IP Library Granted Patent US 7,433,750
Granted Patent B2
US 7,433,750 · App. 11/642,683 · Granted Oct 7, 2008

Data tracking method and system applied in semiconductor manufacturing

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Quick Facts
Patent No.
US 7,433,750
App. No.
11/642,683
Granted
Oct 7, 2008
Kind
B2
Abstract

A data tracking method applied in semiconductor manufacturing is provided. Split historical data of a wafer lot is retrieved and it is determined whether the end of lot data of the wafer lot is read. If not, a maximum split number required for a split processing applied to the wafer lot is determined. Next, a virtual sub split number required for the current process station is determined according to the maximum split number and a current split number. At least one virtual sub lot for the current process station is created according to the virtual sub split number. Process data of an original wafer lot corresponding to the virtual sub lot is copied to the virtual sub lot and virtual sub lots for the next process station is continuously created when creation is complete.

Claims (21)

1. A data tracking method, comprising:

retrieving split historical data of a wafer lot;

determining whether the end of lot data of the wafer lot is read;

if not, creating at least one virtual sub lot for the current process station according to a virtual sub split number required to be created;

copying process data of an original wafer lot corresponding to the virtual sub lot; and

continuously creating virtual sub lots for the next process station when the creation is complete.

2. The data tracking method as claimed in claim 1 , further comprising determining a maximum split number required for a split processing applied to the wafer lot if the end of lot data of the wafer lot has not been read.

3. The data tracking method as claimed in claim 2 , further comprising determining the virtual sub split number required for the current process station according to the maximum split number and a current split number.

4. A data tracking system, comprising:

a lot calculation unit, retrieving split historic data of a wafer lot and determining whether the end of lot data of the wafer lot is read; and

a virtual sub lot creation unit, if the end of lot data of the wafer lot has not been read, creating at least one virtual sub lot for the current process station according to a virtual sub split number required to be created and copying process data of an original wafer lot corresponding to the virtual sub lot.

5. The data tracing system as claimed in claim 4 , the lot calculation unit further determines a maximum split number required for a split processing applied to the wafer lot if the end of lot data of the wafer lot has not been read.

6. The data tracking system as claimed in claim 5 , the lot calculation unit further determines the virtual sub split number required for the current process station according to the maximum split number and a current split number.

7. A computer-readable storage medium storing a computer program providing a data tracking method, comprising using a computer to perform the steps of:

retrieving split historic data of a wafer lot;

determining whether the end of lot data of the wafer lot is read;

if not, creating at least one virtual sub lot for the current process station according to a virtual sub split number required to be created;

copying process data of an original wafer lot corresponding to the virtual sub lot; and

continuously creating virtual sub lots for the next process station when the creation is complete.

8. The computer-readable storage medium as claimed in claim 7 , further comprising determining a maximum split number required for a split processing applied to the wafer lot if the end of lot data of the wafer lot has not been read.

9. The computer-readable storage medium as claimed in claim 8 , further comprising determining the virtual sub split number required for the current process station according to the maximum split number and a current split number.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049757/0575 →
CHANGE OF NAME Recorded Jun 26, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049602/0564 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2006
From: HO, YU-WEN; LIU, TZU-HSIU
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 018714/0744 →