IP Library Granted Patent US 8,031,509
Granted Patent B2
US 8,031,509 · App. 12/653,836 · Granted Oct 4, 2011

Conductive metal oxide structures in non-volatile re-writable memory devices

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Quick Facts
Patent No.
US 8,031,509
App. No.
12/653,836
Granted
Oct 4, 2011
Kind
B2
Abstract

A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).

Claims (73)

1. A pyrochlore non-volatile memory cell, comprising:

a first terminal structure;

a second terminal structure; and

a memory element electrically in series with the first and second terminal structures and operative to store data as a plurality of conductivity profiles, the memory element including

an electrolytic insulator in contact with the first terminal structure and including a first thickness configured to allow tunneling conduction, and

a conductive metal oxide (CMO) including mobile oxygen ions and made from a pyrochlore oxide material having a crystalline structure, the CMO is in contact with the electrolytic insulator and with the second terminal structure,

wherein the pyrochlore oxide material includes a form A 2 B 2 O 7 , where O represents oxygen, A represents at least one rare-earth element, and B represents a selected one of a rare-earth element or a transition metal element.

2. The pyrochlore non-volatile memory cell of claim 1 , wherein the first thickness is approximately 50 Å or less.

3. The pyrochlore non-volatile memory cell of claim 2 , wherein the electrolytic insulator comprises yttria stabilized zirconia (YSZ).

4. The pyrochlore non-volatile memory cell of claim 2 , wherein the electrolytic insulator comprises zirconium oxide.

5. The pyrochlore non-volatile memory cell of claim 2 , wherein the electrolytic insulator comprises hafnium oxide.

6. The pyrochlore non-volatile memory cell of claim 2 , wherein the electrolytic insulator comprises gadolinium oxide.

7. The pyrochlore non-volatile memory cell of claim 2 , wherein the electrolytic insulator comprises erbium oxide.

8. The pyrochlore non-volatile memory cell of claim 1 and further comprising: a non-ohmic device electrically in series with the memory element and with the first and second terminal structures.

9. The pyrochlore non-volatile memory cell of claim 1 , wherein the first terminal structure is electrically coupled with only one of a plurality of first conductive array lines in a two-terminal cross-point memory array and the second terminal structure is electrically coupled with only one of a plurality of second conductive array lines in the two-terminal cross-point memory array.

10. The pyrochlore non-volatile memory cell of claim 9 , wherein the two-terminal cross-point memory array is connected with and is positioned above a substrate including active circuitry electrically coupled with the plurality of first and second conductive array lines and operative to perform data operation on the two-terminal cross-point memory array.

11. A binary oxide non-volatile memory cell, comprising:

a first terminal structure;

a second terminal structure; and

a memory element electrically in series with the first and second terminal structures and operative to store data as a plurality of conductivity profiles, the memory element including

an electrolytic insulator in contact with the first terminal structure and including a first thickness configured to allow tunneling conduction, and

a conductive metal oxide (CMO) including mobile oxygen ions and made from a conductive binary oxide material having a crystalline structure, the CMO is in contact with the electrolytic insulator and with the second terminal structure,

wherein the conductive binary oxide material includes a form A X O Y , where O represents oxygen and A represents a metal.

12. The binary oxide non-volatile memory cell of claim 11 , wherein the conductive binary oxide material comprises tin oxide.

13. The binary oxide non-volatile memory cell of claim 11 , wherein the conductive binary oxide material comprises zinc oxide.

14. The binary oxide non-volatile memory cell of claim 11 , wherein the electrolytic insulator includes vacancies operative to reversibly receive a portion of the mobile oxygen ions in response to a write voltage applied across the first and second terminal structures.

15. The binary oxide non-volatile memory cell of claim 11 , wherein the conductive binary oxide material comprises a doped titanium oxide.

16. The binary oxide non-volatile memory cell of claim 15 , wherein the titanium oxide is doped with niobium.

17. The binary oxide non-volatile memory cell of claim 11 , wherein the first thickness is approximately 50 Å or less.

18. The binary oxide non-volatile memory cell of claim 17 , wherein the electrolytic insulator comprises yttria stabilized zirconia (YSZ).

19. The binary oxide non-volatile memory cell of claim 17 , wherein the electrolytic insulator comprises zirconium oxide.

20. The binary oxide non-volatile memory cell of claim 17 , wherein the electrolytic insulator comprises hafnium oxide.

21. The binary oxide non-volatile memory cell of claim 17 , wherein the electrolytic insulator comprises gadolinium oxide.

22. The binary oxide non-volatile memory cell of claim 17 , wherein the electrolytic insulator comprises erbium oxide.

23. The binary oxide non-volatile memory cell of claim 17 , wherein the electrolytic insulator comprises yttrium oxide.

24. The binary oxide non-volatile memory cell of claim 11 and further comprising: a non-ohmic device electrically in series with the memory element and with the first and second terminal structures.

25. The binary oxide non-volatile memory cell of claim 11 , wherein the first terminal structure is electrically coupled with only one of a plurality of first conductive array lines in a two-terminal cross-point memory array and the second terminal structure is electrically coupled with only one of a plurality of second conductive array lines in the two-terminal cross-point memory array.

26. The binary oxide non-volatile memory cell of claim 25 , wherein the two-terminal cross-point memory array is connected with and is positioned above a substrate including active circuitry electrically coupled with the plurality of first and second conductive array lines and operative to perform data operation on the two-terminal cross-point memory array.

27. A Ruddlesden-Popper non-volatile memory cell, comprising:

a first terminal structure;

a second terminal structure; and

a memory element electrically in series with the first and second terminal structures and operative to store data as a plurality of conductivity profiles, the memory element including

an electrolytic insulator in contact with the first terminal structure and including a first thickness operative to allow tunneling conduction, and

a conductive metal oxide (CMO) including mobile oxygen ions and made from a Ruddlesden-Popper material having a crystalline structure, the CMO is in contact with the electrolytic insulator and with the second terminal structure.

