Patent Assignment
Reel/Frame 049757/0575
Assignment of Assignor's Interest
Recorded: 2019-07-16
Pages: 11
Assignor
POWERCHIP TECHNOLOGY CORPORATION
Executed: 2019-06-28
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(22)
Erasing Method for Non-Volatile Memory
Method of Manufacturing Non-Volatile Memory
Non-Volatile Memory Structure
Patent:
7,183,607 →
Application:
11/308,621 →
Non-Volatile Memory
Probe Apparatus
Non-Volatile Memory and Manufacturing Method Thereof
Fabricating Method of an Non-Volatile Memory
Dispatch Integration System and Method Based on Semiconductor Manufacturing
Device for Testing an Exposure Apparatus
Fabricating Method of a Flash Memory Cell
Image Sensor and Fabrication Method Thereof
Multi-Level Non-Volatile Memory
Wireless 3D Auto-Offset System for Robot Arms
Photosensitive Device
One Time Programmable Memory and the Manufacturing Method Thereof
Method of Fabricating Non-Volatile Memory
Non-Volatile Memory Device and Manufacturing Method and Operating Method Thereof
Method of Evaluating the Uniformity of the Thickness of the Polysilicon Gate Layer
Method of Fabricating Non-Volatile Memory Structure
Method of Fabricating Non-Volatile Memory
Data Tracking Method and System Applied in Semiconductor Manufacturing
Method of Manufacturing Well Pick-Up Structure of Non-Volatile Memory
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.