Wafer cleaning device
View Patent ↗A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.
1. A wafer cleaning device, comprising:
a stage for holding a wafer having a surface, wherein the wafer has a center;
a first nozzle positioned above the wafer, and a first height disposed between the first nozzle and the surface; and
a second nozzle positioned above the wafer, and a second height disposed between the second nozzle and the surface, wherein the first height is shorter than the second height to make a first cleaning solution sprayed from the first nozzle reach the surface earlier than a second cleaning solution sprayed from the second nozzle, and the second nozzle is disposed farther from the center of the wafer than the first nozzle is.
2. The wafer cleaning device of claim 1 , wherein the first nozzle and the second nozzle are disposed on different radiuses of the wafer, a first cleaning solution sprayed from the first nozzle forms a first spraying area on the surface of the wafer, and a second cleaning solution sprayed from the second nozzle forms a second spraying area on the surface of the wafer.
3. The wafer cleaning device of claim 2 , wherein a given point is on the surface, and the wafer rotates toward a predetermined direction.
4. The wafer cleaning device of claim 3 , wherein when the wafer rotates toward the predetermined direction, the given point passes the first spraying area first, and passes the second spraying area later.
5. The wafer cleaning device of claim 3 , wherein the predetermined direction is selected from clockwise and counterclockwise.
6. The wafer cleaning device of claim 2 , wherein the first spraying area and the second spraying area are staggered.
7. The wafer cleaning device of claim 2 , wherein the size of the first spraying area is adjustable.
8. The wafer cleaning device of claim 2 , wherein the size of the second spraying area is adjustable.
9. The wafer cleaning device of claim 2 , wherein the flow rate of the first cleaning solution is 0.1 l/min greater than the flow rate of the second cleaning solution.
10. The wafer cleaning device of claim 2 , wherein the composition of first cleaning solution is identical with the composition of the second cleaning solution.
11. The wafer cleaning device of claim 1 , wherein the first height is 1 cm shorter than the second height.
12. The wafer cleaning device of claim 1 , wherein the surface is selected from the front side of the wafer and the backside of the wafer.