Semiconductor device and method for fabricating the same
View Patent ↗A semiconductor device and a method of manufacturing a semiconductor device. A method may include forming a first well by injecting first conduction type impurity ions on and/or over a semiconductor substrate, forming an extended drain region overlapped with a region of said first well by injecting second conduction type impurities on and/or over a semiconductor substrate, and/or forming a first conduction type second well on and/or over a semiconductor substrate under an extended drain region to overlap with another region of a first well by injecting second conduction type impurities on and/or over a semiconductor substrate. A method may include forming a gate over a first well overlapped with an extended drain region, and/or forming a drain region by injecting second conduction type impurities on and/or over an extended drain region at one side of a gate.
1. A method comprising the steps of:
forming a first well by injecting first conduction type impurity ions over a semiconductor substrate;
forming a gate over said first well;
forming an extended drain region overlapped with a portion of said first well by injecting second conduction type impurities using the gate as a mask;
forming a first conduction type second well over said semiconductor substrate under said extended drain and overlapped with another region of said first well by injecting second conduction type impurities using the gate used as a mask; and
forming a drain region by injecting second conduction type impurities over said extended drain region at one side of the gate.
2. The method of claim 1 , comprising forming an additional second well over a region of a lower portion of said first well opposite the gate as said second conduction type impurities pass through the gate during forming said first conduction type second well.
3. The method of claim 1 , wherein forming said extended drain region comprises forming said extended drain region to overlap with opposite upper peripheral regions of said first well.
4. The method of claim 1 , wherein forming said second well comprises forming said second well to overlap with opposite lower peripheral regions of said first well.
5. The method of claim 1 , wherein forming said extended drain region comprises forming said extended drain region to overlap with one upper peripheral region of said first well.
6. The method of claim 5 , wherein forming said second well comprises forming said second well to overlap with one lower peripheral region of said first well.
7. The method of claim 1 , wherein said impurity ions comprise a concentration between approximately 5E16 atoms/cm 2 and 5E18 atoms/cm 2 .
8. A method comprising:
forming a first well by injecting first conduction type impurity ions over a semiconductor substrate;
forming an extended drain region overlapped with a region of said first well by injecting second conduction type impurities over said semiconductor substrate;
forming a first conduction type second well over said semiconductor substrate under said extended drain region and overlapped with another region of said first well by injecting second conduction type impurities over said semiconductor substrate;
forming a gate over said first well overlapped with said extended drain region; and
forming a drain region by injecting second conduction type impurities over said extended drain region at one side of the gate.
9. The method of claim 8 , wherein forming said extended drain region comprises forming said extended drain region to overlap with opposite upper peripheral regions of said first well.
10. The method of claim 9 , wherein forming said second well comprises forming said second well to overlap with opposite lower peripheral regions of said first well.
11. The method of claim 8 , wherein forming said drain region comprises forming said drain region spaced apart from the gate.
12. The method of claim 8 , wherein forming said extended drain region comprises forming said extended drain region to overlap with one upper peripheral region of said first well.
13. The method of claim 12 , wherein forming said second well comprises forming said second well to overlap one side lower peripheral region of said first well.
14. The method of claim 8 , wherein said impurity ions comprise a concentration between approximately 5E16 atoms/cm 2 and 5E18 atoms/cm 2 .