Antifuse programmable memory array
View Patent ↗Techniques and circuitry are disclosed for efficiently implementing programmable memory array circuit architectures, such as PROM, OTPROM, and other such programmable non-volatile memories. The circuitry employs an antifuse scheme that includes an array of memory bitcells, each containing a program device and an antifuse element configured with current path isolation well and for storing the memory cell state. The bitcell configuration, which can be used in conjunction with column/row select circuitry, power selector circuitry, and/or readout circuitry, allows for high-density memory array circuit designs and layouts.
1. A memory device, comprising:
an array of bitcells, each bitcell having two elements including a single antifuse element for storing a bitcell state and a single access element for providing access to the antifuse element for bitcell programming and readout, wherein the antifuse element is an NMOS transistor configured with an N Well surrounding +N source and drain regions and its source and drain tied together;
power select circuitry for biasing a gate line of the array to a first voltage level for bitcell programming and a second voltage level for bitcell readout, the gate line connected to at least one of the antifuse elements; and
sense circuitry for sensing bitcell state during readout, and including a voltage divider operatively coupled to a transmission gate serially coupled to a skewed inverter, wherein during readout a voltage divided signal from the voltage divider is passed through the transmission gate to the skewed inverter and a high or low value is provided at the inverter output.
2. The memory device of claim 1 wherein the access element is a MOS transistor.
3. The memory device of claim 1 wherein the access element is a thick gate PMOS transistor, and each of the voltage divider and transmission gate are implemented with thick gate transistors.
4. The memory device of claim 1 wherein the antifuse element is a thin gate NMOS transistor having its source and drain tied together and a gate oxide that decreases in resistance after bitcell programming.
5. The memory device of claim 1 wherein post-breakdown current is inhibited from unintended leaking by the N well of the antifuse element.
6. The memory device of claim 1 wherein the N Well is shared with all bitcells within a row of the array.
7. The memory device of claim 1 further comprising at least one of:
column select circuitry for selecting a column of the array; and
row select circuitry for selecting a row of the array.
8. The memory device of claim 1 wherein the voltage divider is tunable.
9. A memory device, comprising:
an array of bitcells, each bitcell having two elements including a single antifuse element for storing a bitcell state and a single access element for providing access to the antifuse element for bitcell programming and readout; and
sense circuitry for sensing bitcell state during readout, and including a voltage divider operatively coupled to a transmission gate serially coupled to a skewed inverter, wherein during readout a voltage divided signal from the voltage divider is passed through the transmission gate to the skewed inverter and a high or low value is provided at the inverter output;
wherein the access element is a PMOS transistor and the antifuse element is an NMOS transistor having its source and drain tied together; and
wherein post-breakdown current is inhibited from unintended leaking by an N Well surrounding +N source and drain regions of the antifuse element.
10. The memory device of claim 9 wherein the access element is a thick gate PMOS transistor, and the antifuse element is a thin gate NMOS transistor, and each of the voltage divider and transmission gate are implemented with thick gate transistors.
11. The memory device of claim 9 wherein the N Well is shared with multiple bitcells of the array.
12. The memory device of claim 9 further comprising:
power select circuitry for biasing a gate line of the array to a first voltage level for bitcell programming and a second voltage level for bitcell readout, the gate line connected to at least one of the antifuse elements.
13. The memory device of claim 9 further comprising at least one of:
column select circuitry for selecting a column of the array; and
row select circuitry for selecting a row of the array.
14. The memory device of claim 8 wherein at least one of the column select circuitry, row select circuitry, sense circuitry, and/or power select circuitry comprises level shifter circuitry for adjusting voltage levels between a nominal voltage domain and a high voltage domain.
15. The memory device of claim 10 further comprising:
row select circuitry for selecting a corresponding row of the array, the row select circuitry comprising, for each row, a level shifter for adjusting a corresponding row select signal from a nominal voltage domain level to a high voltage domain level that is applied to gates of the thick gate PMOS transistor access elements of that corresponding row; and
column select circuitry for selecting a corresponding column of the array, the column select circuitry comprising, for each column, a thick gate PMOS transistor having its gate driven by a level shifter, the level shifter for adjusting a corresponding column select signal from the nominal voltage domain level to the high voltage domain level.
16. A system, comprising:
a memory device comprising:
an array of bitcells, each bitcell having two elements including a single antifuse element for storing a bitcell state and a single access element for providing access to the antifuse element for bitcell programming and readout, wherein the antifuse element is an NMOS transistor configured with an N Well surrounding +N source and drain regions and its source and drain tied together;
power select circuitry for biasing a gate line of the array to a first voltage level for bitcell programming and a second voltage level for bitcell readout, the gate line connected to at least one of the antifuse elements; and
sense circuitry for sensing bitcell state during readout, and including a voltage divider operatively coupled to a transmission gate serially coupled to a skewed inverter, wherein during readout a voltage divided signal from the voltage divider is passed through the transmission gate to the skewed inverter and a high or low value is provided at the inverter output; and
a processor for accessing the memory device.
17. The system of claim 16 wherein the access element is a MOS transistor and the antifuse element is a MOS transistor having its source and drain tied together.
18. The system of claim 16 wherein the access element is a thick gate PMOS transistor, and each of the voltage divider and transmission gate are implemented with thick gate transistors.
19. The system of claim 16 wherein the antifuse element is a thin gate NMOS transistor having its source and drain tied together and a gate oxide that decreases in resistance after bitcell programming.
20. The system of claim 16 wherein post-breakdown current is inhibited from unintended leaking by the N well of the antifuse element.
21. The system of claim 16 wherein the N Well is shared with all bitcells within a row of the array.
22. The system of claim 16 further comprising at least one of:
column select circuitry for selecting a column of the array; and
row select circuitry for selecting a row of the array.
23. The system of claim 22 wherein:
the access element is a thick gate PMOS transistor, and the antifuse element is a thin gate NMOS transistor;
each of the voltage divider and transmission gate are implemented with thick gate transistors, and the transmission gate further comprises a level shifter for providing a control signal to the transmission gate;
the column select circuitry comprises, for each column, a thick gate PMOS transistor having its gate driven by a level shifter; and
the row select circuitry comprises, for each row, a level shifter;
wherein each level shifter is for adjusting voltage levels between a nominal voltage domain and a high voltage domain.