IP Library Granted Patent US 8,749,259
Granted Patent B2
US 8,749,259 · App. 12/681,295 · Granted Jun 10, 2014

Full grid cassette for a parallel tester for testing a non-componented printed circuit board, spring contact pin for such a full grid cassette and adapter for a parallel tester for testing a non-componented printed circuit board

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Quick Facts
Patent No.
US 8,749,259
App. No.
12/681,295
Granted
Jun 10, 2014
Kind
B2
Abstract

The invention relates to a full grid cassette for a parallel tester for testing a non-componented printed circuit board, to a spring contact pin for such a full grid cassette and to an adapter for a parallel tester for testing a non-componented printed circuit board.

Claims (44)

1. A full grid cassette for an apparatus for testing non-componented printed circuit boards, the full grid cassette electrically connects contact points of a basic grid to individual test needles of an adapter, wherein the full grid cassette comprises:

a basic grid plate oriented towards the basic grid and an adapter plate oriented towards the adapter, wherein aligned through holes in each of the basic grid plate and the adapter plate are provided to accommodate spring contact pins, each of the spring contact pins being made from a wire with a helically wound spring section and located without sheathing in the through holes of the adapter plate and of the basic grid plate and the spring sections extending at least across a region between the adapter plate and the basic grid plate; and

a film located between the adapter plate and the basic grid plate and provided with holes through each of which one of the spring contact pins passes, the width of the holes being less than the maximum diameter of the spring contact pins.

2. The full grid cassette according to claim 1 , wherein the holes of the film are designed as slots, the length of which is approximately equal to or slightly exceeds the maximum diameter of the spring contact pins.

3. The full grid cassette according to claim 2 , wherein the film is made of polyimide.

4. The full grid cassette according to claim 3 , wherein the spring contact pins are made of spring wire.

5. The full grid cassette according to claim 4 , wherein a taper is provided in the through holes of the basic grid plate or the adapter plate, the through hole tapering towards the outside of the full grid cassette, and in that the spring contact pins have a thickened section located between the taper and the film.

6. The full grid cassette according to claim 5 , wherein the taper is configured as an annular step.

7. The full grid cassette according to claim 1 , wherein the film is made of polyimide.

8. The full grid cassette according to claim 1 , wherein the spring contact pins are made of spring wire.

9. The full grid cassette according to claim 1 , wherein a taper is provided in the through holes of the basic grid plate or the adapter plate, the through hole tapering towards the outside of the full grid cassette, and in that the spring contact pins have a thickened section located between the taper and the film.

10. The full grid cassette according to claim 9 , wherein the taper is configured as an annular step.

11. The full grid cassette according to claim 1 , wherein the spring section of the spring contact pins extends across a region between the adapter plate and the basic grid plate.

12. The full grid cassette according to claim 1 , wherein the spring contact pins are arranged in a regular grid pattern corresponding to the basic grid.

13. The full grid cassette according to claim 1 , wherein the test needles of the adapter comprise contact needles and/or contact pins.

14. A unit comprising a full grid cassette according to claim 1 and an adapter for an apparatus for testing non-componented printed circuit boards, wherein the adapter being designed for electrically connecting contact pins of a full grid cassette with contact points of a printed circuit board, wherein the adapter comprises test needles which are secured from dropping out on just one side of the adapter, and the full grid, cassette is attached on the side of the adapter on which the test needles are not secured.

15. The unit according to claim 14 , wherein the adapter comprises contact needles or contact pins as well as a plurality of guide plates, wherein guide holes are formed through which the contact needles or the contact pins pass, wherein the contact needles or contact pins are designed for contacting plated-through holes of the printed circuit boards to be tested with a scanning head which is significantly wider than the rest of the contact needles or contact pins, and wherein the contact needles or contact pins have a locking projection and the guide plate of the adapter which faces the printed circuit board to be tested has a keyhole designed such that the locking projection can be passed through from the side of the printed circuit board to be tested, and wherein, on the side remote from the printed circuit board to be tested, either a locking recess is provided adjacent to the keyhole for the accommodation of the locking projection, or the keyhole has a region through which the locking projection can be passed and which is slightly offset from an ideal position of the contact needles or contact pins and has a narrower region which extends to the ideal position, so that the contact needles or contact pins adopt its ideal position guided by the further guide plates and the locking projection comes to lie on the guide plate provided with the keyhole.

16. A full grid cassette for an apparatus for testing non-componented printed circuit boards, the full grid cassette electrically connects contact points of a basic grid to individual test needles of an adapter, wherein the full grid comprises:

a basic grid plate oriented towards the basic grid and an adapter plate oriented towards the adapter, wherein aligned through holes are provided to accommodate and guide spring contact pins, each of the spring contact pins being made from a wire with a helically wound spring section and located without sheathing in the through holes of the adapter plate and of the basic grid plate; and

a guide device located between the adapter plate and the basic grid plate such that the adapter plate and the basic grid plate are movable relative to one another in an axial direction of the spring contact pins and have play in a plane perpendicular to the axial direction of the spring contact pins.

