting differential signal leads T x + and T x − for USB 3.0, while the pair of second differential signal leads is a pair of receiving differential signal leads R x + and R x − for USB 3.0.

3. The electric connector as claimed in claim 1 , wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D + and D − for USB 3.0 and supporting USB 1.0 or USB 2.0.

4. The electric connector as claimed in claim 1 , wherein an orthographic projection of the first leads on the first surface does not overlap an orthographic projection of the second leads on the first surface.

5. An electric assembly, comprising:

a circuit board having a first surface and a second surface opposite to the first surface, the circuit board comprises:

a first circuit disposed on the first surface; and

a second circuit disposed on the second surface; and

an electric connector, comprising:

a metallic case;

an insulating base connected with the metallic case;

a plurality of first leads disposed on the insulating base and soldered to the first surface, wherein the first leads comprises:

a pair of first differential signal leads;

a pair of second differential signal leads;

a first ground lead located between the pair of first differential signal leads and the pair of second differential signal leads,

wherein the pair of first differential signal leads and the pair of second differential signal leads of the first leads are soldered to the first circuit;

a plurality of second leads disposed on the insulating base and soldered to the second surface, wherein the second leads comprises:

a power lead;

a second ground lead; and

a pair of third differential signal leads located between the power lead and the second ground lead,

wherein the pair of third differential signal leads of the second leads are soldered to the second circuit.

6. The electric assembly as claimed in claim 5 , wherein the pair of first differential signal leads is a pair of transmitting differential signal leads T x + and T x − for USB 3.0, while the pair of second differential signal leads is a pair of receiving differential signal leads R x + and R x − for USB 3.0.

7. The electric assembly as claimed in claim 5 , wherein the pair of third differential signal leads is a pair of transmitting/receiving differential signal leads D + and D − for USB 3.0 and supporting USB 1.0 or USB 2.0.

8. The electric assembly as claimed in claim 5 , wherein an orthographic projection of the first leads on the first surface does not overlap an orthographic projection of the second leads on the first surface.

9. The electric assembly as claimed in claim 5 , further comprising:

a control chip disposed on the first surface.

10. The electric assembly as claimed in claim 9 , wherein the pair of second differential signal leads of the first leads are electrically connected to the control chip via the first circuit, and

the pair of third differential signal leads of the second leads are electrically connected to the control chip via the second circuit.

11. The electric assembly as claimed in claim 10 , wherein the circuit board further comprises:

a plurality of conductive vias connecting the second circuit to the first circuit such that the second leads are electrically connected to the control chip through the second circuit, the conductive vias and the first circuit sequentially.

12. The electric assembly as claimed in claim 10 , wherein the circuit board further comprises:

a reference plane located between the first circuit and the second circuit.

13. The electric assembly as claimed in claim 12 , wherein the reference plane is a ground plane, and both of the ground lead and the second ground lead are electrically connected to the ground plane.

14. The electric assembly as claimed in claim 12 , wherein the reference plane is a power plane, and the power lead is electrically connected to the power plane.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2019
From: VIA TECHNOLOGIES, INC.
To: VIA LABS, INC.
Reel/Frame 050808/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2010
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023769/0766 →
Priority Claims (1)
TW 98136684 A · Oct 29, 2009 · national
Continuity (2)
Provisional Application 61228953 · Jul 27, 2009
Related Publication 20110021043A1 · Jan 27, 2011