Method for manufacturing semiconductor device and non-volatile memory

1. A method for fabricating semiconductor device, comprising:

providing a substrate;

forming a plurality of first gate lines disposed in parallel to each other and a first dummy line disposed in a direction perpendicular to the first gate lines, wherein first gaps are formed between the first dummy gate line and the first gate lines and second gaps are formed between every pair of adjacent first gate lines;

forming a second composite layer over the substrate;

forming a conductive layer over the second composite layer;

etching back the conductive layer to form a plurality of second device structures that completely fills the first gaps and the second gaps; and

removing the second device structures in the first gaps.

2. The method of claim 1 , wherein the step of removing the second device structure in the first gaps includes:

forming a patterned photoresist layer over the substrate to expose the first gaps; and

performing an anisotropic etching process.

3. The method of claim 1 , wherein a second dummy gate line disposed in parallel to the first gate lines is also formed together with the first dummy gate line, and there is a third gap between the second dummy gate line and a outermost first gate line.

4. The method of claim 3 , wherein the conductive layer also fills the third gap when the conductive layer is formed.

5. The method of claim 4 , wherein the conductive layer in the third gap is also removed when the conductive layer in the first gaps is removed.

6. The method of claim 1 , wherein the first gate lines and the first dummy gate line each comprises a first composite layer, a gate and a cap layer.

7. The method of claim 6 , wherein a material constituting the cap layer includes silicon oxide or silicon nitride.

8. The method of claim 6 , wherein the first composite layer and the second composite layer each comprises a bottom dielectric layer, a charge storage layer and a top dielectric layer.

9. The method of claim 8 , wherein a material constituting the bottom dielectric layer and the top dielectric layer comprises silicon oxide.

10. The method of claim 8 , wherein a material constituting the charge storage layer comprises silicon nitride or doped polysilicon.

11. The method of claim 1 , wherein a material constituting the conductive layer comprises doped polysilicon.

12. The method of claim 1 , wherein spacers are also formed on respective sidewalls of the first gate lines and the dummy gate lines.

13. The method of claim 12 , wherein a material constituting the spacers comprises silicon nitride.

14. The method of claim 1 , wherein the first dummy gate line is formed in a non-device region outside the first gate lines and the second device structures.

15. A method for fabricating non-volatile memory, comprising the steps of:

providing a substrate;

forming a plurality of first gate lines disposed in parallel to each other and a first dummy gate line disposed in a direction perpendicular to the first gate lines, wherein first gaps are formed between the first dummy gate line and the first gate lines and second gaps are formed between every pair of the adjacent first gate lines, and the first gate lines and the first dummy gate line each comprises a first charge storage layer;

forming a second composite layer over the substrate;

forming a conductive layer over the substrate;

etching back the conductive layer to form a plurality of second gates that completely fills the second gaps, thereby forming a memory cell row;

removing the conductive layer in the first gaps; and

forming a source/drain region in the substrate on respective sides of the memory cell row.

16. The method of claim 15 , wherein the step for removing the conductive layer in the first gaps includes:

forming a patterned photoresist layer over the substrate; and

performing an anisotropic process.

17. The method of claim 15 , wherein a second dummy gate line disposed in parallel to the first gate lines is also formed together with the first dummy gate line, and a third gap is also formed between the second dummy gate line and the outermost first gate line.

18. The method of claim 17 , wherein the conductive layer also fills the third gap when the conductive layer is formed.

19. The method of claim 18 , wherein the conductive layer in the third gap is also removed when the conductive layer in the first gaps is removed.

20. The method of claim 15 , wherein each first gate line further comprises a first gate and a cap layer.

21. The method of claim 20 , wherein a material constituting the cap layer comprises silicon oxide or silicon nitride.

22. The method of claim 15 , wherein a material constituting the first charge storage layer comprises doped polysilicon or silicon nitride.

23. The method of claim 15 , wherein a material constituting the film layers above and below the first charge storage layer comprises silicon oxide.

24. The method of claim 15 , wherein the second composite layer comprises a bottom dielectric layer, a second charge storage layer and a top dielectric layer.

25. The method of claim 24 , wherein a material constituting the bottom dielectric layer and the top dielectric layer comprises silicon oxide.

26. The method of claim 24 , wherein a material constituting the second charge storage layer comprises silicon nitride or doped polysilicon.

27. The method of claim 15 , wherein a material constituting the conductive layer comprises polysilicon.

28. The method of claim 15 , wherein spacers are also formed on respective sidewalls of the first gate lines and the first dummy gate line.

29. The method of claim 28 , wherein a material constituting the spacers comprises silicon nitride.

30. The method of claim 15 , wherein the first dummy gate line is formed in a non-device region outside the first gate lines and the second gates.