Patent Assignment
Reel/Frame 049770/0101
Assignment of Assignor's Interest
Recorded: 2019-07-16
Pages: 11
Assignor
POWERCHIP TECHNOLOGY CORPORATION
Executed: 2019-06-28
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(20)
Process for Fabricating Crown Capacitors of Dram and Capacitor Structure
Junction-Free Nand Flash Memory and Fabricating Method Thereof
Automated Material Handling System and Method
Manufacturing Method of Semiconductor Device Having Self-Aligned Contact
Page Buffer Circuit for Electrically Rewritable Non-Volatile Semiconductor Memory Device and Control Method
Non-Volatile Semiconductor Memory, and the Method Thereof
Non-Volatile Semiconductor Memory Device and Method of Reading the Same
Non-Volatile Semiconductor Memory
Image Sensor and Fabrication Method Thereof
Non-Volatile Semiconductor Memory Device and Write-in Method Thereof
Method for Fabricating Bottom Electrode of Capacitors of Dram
Vertical Channel Transistor Array and Manufacturing Method Thereof
Vertical Capacitor-Less Dram Cell, Dram Array and Operation of the Same
Phase Change Memory Devices and Methods for Fabricating the Same
Method for Programming a Memory Structure
Vertical Channel Transistor Array and Manufacturing Method Thereof
Dynamic Random Access Memory Cell and Array Having Vertical Channel Transistor
Non-Volatile Memory and Fabricating Method Thereof
Non-Volatile Memory Device and Method of Fabricating the Same
Programming Method for Nand Flash Memory Device to Reduce Electrons in Channels
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 2009
From: SHIROTA, RIICHIRO
To: POWERCHIP SEMICONDUCTOR CORP
Reel/Frame 023602/0606 →
Assignment of Assignor's Interest
Dec 8, 2009
From: OTA, TSUYOSHI
To: POWERCHIP SEMICONDUCTOR CORP
Reel/Frame 023619/0056 →
Assignment of Assignor's Interest
Dec 17, 2009
From: FURUYAMA, TAKAAKI
To: POWERCHIP SEMICONDUCTOR CORP
Reel/Frame 023672/0320 →
Assignment of Assignor's Interest
Jan 21, 2010
From: MURAKAMI, HIROKI
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 023824/0455 →
Assignment of Assignor's Interest
Jan 21, 2010
From: MIIDA, TAKASHI
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 023829/0334 →
Change of Name
Jun 12, 2012
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 028363/0373 →
Change of Name
Jun 18, 2012
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 028391/0976 →
Change of Name
Jul 16, 2012
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 028611/0899 →
Change of Name
Aug 30, 2012
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 028885/0262 →
Change of Name and Address of Assignee
Nov 12, 2012
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 029277/0956 →
Change of Name
Apr 14, 2014
From: POWERCHIP SEMICONDUCTOR CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 032675/0326 →
Assignment of Assignor's Interest
Sep 4, 2014
From: POWERFLASH TECHNOLOGY CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 033663/0197 →
Change of Name
Jun 26, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049602/0564 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →