IP Library Granted Patent US 8,659,087
Granted Patent B2
US 8,659,087 · App. 12/639,394 · Granted Feb 25, 2014

Electronic device with a gate electrode having at least two portions

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,659,087
App. No.
12/639,394
Granted
Feb 25, 2014
Kind
B2
Abstract

A transistor structure of an electronic device can include a gate dielectric layer and a gate electrode. The gate electrode can have a surface portion between the gate dielectric layer and the rest of the gate electrode. The surface portion can be formed such that another portion of the gate electrode primarily sets the effective work function in the finished transistor structure.

Claims (55)

1. An electronic device comprising:

a first active region and a second active region;

a gate dielectric layer over at least a portion of the first active region and at least a portion of the second active region; and

a first layer formed over the first active region, wherein the first layer has a first work function;

a second layer formed over the first layer and the first active region, wherein the second layer has a second work function;

a third layer formed over the gate dielectric formed over the second active region;

wherein a first gate electrode overlies the first active region, includes portions of the first and second layers, and has an effective work function closer in value to the second work function than the first work function; and

a second gate electrode overlies the second active region and includes a portion of the third layer.

2. The electronic device of claim 1 , wherein the gate dielectric layer includes an element from Group 3, 4, or 5 of the Periodic Table.

3. The electronic device of claim 2 , wherein the gate dielectric layer comprises hafnium, zirconium, aluminum, or any combination thereof.

4. The electronic device of claim 1 , wherein the first layer of the first gate electrode comprises a metallic element.

5. The electronic device of claim 4 , wherein the metallic element is absent from both the gate dielectric layer and the second layer of the first gate electrode.

6. The electronic device of claim 1 , wherein the first layer of the first gate electrode has a thickness of at least 2 atomic layers and not more than approximately 1.1 nm.

7. The electronic device of claim 1 , wherein the second layer of the first gate electrode further comprises:

a metallic element; and

oxygen, nitrogen, silicon, carbon, or any combination thereof.

8. The electronic device of claim 1 , further comprising a substrate and an interface layer, wherein the interface layer lies between the substrate and the gate dielectric layer.

9. The electronic device of claim 8 , wherein the interface layer is not greater than approximately 1.4 nm.

10. An electronic device comprising:

a first transistor structure including:

a first gate dielectric layer; and

a first gate electrode including a first portion and a second portion, wherein:

the first portion lies between the first gate dielectric layer and the second portion;

the first portion has a first work function;

the second portion has a second work function; and

the first gate electrode has a first effective work function closer in value to the second work function than the first work function; and

a second transistor structure including:

a second gate dielectric layer; and

a second gate electrode including a third portion that abuts the second gate dielectric layer, wherein the third portion has a third work function, and the second gate electrode has a second effective work function that is substantially the third work function.

11. The electronic device of claim 10 , wherein the first, second, and third portions have different compositions as compared to one another.

12. The electronic device of claim 11 , wherein the first gate electrode further comprises a fourth portion overlying the second portion, wherein the fourth portion and the third portion of the second gate electrode have substantially a same composition.

13. The electronic device of claim 12 , wherein:

the first gate electrode further comprises a fifth portion overlying the fourth portion;

the second gate electrode further comprises a sixth portion overlying the third portion; and

the fifth and sixth portions have substantially a same composition.

14. The electronic device of claim 11 , wherein the first portion of the first gate electrode has a thickness of at least 2 atomic layers.

15. The electronic device of claim 14 , wherein the first portion of the first gate electrode is not more than approximately 1.1 nm in thickness.

16. The electronic device of claim 11 , wherein substantially all of the second portion of the first gate electrode is spaced apart from the first gate dielectric.

17. The electronic device of claim 11 , wherein the first gate dielectric layer includes an element from Group 3, 4, or 5 of the Periodic Table.

18. The electronic device of claim 11 , wherein:

the first portion of the first gate electrode comprises Ti a N b , Ta a N b , Ti a Si b N c , Ta a Si b N c , Ti a C b , Ta a C b , Ti a Si b C c , or Ta a Si b C c ;

the second portion of the first gate electrode comprises Mo a O b , Mo a N b , Mo a Si b N c , Ru a O b , Ir a O b , Ru, Ir, Mo a Si b O c , Mo a Si b O c N d , Mo a Hf b O c , Mo a Hf b O c N d , Pt, Pd, or another transition metal containing material; and

the third portion of the second gate electrode comprises Ta a C b , Ta a Si b N c , Ta a N b , Ta a Si b C, Hf a C b , Nb a C b , Ti a C b , or Ni a Si b .

19. The electronic device of claim 18 , wherein each of the first and second gate dielectric layers comprises Hf a C b , Hf a O b N c , Hf a Si b O c , Hf a Si b O c N d , Hf a Zr b O c N d , Hf a Zr b Si c O d N e , Hf a Zr b O c , Zr a Si b O c , Zr a Si b O c N d , or Zr a O b .

20. An electronic device comprising a transistor structure, the transistor structure comprising:

an interface layer having a thickness no greater than approximately 0.4 nm;

a high-k gate dielectric layer overlying the interface layer, wherein the high-k gate dielectric layer includes an element from Group 3, 4 or 5 of the Periodic Table; and

a gate electrode, including a first portion and a second portion wherein:

the first portion comprises a metallic element and lies between the gate dielectric layer and the second portion;

the first portion has a first work function;

the second portion has a second work function;

the second portion comprises:

a metallic element; and

oxygen, nitrogen, silicon, carbon, or a combination thereof; and

the gate electrode has an effective work function closer in value to the second work function than the first work function.

Assignments (24)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NORTH STAR INNOVATIONS INC.
Reel/Frame 037694/0264 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037355/0723 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024079/0082 →