Patent Assignment
Reel/Frame 049602/0564
Change of Name
Recorded: 2019-06-26
Pages: 3
Assignor
POWERCHIP SEMICONDUCTOR CORP.
Executed: 2010-08-09
Assignee
POWERCHIP TECHNOLOGY CORPORATION
NO. 12, LI-HSIN ROAD 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(26)
Non-Volatile Memory
Non-Volatile Memory and Manufacturing Method Thereof
Fabricating Method of an Non-Volatile Memory
Device for Testing an Exposure Apparatus
Fabricating Method of a Flash Memory Cell
Multi-Level Non-Volatile Memory
Wireless 3D Auto-Offset System for Robot Arms
Photosensitive Device
One Time Programmable Memory and the Manufacturing Method Thereof
Non-Volatile Memory Device and Manufacturing Method and Operating Method Thereof
Method of Evaluating the Uniformity of the Thickness of the Polysilicon Gate Layer
Method of Fabricating Non-Volatile Memory Structure
Method of Fabricating Non-Volatile Memory
Data Tracking Method and System Applied in Semiconductor Manufacturing
Method of Manufacturing Well Pick-Up Structure of Non-Volatile Memory
Method of Manufacturing a Sonos Memory
Process for Removing Particles from Reticle
Method of Fabricating Flash Memory Cell
Method of Operating Flash Memory Cell
Fabricating Method of Non-Volatile Memory
Phase Change Memory Devices and Methods for Fabricating the Same
Method of Manufacturing Self-Aligned Contact Openings
Method for Fabricating Semiconductor Device
Integrated Circuits and Discharge Circuits
Process for Fabricating Crown Capacitors of Dram and Capacitor Structure
Junction-Free Nand Flash Memory and Fabricating Method Thereof
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0575 →
Assignment of Assignor's Interest
Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049770/0090 →