Miniature fluid-cooled heat sink with integral heater
View Patent ↗A temperature control device that includes a miniature liquid-cooled heat sink with integral heater and sensing elements is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing phase. The temperature control device includes an interface surface configured to provide a thermal path from the device to a device under test. One such device has a liquid-cooled heat sink comprising a first heat transfer portion in a first plane and a second heat transfer portion in a second plane. The first and second heat transfer portions establish a three-dimensional cross-flow of coolant within the heat sink structure. An alternate embodiment includes parallel fluid conduits, each having a three-dimensional microchannel structure that directs coolant flow in three dimensions within the fluid conduits. Coolant flows in opposite directions through adjacent fluid conduits, thus resulting in a three-dimensional cross-flow within the heat sink structure.
1. A temperature control device comprising:
an interface surface configured to provide a thermal path to a device under test (“DUT”);
a fluid-cooled heat sink structure configured to maintain a cross-flow of coolant in three dimensions for cooling said interface surface, where said fluid-cooled heat sink structure comprises:
a first continuous fluid conduit for accommodating coolant flow in a first direction;
a first three-dimensional microchannel structure located within said first continuous fluid conduit, said first microchannel structure being configured to direct coolant flow in three dimensions within said first continuous fluid conduit;
a second continuous fluid conduit for accommodating coolant flow in a second direction different than said first direction; and
a second three-dimensional microchannel structure located within said second continuous fluid conduit, said second microchannel structure being configured to direct coolant flow in three dimensions within said second continuous fluid conduit; and
a heater assembly configured to heat said interface surface.
2. A temperature control device according to claim 1 , wherein said first and second continuous fluid conduits are coplanar.
3. A temperature control device according to claim 2 , wherein said first and second continuous fluid conduits are adjacent to each other.
4. A temperature control device according to claim 1 , wherein:
said first continuous fluid conduit is located above said second continuous fluid conduit;
and said first and second continuous fluid conduits are located above said interface surface.
5. A temperature control device according to claim 1 , wherein said heater assembly is located between said interface surface and said fluid-cooled heat sink structure.
6. A temperature control device according to claim 1 , wherein said fluid-cooled heat sink structure comprises:
a first layer;
a second layer below said first layer;
a first plurality of flow channels, formed in said first layer, for accommodating coolant flow within said fluid-cooled heat sink structure; and
a second plurality of flow channels, formed in said second layer, for accommodating coolant flow within said fluid-cooled heat sink structure.
7. A temperature control device according to claim 6 , wherein said first and second layers are parallel to each other.
8. A temperature control device according to claim 6 , wherein:
said first plurality of flow channels are configured to maintain a first flow path having a first direction; and
said second plurality of flow channels are configured to maintain a second flow path having a second direction different than said first direction.
9. A temperature control device according to claim 8 , wherein said first flow path is opposite to said second flow path.
10. A temperature control device according to claim 1 , wherein said first microchannel structure is a first geometric web structure; and
said second microchannel structure is a second geometric web structure, wherein said second geometric web structure is offset from the first geometric web structure.
11. A temperature control device comprising:
an interface surface configured to provide a thermal path to a device under test (“DUT”); and
a fluid-cooled heat sink structure configured to maintain a cross-flow of coolant in three-dimensions for cooling said interface surface, said fluid-cooled heat sink structure comprising:
a first continuous fluid conduit for accommodating coolant flow in a first direction;
a first three-dimensional microchannel structure located within said first continuous fluid conduit, said first microchannel structure being configured to direct coolant flow in three dimensions within said first continuous fluid conduit;
a second continuous fluid conduit for accommodating coolant flow in a second direction different than said first direction; and
a second three-dimensional microchannel structure located within said second continuous fluid conduit, said second microchannel structure being configured to direct coolant flow in three dimensions within said second continuous fluid conduit.
12. A temperature control device according to claim 11 , further comprising a heater assembly configured to heat said interface surface.
13. A temperature control device according to claim 11 , wherein said first and second continuous fluid conduits are coplanar.
14. A temperature control device according to claim 11 , wherein:
said first continuous fluid conduit is located above said second continuous fluid conduit; and
said first and second continuous fluid conduits are located above said interface surface.
15. A temperature control device according to claim 11 , wherein said first three-dimensional microchannel structure is a first geometric web structure; and
said second three-dimensional microchannel structure is a second geometric web structure, wherein said second geometric web structure is offset from the first geometric web structure.