IP Library Granted Patent US 8,215,177
Granted Patent B2
US 8,215,177 · App. 12/619,409 · Granted Jul 10, 2012

Apparatus and methods for applying stress-induced offset compensation in sensor devices

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,215,177
App. No.
12/619,409
Granted
Jul 10, 2012
Kind
B2
Abstract

Apparatus and methods for applying stress-induced offset compensation and/or scale factor correction in sensor devices are provided. One sensor device ( 100, 300, 500, 700 ) includes an integrated circuit device ( 110, 310, 510, 710 ), a transducer ( 120, 320, 520, 720 ) coupled to the ASIC device, and a stress sensor ( 130, 330, 530, 730 ) coupled to the transducer or the integrated circuit device and configured to measure stress on the sensor device independent of the transducer. Another sensor device ( 900 ) includes a transducer, a sensor package ( 940 ) enclosing the transducer, and a stress sensor ( 930 ) coupled to the sensor device package and configured to measure stress on the sensor device independent of the transducer. A method includes detecting, via a stress sensor, an amount of stress being applied to the sensor device and adjusting, via the stress sensor and independent of the transducer, an output of the sensor device by the detected amount of stress.

Claims (31)

1. A sensor device, comprising:

an integrated circuit device;

a transducer coupled to the integrated circuit device and configured to generate a transducer output;

a first stress sensor coupled to the transducer or the integrated circuit device and configured to detect a first measure of stress being experienced by the sensor device, the first measure of stress being indicated by a first stress signal; and

a compensation circuit coupled to the transducer and to the first stress sensor, the compensation circuit being configured to receive the transducer output and the first stress signal, calculate an amount of offset to at least partially compensate for the detected first measure of stress, and to adjust the transducer output in response to the first stress signal, wherein the adjusting is independent of operation of the transducer, and wherein the adjusting comprises adjusting the transducer output with the calculated amount of offset to generate a corrected output for the sensor device that compensates for the detected first measure of stress.

2. The sensor device of claim 1 , further comprising a second stress sensor coupled to the transducer or the integrated circuit device, the second stress sensor configured to generate a second stress signal that is indicative of stress on the sensor device independent of the transducer, wherein the compensation circuit is also coupled to the second stress sensor, and the compensation circuit is configured to offset the transducer output in response to the first stress signal and in response to the second stress signal.

3. The sensor device of claim 1 , wherein the compensation circuit is implemented in the integrated circuit device.

4. The sensor device of claim 3 , wherein the compensation circuit is implemented with a processor of the integrated circuit device.

5. The sensor device of claim 1 , wherein the first stress sensor is one of a resistor bridge, a capacitive sensor, an optical sensor, a piezoelectric sensor, and a resistive sensor.

6. The sensor device of claim 5 , wherein the transducer is one of an accelerometer, a gyro, a compass, a pressure sensor, and a torque sensor.

7. The sensor device of claim 1 , wherein the transducer is one of an accelerometer, a gyro, a compass, a pressure sensor, and a torque sensor.

8. The sensor device of claim 1 , wherein the first stress sensor is a resistor bridge and the transducer is an accelerometer.

9. The sensor device of claim 1 , further comprising a plurality of wire bonds coupling the transducer to the integrated circuit device.

10. A microelectromechanical sensor device, comprising:

a transducer configured to generate a transducer output signal;

a sensor device package enclosing the transducer;

a first stress sensor coupled to the sensor device package and configured to detect a first measure of stress being experienced by the sensor device, the first measure of stress being indicated by a first stress signal; and

a compensation circuit coupled to the transducer and to the first stress sensor, the compensation circuit being configured to receive the transducer output signal and the first stress signal, calculate an amount of offset to at least partially compensate for the detected first measure of stress, and adjust the transducer output signal in response to the first stress signal, wherein the adjusting is independent of operation of the transducer, and wherein the adjusting comprises adjusting the transducer output signal with the calculated amount of offset to generate a corrected output for the sensor device that compensates for the detected first measure of stress.

11. The microelectromechanical sensor device of claim 10 , further comprising a second stress sensor coupled to the sensor device package, the second stress sensor configured to detect a second amount of stress on the sensor device independent of the transducer, wherein the detected second amount of stress is used to scale the output of the transducer.

12. The sensor device of claim 10 , wherein the transducer is one of an accelerometer, a gyro, a compass, a pressure sensor, and a torque sensor.

13. The microelectromechanical sensor device of claim 10 , wherein the first stress sensor is one of a resistor bridge, a capacitive sensor, an optical sensor, a piezoelectric sensor, and a resistive sensor.

14. The microelectromechanical sensor device of claim 10 , wherein the first stress sensor is a resistor bridge and the transducer is an accelerometer.

15. A method for applying stress-induced compensation in a sensor device including a transducer and one or more stress sensors, the method comprising:

detecting, via a first stress sensor, a first measure of stress being experienced by the sensor device, the first measure of stress being indicated by a first stress signal;

calculating an amount of offset to at least partially compensate for the detected first measure of stress; and

adjusting an output of the transducer in response to the first stress signal, wherein the adjusting is independent of operation of the transducer, and wherein the adjusting comprises adjusting the output of the transducer with the calculated amount of offset to generate a corrected output for the sensor device that compensates for the detected first measure of stress.

16. A method for applying stress-induced compensation in a sensor device including a transducer and one or more stress sensors, the method comprising:

detecting, via a first stress sensor, a first measure of stress being experienced by the sensor device, the first measure of stress being indicated by a first stress signal;

detecting, via a second stress sensor, a second measure of stress being experienced by the sensor device, the second measure of stress being indicated by a second stress signal; and

adjusting an output of the transducer in response to both the first stress signal and the second stress signal, wherein the adjusting is independent of operation of the transducer.

17. The method of claim 16 , further comprising calculating an amount of offset based upon the detected first measure of stress and the detected second measure of stress, wherein adjusting the output of the transducer is influenced by the amount of offset.

Assignments (23)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NORTH STAR INNOVATIONS INC.
Reel/Frame 037694/0264 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037355/0723 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2009
From: HAYNER, DAVID A.; MILLER, TODD F.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 023665/0897 →