Electrostatic force assisted deposition of graphene
View Patent ↗An embodiment of a method of depositing graphene includes bringing a stamp into contact with a substrate over a contact area. The stamp has at least a few layers of the graphene covering the contact area. An electric field is developed over the contact area. The stamp is removed from the vicinity of the substrate which leaves at least a layer of the graphene substantially covering the contact area.
1. A method of depositing graphene comprising:
bringing a stamp into contact with a substrate over a contact area, the stamp having one or more layers of the graphene covering the contact area;
developing an electric field over the contact area; and
removing the stamp from the vicinity of the substrate which leaves at least a layer of the graphene substantially covering the contact area.
2. The method of claim 1 wherein the stamp comprises highly ordered pyrolytic graphite.
3. The method of claim 2 further comprising:
developing a resist over the contact area of the highly ordered pyrolytic graphite;
etching a surface of the highly ordered pyrolytic graphite in areas not covered by the resist; and
removing a remainder of the resist to produce the contact area having a pre-patterned surface.
4. The method of claim 3 wherein removing the stamp from the vicinity of the substrate leaves at least a layer of the graphene having a pattern produced by the pre-patterned surface.
5. The method of claim 1 wherein the substrate includes a dielectric surface layer.
6. The method of claim 5 wherein developing the electric field over the contact area comprises applying a voltage from below the dielectric layer of the substrate to above the one or more layers of the graphene of the stamp.
7. The method of claim 6 wherein the dielectric layer comprises SiO 2 .
8. The method of claim 7 the substrate below the dielectric layer comprises Si.
9. A method of depositing graphene comprising:
bringing a stamp into contact with a dielectric surface of a substrate over a contact area, the stamp having one or more layers of the graphene covering the contact area;
applying a voltage from the substrate below the dielectric layer to the stamp above the contact area; and
removing the stamp from the vicinity of the substrate which leaves at least a layer of the graphene substantially covering the contact area.
10. The method of claim 9 wherein the substrate comprises a Si substrate and the dielectric layer comprises SiO 2 .
11. The method of claim 10 wherein the voltage is selected such that an average electric field magnitude at the dielectric layer is less than about 10 MV/cm.
12. The method of claim 10 wherein the voltage is selected such that an average electric field magnitude at the dielectric layer is at least about 1.7 MV/cm.