IP Library Granted Patent US 7,218,981
Granted Patent B1
US 7,218,981 · App. 11/401,900 · Granted May 15, 2007

Dispatch integration system and method based on semiconductor manufacturing

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,218,981
App. No.
11/401,900
Granted
May 15, 2007
Kind
B1
Abstract

A dispatch integration method based on semiconductor manufacturing. When multiple tools are idle, idle messages are sent to a real-time dispatch system through a tool control system and a manufacturing execution system. The real-time dispatch system sorts tool parameters relating to tool efficiency based on a currently executed process using a principal component analysis method, defining weights of each tool according to the defined tool parameters and corresponding factor weights using a linear regression weight formula, calculating tool weights of each tool parameter using a linear regression weight formula, and determining a desired tool for dispatch according to the calculated tool weights.

Claims (19)

1. A dispatch integration method based on semiconductor manufacturing, applied to a dispatch integration system comprising a plurality of tools, a tool control system, a manufacturing execution system (MES), and a real-time dispatch system, the method comprising:

sending idle messages to a real-time dispatch system through a tool control system and a manufacturing execution system when the tools are idle;

sorting tool parameters relating to tool efficiency, by the real-time dispatch system, based on a currently executed process using a principal component analysis method;

defining factor weights corresponding to each tool parameter, by the real-time dispatch system, according to sorting results;

calculating tool weights of each tool, by the real-time dispatch system, according to the defined tool parameters and corresponding factor weights using a linear regression weight formula; and

determining a desired tool for dispatching, by the real-time dispatch system, according to the calculated tool weights.

2. The dispatch integration method as claimed in claim 1 , wherein the linear regression weight formula is represented as:

EQP? ax 1 ? bx 2 ? cx 3 ? . . . ? sx n−1 ? tx n , where EQP represents a tool, x 1 , x 2 , x n represent tool parameters corresponding to the tool, and a, b, . . . , t represent factor weights corresponding to the tool parameters x 1 ˜x n .

3. The dispatch integration method as claimed in claim 1 , wherein each tool parameter corresponds to multiple factor weights, wherein a tool parameter corresponding to larger factor weights more seriously affects the executed process.

4. The dispatch integration method as claimed in claim 3 , wherein each tool parameter and corresponding factor weights are changed following different executed processes.

5. A dispatch integration system based on semiconductor manufacturing, comprising:

a plurality of tools, capable of sending idle messages when idle;

a tool control system, coupled to the tools, capable of receiving and forwarding the idle messages from the tools;

a manufacturing execution system, coupled to the tool control system, capable of receiving and forwarding the idle messages from the tool control system; and

a real-time dispatch system, coupled to the manufacturing execution system, capable of sorting tool parameters relating to tool efficiency based on a currently executed process using a principal component analysis method when the idle messages are received, defining factor weights corresponding to each tool parameter according to sorting results, calculating tool weights of each tool according to the defined tool parameters and corresponding factor weights using a linear regression weight formula, and determining a desired tool for dispatch according to the calculated tool weights.

6. The dispatch integration system as claimed in claim 5 , wherein the linear regression weight formula is represented as:

EQP? ax 1 ? bx 2 ? cx 3 ? . . . ? sx n−1 ? tx n , where EQP represents a tool, x 1 , x 2 , x n represent tool parameters corresponding to the tool, and a, b, . . . , t represent factor weights corresponding to the tool parameters x 1 ˜x n .

7. The dispatch integration system as claimed in claim 5 , wherein each tool parameter corresponds to multiple factor weights, wherein a tool parameter corresponding to larger factor weights more seriously affects the executed process.

8. The dispatch integration system as claimed in claim 7 , wherein each tool parameter and corresponding factor weights are changed following different executed processes.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0575 →
CHANGE OF NAME Recorded Jul 1, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049648/0410 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2006
From: HO, YU-WEN; TAI, HUNG-EN; CHEN, CHIEN-CHUNG
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 017755/0588 →