28. The Ruddlesden-Popper non-volatile memory cell or claim 27 , wherein the material having the Ruddlesden-Popper structure includes a form ABO 3 , where O represents oxygen, A represents an alkaline earth metal element, and B represents a transition metal element.

29. The Ruddlesden-Popper non-volatile memory cell or claim 27 , wherein the material having the Ruddlesden-Popper structure includes a form AO(ABO 3 )n, where O represents oxygen, A represents at least one alkaline earth metal element, B represents at least one transition metal element, and n represents a Ruddlesden-Popper phase.

30. The Ruddlesden-Popper non-volatile memory cell of claim 27 , wherein the first thickness is approximately 50 Å or less.

31. The Ruddlesden-Popper non-volatile memory cell of claim 30 , wherein the electrolytic insulator comprises yttria stabilized zirconia (YSZ).

32. The Ruddlesden-Popper non-volatile memory cell of claim 30 , wherein the electrolytic insulator comprises zirconium oxide.

33. The Ruddlesden-Popper non-volatile memory cell of claim 30 , wherein the electrolytic insulator comprises hafnium oxide.

34. The Ruddlesden-Popper non-volatile memory cell of claim 30 , wherein the electrolytic insulator comprises gadolinium oxide.

35. The Ruddlesden-Popper non-volatile memory cell of claim 30 , wherein the electrolytic insulator comprises erbium oxide.

36. The Ruddlesden-Popper non-volatile memory cell of claim 27 and further comprising: a non-ohmic device electrically in series with the memory element and with the first and second terminal structures.

37. The Ruddlesden-Popper non-volatile memory cell of claim 27 , wherein the first terminal structure is electrically coupled with one of a plurality of first conductive array lines in a two-terminal cross-point memory array and the second terminal structure is electrically coupled with one of a plurality of second conductive array lines in the two-terminal cross-point memory array.

38. The Ruddlesden-Popper non-volatile memory cell of claim 37 , wherein the two-terminal cross-point memory array is connected with and is positioned above a substrate including active circuitry electrically coupled with the plurality of first and second conductive array lines and operative to perform data operation on the two-terminal cross-point memory array.

39. A multiple B-site non-volatile memory cell, comprising:

a first terminal structure;

a second terminal structure; and

a memory element electrically in series with the first and second terminal structures and operative to store data as a plurality of conductivity profiles, the memory element including

an electrolytic insulator in contact with the first terminal structure and including a first thickness operative to allow tunneling conduction, and

a conductive metal oxide (CMO) including mobile oxygen ions and made from a multiple B-site perovskite material including a plurality of perovskite unit cells, the CMO is in contact with the electrolytic insulator and with the second terminal structure,

the multiple B-site perovskite material includes a form A X (B 1 ,B 2 ) Y O Z , where A X represents one or more elements selected from the group consisting of lanthanum, cerium, praseodymium, neodymium, calcium, strontium, and barium that are positioned at A-sites in the plurality of perovskite unit cells, B 1 represents a first transition metal element positioned at B-sites in a first portion of the plurality of perovskite unit cells, B 2 represents a second transition metal element positioned at B-sites in a second portion of the plurality of perovskite unit cells, the second transition metal element is different than the first transition metal element, where O represents oxygen, where X can be any number, where Y is typically 1, and where Z is typically 3.

40. The multiple B-site non-volatile memory cell of claim 39 , wherein the first thickness is approximately 50 Å or less.

41. The multiple B-site non-volatile memory cell of claim 39 , wherein the electrolytic insulator comprises yttria stabilized zirconia (YSZ).

42. The multiple B-site non-volatile memory cell of claim 39 , wherein the electrolytic insulator comprises zirconium oxide.

43. The multiple B-site non-volatile memory cell of claim 39 , wherein the electrolytic insulator comprises hafnium oxide.

44. The multiple B-site non-volatile memory cell of claim 39 , wherein the electrolytic insulator comprises gadolinium oxide.

45. The multiple B-site non-volatile memory cell of claim 39 , wherein the electrolytic insulator comprises erbium oxide.

46. The multiple B-site non-volatile memory cell of claim 39 and further comprising: a non-ohmic device electrically in series with the memory element and with the first and second terminal structures.

47. The multiple B-site non-volatile memory cell of claim 39 , wherein the first terminal structure is electrically coupled with one of a plurality of first conductive array lines in a two-terminal cross-point memory array and the second terminal structure is electrically coupled with one of a plurality of second conductive array lines in the two-terminal cross-point memory array.

48. The multiple B-site non-volatile memory cell of claim 47 , wherein the two-terminal cross-point memory array is connected with and is positioned above a substrate including active circuitry electrically coupled with the plurality of first and second conductive array lines and operative to perform data operation on the two-terminal cross-point memory array.

49. The multiple B-site non-volatile memory cell of claim 39 , wherein the multiple B-site perovskite material includes a crystalline structure.

50. The multiple B-site non-volatile memory cell of claim 49 , wherein the crystalline structure does not comprise a single crystalline structure.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Feb 9, 2012
From: SILICON VALLEY BANK
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 027675/0686 →
SECURITY AGREEMENT Recorded Jan 25, 2011
From: UNITY SEMICONDUCTOR CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 025710/0132 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2010
From: SCHLOSS, LAWRENCE; BREWER, JULIE; KINNEY, WAYNE; MEYER, RENE
To: UNITY SEMICONDUCTOR CORPORATION
Reel/Frame 023761/0765 →