17. The full grid cassette according to claim 16 , wherein the play lies within a range of 60 μm to 200 μm, preferably 80 μm to 150 μm.

18. The full grid cassette according to claim 16 , wherein the spring section of the spring contact pins extends across a region between the adapter plate and the basic grid plate.

19. The full grid cassette according to claim 16 , wherein the spring contact pins are arranged in a regular grid pattern corresponding to the basic grid.

20. The full grid cassette according to claim 16 , wherein the test needles of the adapter comprise contact needles and/or contact pins.

21. A unit comprising a full grid cassette according to claim 16 and an adapter for an apparatus for testing non-componented printed circuit boards, wherein the adapter is designed for electrically connecting contact pins of a full grid cassette with contact points of a printed circuit board, wherein the adapter comprises test needles which are secured from dropping out on just one side of the adapter, and the full grid cassette is attached on the side of the adapter on which the test needles are not secured.

22. The unit according to claim 21 , wherein the adapter comprises contact needles or contact pins as well as a plurality of guide plates, wherein guide holes are formed through which the contact needles or the contact pins pass, wherein the contact needles or contact pins are designed for contacting plated-through holes of the printed circuit boards to be tested with a scanning head which is significantly wider than the rest of the contact needles or contact pins, and wherein the contact needles or contact pins have a locking projection and the guide plate of the adapter which faces the printed circuit board to be tested has a keyhole designed such that the locking projection can be passed through from the side of the printed circuit board to be tested, and wherein, on the side remote from the printed circuit board to be tested, either a locking recess is provided adjacent to the keyhole for the accommodation of the locking projection, or the keyhole has a region through which the locking projection can be passed and which is slightly offset from an ideal position of the contact needles or contact pins and has a narrower region which extends to the ideal position, so that the contact needles and contact pins adopt its ideal position guided by the further guide plates and the locking projection comes to lie on the guide plate provided with the keyhole.

23. The unit according to claim 22 , wherein the adapter is provided both with contact needles and with contact pins.

24. The unit according to claim 22 , wherein the contact pins are made of thin sheet metal.

25. A contact pin for a full grid cassette comprising:

a spring contact pin helically wound from a wire having at least one spring section,

wherein a maximum diameter of the spring contact pin is no more than 0.8 mm and an end winding is wound to a smaller radius than adjacent windings, so that the wire has an end which is disposed centrally relative to the adjacent windings and forms a central contact point.

26. The spring contact pin according to claim 25 , wherein the wire is a spring wire.

27. The spring contact pin according to claim 25 , wherein the wire has a diameter approximately 0.10 mm to 0.15 mm.

28. The spring contact pin according to claim 27 , wherein the diameter is approximately 0.10 mm to 0.12 mm.

29. An apparatus for testing non-componented printed circuit boards comprising:

an adapter electrically connecting spring contact pins of a full grid cassette to contact points of a printed circuit board to be tested,

wherein the adapter is provided with a plurality of guide plates,

wherein guide holes are formed through the plurality of guide plates which a plurality of contact pins pass,

wherein the contact pins contact plated-through holes of the printed circuit boards to be tested with a scanning head which is wider than the rest of the contact pin,

wherein the contact pin has a locking projection and the guide plate of the adapter which faces the printed circuit board to be tested has a keyhole configured such that the locking projection can be passed through from a side of the printed circuit board to be tested, and

wherein on the side remote from the printed circuit board to be tested, either a locking recess is provided adjacent to the keyhole for the accommodation of the locking projection, or the keyhole has a region through which the locking projection can be passed and which is offset from an ideal position of the contact pin and has a narrower region which extends to the ideal position, so that the contact pin adopts a position guided by the further guide plates and the locking projection comes to lie on the guide plate provided with the keyhole.

30. The adapter according to claim 29 , wherein the adapter has both contact needles and contact pins.

31. The adapter according to claim 30 , wherein the contact pins are made of thin sheet metal.

32. The adapter according to claim 29 , wherein the contact pins are made of thin sheet metal.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jun 15, 2021
From: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
To: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES, LLC
Reel/Frame 056592/0572 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 7261561 AND REPLACE WITH PATENT NUMBER 7231561 PREVIOUSLY RECORDED ON REEL 034660 FRAME 0188. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT. Recorded Feb 11, 2016
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 037824/0372 →
RELEASE OF SECURITY INTEREST IN UNITED STATES PATENTS Recorded Dec 18, 2014
From: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
To: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
Reel/Frame 034660/0394 →
SECURITY AGREEMENT Recorded Dec 18, 2014
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 034660/0188 →
CHANGE OF NAME Recorded May 27, 2014
From: LTX-CREDENCE CORPORATION
To: XCERRA CORPORATION
Reel/Frame 033032/0768 →
SECURITY AGREEMENT Recorded Jan 17, 2014
From: LTX-CREDENCE CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 032086/0476 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2010
From: GULZOW, ANDREAS; DEHMEL, RUDIGER
To: DTG INTERNATIONAL GMBH
Reel/Frame 024661/0370 →