IP Library Granted Patent US 8,223,541
Granted Patent B2
US 8,223,541 · App. 12/630,539 · Granted Jul 17, 2012

Non-volatile semiconductor memory, and the method thereof

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,223,541
App. No.
12/630,539
Granted
Jul 17, 2012
Kind
B2
Abstract

A non-volatile semiconductor memory and a writing method thereof are provided for preventing miswriting induced by gate-induced-drain leakage (GIDL). The non-volatile semiconductor memory comprises a non-volatile memory cell array 10 for recording multiple values by setting a plurality of different thresholds to each memory cell transistor that is connected in series between selection transistors Qs 1 and Qs 2 on two terminals of a selected bit line; and a control circuit 11 for controlling writing of the data from the memory cell array 10 . The control circuit 11 records two values for at least a plurality of first memory cell transistors Q 0 , Q 1 , Q 32 and Q 33 respectively adjacent to the selection transistors Qs 1 and Qs 2 on two terminals of the bit line, and records more than three values for a plurality of second transistors Q 2 ˜Q 31 other than the first memory cell transistors.

Claims (15)

1. A non-volatile semiconductor memory device, comprising:

a non-volatile memory cell array for recording multiple values by setting a plurality of different threshold voltages to each memory cell transistor, wherein each memory cell transistor is connected in series between selection transistors on two terminals of a selected bit line; and

a control circuit for controlling programmed data of the memory cell array,

wherein the control circuit records two values for at least a plurality of first memory cell transistors respectively adjacent to the selection transistors on the two terminals, and records more than three multiple values for a plurality of second transistors other than the first memory cell transistors, and sets a programming/verifying voltage of the first memory cell transistors recorded by the two values to a voltage which is lower than a verifying voltage for recording the data, and the verifying voltage for recording the data has a maximum threshold voltage level for a plurality of recorded data recorded by the multiple values.

2. The non-volatile semiconductor memory device as claimed in claim 1 , wherein the control circuit records the two values for two of the first memory cell transistors respectively adjacent to the selection transistors on the two terminals.

3. The non-volatile semiconductor memory device as claimed in claim 2 , wherein the control circuit divides the data into a predetermined number and writes the data into each page of the first memory cell transistors recorded by the two values for recording the data.

4. The non-volatile semiconductor memory device as claimed in claim 1 , wherein the verifying voltage for recording the data has a low threshold voltage level which is lower than the maximum threshold voltage level for a plurality of recorded data recorded by the multiple values.

5. A write-in method for a non-volatile semiconductor memory device, wherein the non-volatile semiconductor memory device comprises a non-volatile memory cell array and a control circuit, the memory cell array records multiple values by setting a plurality of different threshold voltages to each memory cell transistor, each memory cell transistor is coupled in series between selection transistors on two terminals of a selected bit line, and the control circuit controls programmed data of the memory cell array, comprising:

a control step for recording two values for at least a plurality of first memory cell transistors respectively adjacent to the selection transistors on the two terminals, and recording more than three multiple values for a plurality of second transistors other than the first memory cell transistors; and

setting a programming/verifying voltage of the first memory cell transistors recorded by the two values to a voltage which is lower than a verifying voltage for recording the data, and the verifying voltage for recording the data has a maximum threshold voltage level for a plurality of recorded data recorded by the multiple values.

6. The write-in method as claimed in claim 5 , wherein the control step further comprises the step of:

recording the two values for two of the first memory cell transistors respectively adjacent to the selection transistors on the two terminals.

7. The write-in method as claimed in claim 5 , wherein the control step further comprises the step of:

dividing the data into a predetermined number and writing the data into each page of the first memory cell transistors recorded by the two values for recording the data.

8. The write-in method as claimed in claim 5 , wherein the verifying voltage for recording the data has a low threshold voltage level which is lower than the maximum threshold voltage level for a plurality of recorded data recorded by the multiple values.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049770/0101 →
CHANGE OF NAME Recorded Jun 18, 2012
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 028391/0976 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2009
From: SHIROTA, RIICHIRO
To: POWERCHIP SEMICONDUCTOR CORP
Reel/Frame 023602/0606 →