Patent Assignment
Reel/Frame 049648/0410
Change of Name
Recorded: 2019-07-01
Pages: 3
Assignor
POWERCHIP SEMICONDUCTOR CORP.
Executed: 2010-08-09
Assignee
POWERCHIP TECHNOLOGY CORPORATION
NO.12, LI-HSIN ROAD 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Properties
(18)
Nand Flash Memory Cell Row and Manufacturing Method Thereof
Method for Fabricating Semiconductor Device and Wire with Silicide
Method of Fabricating Semiconductor Device
Non-Volatile Memory and Fabricating Method Thereof
Patent:
7,102,193 →
Application:
11/164,063 →
Method for Manufacturing Semiconductor Device and Non-Volatile Memory
Method of Fabricating Non-Volatile Memory
Patent:
7,148,107 →
Application:
11/164,211 →
Method for Manufacturing Gate Dielectric Layer
Anti-Punch-Through Semiconductor Device
Non-Volatile Memory
Method of Fabricating Non-Volatile Memory
Method of Fabricating Non-Volatile Memory
Fabricating Method of Non-Volatile Memory
Flash Memory and Manufacturing Method Thereof
A Non-Volatile Memory
Erasing Method for Non-Volatile Memory
Method of Manufacturing Non-Volatile Memory
Non-Volatile Memory Structure
Patent:
7,183,607 →
Application:
11/308,621 →
Dispatch Integration System and Method Based on Semiconductor Manufacturing
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0550 →
Assignment of Assignor's Interest
Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0575 →
Assignment of Assignor's Interest
Apr 8, 2020
From: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 052337/0735 →
Assignment of Assignor's Interest
Sep 7, 2020
From: POWERCHIP TECHNOLOGY CORPORATION
To: NEXCHIP SEMICONDUCTOR CORPORATION
Reel/Frame 053704/0522 →