Semiconductor device and test method
A semiconductor device includes a first circuit block, a second circuit block, a first lead-out line coupled to the first circuit block, a second lead-out line coupled to the second circuit block, a first pad coupled to the first lead-out line, a second pad coupled to the second lead-out line, and a shielding line provided between the first lead-out line and the second lead-out line.
1. A test method comprising:
preparing a semiconductor device including a first circuit block, a second circuit block, a first lead-out line coupled to the first circuit block, a second lead-out line coupled to the second circuit block, a first pad coupled to the first lead-out line, a second pad coupled to the second lead-out line, first shielding lines which are provided at both sides of the first lead-out line respectively and are adjacent to the first lead-out line and second shielding lines which are provided at both sides of the second lead-out line respectively and are adjacent to the second lead-out line;
applying a test voltage to both the first pad and the second pad to perform a short-circuit test of the semiconductor device; and
monitoring for a leakage current flowing through at least one of the first shield lines and the second shield lines.
2. The test method according to claim 1 , wherein the applying simultaneously applies a test voltage to both the first pad and the second pad to perform the short-circuit test of the semiconductor device.
3. The test method according to claim 1 , wherein the short-circuit test is performed by fixing at least one of the first shielding lines and the second shielding lines to a first potential different from the test voltage.
4. A test method comprising:
preparing a semiconductor device including a first circuit block, a second circuit block, a first external power supply line coupled to the first circuit block, a second external power supply line coupled to the second circuit block, a first pad coupled to the first external power supply line, a second pad coupled to the second external power supply line, first shielding lines which are provided at both sides of the first external power supply line respectively and are adjacent to the first lead-out line and second shielding lines which are provided at both sides of the second external power supply line respectively and are adjacent to the second lead-out line;
applying a test voltage to both the first pad and the second pad to perform a short-circuit test of the semiconductor device; and
monitoring for a leakage current flowing through at least one of the first shield lines and the second shield lines.
5. The test method according to claim 4 , wherein the applying simultaneously applies a test voltage to both the first pad and the second pad to perform the short-circuit test of the semiconductor device.
6. The test method according to claim 4 , wherein the short-circuit test is performed by fixing at least one of the first shielding lines and the second shielding lines to a first potential different from the test voltage.