Semiconductor device
View Patent ↗A semiconductor device of the present invention has a first contact and a second contact which are located over a device isolation film so as to be opposed with each other, and have a length in the horizontal direction larger than the height; a first electro-conductive pattern located on the first contact and is formed in at least a single interconnect layer; a second electro-conductive pattern located on the second contact so as to be opposed with the first electro-conductive pattern; and an interconnect formed in an upper interconnect layer which is located above the first electro-conductive pattern and the second electro-conductive pattern, so as to be located in a region above the first electro-conductive pattern and the second electro-conductive pattern.
1. A semiconductor device comprising:
a device isolation film formed in a substrate;
a first contact and a second contact located over said device isolation film so as to be opposed with each other, each of which including a length in the horizontal direction larger than the height;
a first electro-conductive pattern located on said first contact, and formed in at least a single interconnect layer;
a second electro-conductive pattern located on said second contact so as to be opposed with said first electro-conductive pattern, and formed in at least a single interconnect layer; and
an upper interconnect layer located above said first electro-conductive pattern and said second electro-conductive pattern,
wherein, said upper interconnect layer is provided so as to locate a portion of said upper interconnect layer composed of an insulating film or a portion of said upper interconnect layer composed of a third electro-conductive pattern, which is different from said first electro-conductive pattern and said second electro-conductive pattern, above said first electro-conductive pattern and said second electro-conductive pattern.
2. The semiconductor device as claimed in claim 1 ,
wherein the lower end of said first contact and the lower end of said second contact are brought into contact with device isolation film.
3. The semiconductor device as claimed in claim 1 , further comprising:
a first lower electro-conductive pattern including the top surface of said first lower electro-conductive pattern brought into contact with said first contact, and the lower surface of said first lower electro-conductive pattern brought into contact with said device isolation film, and including a length in the horizontal direction larger than the height; and
a second lower electro-conductive pattern including the top surface of said second lower electro-conductive pattern brought into contact with said second contact, and the lower surface of said second lower electro-conductive pattern brought into contact with said device isolation film, being provided so as to be opposed with said first lower electro-conductive pattern, and including the length in the horizontal direction larger than the height.
4. The semiconductor device as claimed in claim 3 , further comprising:
a transistor which is formed in said substrate and has a gate electrode,
wherein said first lower electro-conductive pattern and said second lower electro-conductive pattern include the same layer structure with said gate electrode.
5. The semiconductor device as claimed in claim 1 , further comprising:
a first insulating film located between a combination of said first contact and said first electro-conductive pattern and a combination of said second contact and said second electro-conductive pattern; and
a second insulating film located above said first electro-conductive pattern and said second electro-conductive pattern,
wherein said second insulating film includes a dielectric constant smaller than that of said first insulating film.
6. The semiconductor device as claimed in claim 1 ,
wherein the distance between said first contact and said second contact is equal to or smaller than 140 nm.
7. The semiconductor device as claimed in claim 6 ,
wherein the distance between said first contact and said second contact is a minimum distance specified by a minimum design rule for said semiconductor device.