Semiconductor device and method for manufacturing the same

1. An apparatus, comprising:

a substrate over which a first conductive type well is formed; and

an LDMOS device that includes a gate electrode, a drain region formed in the substrate, a trench formed over the substrate, a second conductive type body surrounding both sides and a bottom surface of the trench, a first source region, a second region and a second conductive type contact region formed between the first source region and the second source region on the bottom surface of the trench in the second conductive type body,

wherein the gate electrode is formed in a bent shape along a first surface formed over the substrate, a second surface formed along a side wall of the trench, and a third surface formed at a portion of the bottom surface of the trench.

2. The apparatus of claim 1 , wherein the second conductive type body includes first and second body regions formed over the substrate on one side and another side of the trench and a third body region formed over the substrate proximate a lower side of the trench.

3. The apparatus of claim 1 , further comprising a first conductive type impurity layer formed at a region adjacent to the first source region and the second source region and a second conductive type contact region on the bottom surface of the trench.

4. The apparatus of claim 1 , wherein at least a portion of the gate electrode is formed in the trench.

5. The apparatus of claim 4 , wherein the gate electrode includes first and second gate electrodes, and

the first gate electrode and the second gate electrode have a predetermined interval based on the second conductive type contact region.

6. The apparatus of claim 1 , wherein the substrate of the lower side of the trench is formed with a first conductive type impurity layer.

7. The apparatus of claim 1 , wherein the first conductive type is a N type.