Defect detection recipe definition
View Patent ↗A method of forming a device is disclosed. The method includes providing a substrate and processing a layer of the device on the substrate. The layer is inspected with an inspection tool for defects. The inspection tool is programmed with an inspection recipe determined from studying defects programmed into the layer at known locations.
1. A method of forming a device comprising:
providing a substrate;
processing a layer of the device on the substrate; and
inspecting the layer with an inspection tool for defects, wherein the inspection tool is programmed with an inspection recipe determined from a programmed defects study; and
wherein the programmed defects study comprises
providing a test chiplet with defects programmed therein at known locations of the substrate,
inspecting the substrate with a group of initial defect detection recipes,
analyzing signal-to-noise responses of the initial defect detection recipes, and
selecting the detection recipe with the best signal-to-noise response which gives the highest capture rate of the programmed defects as the inspection recipe.
2. The method of claim 1 wherein:
the device comprises a plurality of layers; and
processing a layer and inspecting the layer are repeated until all layers of the device are processed on the substrate.
3. The method of claim 2 wherein the defects are programmed into at least one of the layers of the device at known locations.
4. The method of claim 2 wherein the defects are programmed into some of or all of the layers of the device at known locations.
5. The method of claim 1 wherein:
the device comprises a plurality of layers; and
processing a layer of the device is repeated until all layers of the device are processed.
6. The method of claim 5 wherein the defects are programmed into at least one of the layers of the device at known locations.
7. The method of claim 6 wherein inspecting the layer is performed after the layer with programmed defects is processed.
8. The method of claim 5 wherein the defects are programmed into some of or all of the layers of the device at known locations.
9. The method of claim 8 wherein inspecting the layer is performed after the layer with programmed defects is processed.
10. The method of claim 1 wherein the test chiplet comprises a plurality of test cells.
11. The method of claim 10 wherein the defects comprise bridging defects, necking defects or a combination thereof.
12. The method of claim 11 wherein the defects comprise subtle defects.
13. The method of claim 10 wherein:
the test chiplet is disposed in a scribe region surrounding the device or an inactive region within the device; or
a first test chiplet is disposed in the scribe region and a second test chiplet is disposed within the device.
14. The method of claim 13 wherein the defects comprise bridging defects, necking defects or a combination thereof.
15. The method of claim 14 wherein the defects comprise subtle defects.
16. A method of defect inspection comprising:
providing a substrate;
inspecting the layer with an inspection tool for defects, wherein the inspection tool is programmed with an inspection recipe determined from a programmed defects study; and
wherein the programmed defects study comprises
providing a test chiplet with defects programmed therein at known locations of the substrate,
inspecting the substrate with a group of initial defect detection recipes,
analyzing signal-to-noise responses of the initial defect detection recipes, and
selecting the detection recipe with the best signal-to-noise response which gives the highest capture rate of the programmed defects as the inspection recipe.
17. The method of claim 16 wherein the test chiplet comprises a plurality of test cells.
18. An inspection tool comprising:
a recipe set up menu; and
an inspection recipe stored in the inspection tool, the inspection recipe is used to inspect a layer of a device, the inspection recipe is defined through a programmed defects study, wherein the programmed defects study comprises
providing a test chiplet with defects programmed therein at known locations of the substrate,
inspecting the substrate with a group of initial defect detection recipes,
analyzing signal-to-noise responses of the initial defect detection recipes, and
selecting the detection recipe with the best signal-to-noise response which gives the highest capture rate of the programmed defects as the inspection recipe.
19. The inspection tool of claim 18 comprises an optical inspection tool or an ebeam inspection tool.