Fan-out chip scale package
A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads.
1. A chip scale package, comprising:
a semiconductor die embedded in a die support body formed of a molding composition, the semiconductor die having a die surface with a first area, the die support body having a layer support surface proximal the first area, the die having a plurality of first bond pads disposed in a first spaced arrangement on the first area, the first spaced arrangement having a first minimum center-to-center bond pad spacing;
a bond pad spacing interface structure supported, at least in part, by the layer support surface of the die support body, the bond pad spacing interface structure having a plurality of second bond pads in a second spaced arrangement over a second area, the second spaced arrangement having a second minimum center-to-center bond pad spacing, and a plurality of electrical conductors, each of the electrical conductors connecting a corresponding one of the first bond pads to a corresponding one or more of the second bond pads, wherein the first bond pads are arranged with a first average density of bond pads per unit area and the second bond pads are arranged with a second average density value of bond pads per unit area that is lower than said first density.
2. The chip scale package of claim 1 , wherein the semiconductor die includes a dielectric layer disposed on at least a portion of the first area of the semiconductor die, the dielectric layer having a plurality of bond pad clearance openings, each bond pad clearance opening aligned with a corresponding one of the first bond pads.
3. The chip scale package of claim 1 , wherein the bond pad spacing interface structure includes a dielectric layer disposed on at least a portion of the first area of the semiconductor die and at least a portion of the layer support surface of the die support body, the dielectric layer having a plurality of bond pad clearance openings, each bond pad clearance opening aligned with a corresponding one of the first bond pads.
4. The chip scale package of claim 2 , wherein the bond pad density interface structure includes a patterned conductive layer overlaying at least a portion of the dielectric layer, the patterned conductive layer forming the electrical conductors.
5. The chip scale package of claim 3 , wherein the bond pad density interface structure includes a patterned conductive layer overlaying at least a portion of the dielectric layer, the patterned conductive layer forming the electrical conductors.
6. The chip scale package of claim 4 , wherein the bond pad density interface structure includes a solder mask disposed over at least a portion of the patterned conductive layer, the solder mask having clearance openings respectively aligned with the second bond pads.
7. The chip scale package of claim 5 , wherein the bond pad density interface structure includes a solder mask disposed over at least a portion of the patterned conductive layer, the solder mask having clearance openings respectively aligned with the second bond pads.
8. The chip scale package of claim 6 , wherein the bond pad density interface structure includes a solder bump disposed within a clearance opening of the solder mask, the solder bump having a bottom surface contacting one of the second bond pads and a top surface projecting outward beyond a surface plane of the solder mask.
9. The chip scale package of claim 7 , wherein the bond pad density interface structure includes a solder bump disposed within a clearance opening of the solder mask, the solder bump having a bottom surface contacting one of the second bond pads and a top surface projecting outward beyond a surface plane of the solder mask.
10. The chip scale package of claim 1 , wherein the first minimum center-to-center spacing is smaller than the second minimum center-to-center spacing.
11. The chip scale package of claim 1 , wherein the first area of the die surface is substantially coplanar with the second area of the die support body.
12. The chip scale package of claim 2 , wherein the dielectric layer is a polymeric dielectric buffer material with a low moisture uptake and an elongation of from approximately 10% to 300%.
13. The chip scale package of claim 3 , wherein the dielectric layer is a polymeric dielectric buffer material with a low moisture uptake and an elongation of from approximately 10% to 300%.
14. A chip scale package, comprising:
a semiconductor die embedded in a die support body formed of a molding composition, the semiconductor die having a die surface with a first area, the die support body having a layer support surface proximal the first area, the die having a plurality of first bond pads disposed in a first spaced arrangement on the first area, the first spaced arrangement having a first minimum center-to-center bond pad spacing;
a bond pad spacing interface structure supported, at least in part, by the layer support surface of the die support body, the bond pad spacing interface structure having a plurality of second bond pads in a second spaced arrangement over a second area, the second spaced arrangement having a second minimum center-to-center bond pad spacing, and a plurality of electrical conductors, each of the electrical conductors connecting a corresponding one of the first bond pads to a corresponding one or more of the second bond pads wherein the semiconductor die includes a dielectric layer disposed on at least a portion of the first area of the semiconductor die, the dielectric layer having a plurality of bond pad clearance openings, each bond pad clearance opening aligned with a corresponding one of the first bond pads, and the dielectric layer is a polymeric dielectric buffer material with a low moisture uptake and an elongation of from approximately 20% to 100%.
15. The chip scale package of claim 3 , wherein the dielectric layer is a polymeric dielectric buffer material with a low moisture uptake and an elongation of from approximately 20% to 50%.
16. The chip scale package of claim 2 , wherein the dielectric layer is selected from the group consisting of an epoxy, a benzocyclobutene resin, a polyamide, a benzocyclobutene-modified polyamide, a benzocyclobutene-modified silicone, a silicone resin, a polyolefin resin, a diene resin, poly(methyl methacrylate), polysulfones, polyetherimides and styrene resins.
17. The chip scale package of claim 3 , wherein the dielectric layer is selected from the group consisting of an epoxy, a benzocyclobutene resin, a polyamide, a benzocyclobutene-modified polyamide, a benzocyclobutene-modified silicone, a silicone resin, a polyolefin resin, a diene resin, poly(methyl methacrylate), polysulfones, polyetherimides and styrene resins.
18. The chip scale package of claim 2 , wherein the dielectric layer is from approximately 0.1 to approximately 50 microns thick.
19. The chip scale package of claim 3 , wherein the dielectric layer is from approximately 0.1 to approximately 50 microns thick.
20. A chip scale package, comprising:
a semiconductor die embedded in a die support body formed of a molding composition, the semiconductor die having a die surface with a first area, the die support body having a layer support surface proximal the first area, the die having a plurality of first bond pads disposed in a first spaced arrangement on the first area, the first spaced arrangement having a first minimum center-to-center bond pad spacing;
a bond pad spacing interface structure supported, at least in part, by the layer support surface of the die support body, the bond pad spacing interface structure having a plurality of second bond pads in a second spaced arrangement over a second area, the second spaced arrangement having a second minimum center-to-center bond pad spacing, and a plurality of electrical conductors, each of the electrical conductors connecting a corresponding one of the first bond pads to a corresponding one or more of the second bond pads wherein the semiconductor die includes a dielectric layer disposed on at least a portion of the first area of the semiconductor die, the dielectric layer having a plurality of bond pad clearance openings, each bond pad clearance opening aligned with a corresponding one of the first bond pads, wherein the dielectric layer is from approximately 1 to approximately 10 microns thick.
21. The chip scale package of claim 3 , wherein the dielectric layer is from approximately 1 to approximately 10 microns thick.
22. The chip scale package of claim 1 , wherein at least some of the second bond pads are disposed on the die support body so that, viewed in a direction substantially perpendicular to a plane in which the second bond pads lie, the second bond pads are located beyond a projection of a perimeter of the semiconductor die.
23. The chip scale package of claim 1 , wherein at least one first bond pad is electrically connected to another first bond pad.