Strained-silicon transistor and method of making the same
View Patent ↗A structure of a strained-silicon transistor includes a PMOS disposed on a substrate, a silicon nitride layer positioned on the PMOS, and a compressive stress film disposed on the silicon nitride layer, wherein the silicon nitride has a stress between −0.1 Gpa and −3.2 Gpa, and the stress of the silicon nitride is smaller than the stress of the compressive stress layer.
1. A strained-silicon transistor structure, comprising:
a PMOS positioned on a substrate;
an NMOS positioned on the substrate;
a buffering stress film positioned on the PMOS, wherein the buffering stress film has a first compressive stress ranging from about −0.1 Gpa to −3.2 Gpa;
a compressive stress film directly positioned on the buffering stress film, wherein the compressive stress film has a second compressive stress higher than the first compressive stress of the buffering stress film;
a tensile stress film positioned on the NMOS; and
a first protective layer continuously covering the entire PMOS and continuously covering the entire NMOS, wherein the first protective layer is below the tensile stress film and the buffering stress film.
2. The strained-silicon transistor structure of claim 1 , further comprising a second protective layer on the tensile stress film.
3. The strained-silicon transistor structure of claim 1 , wherein the first compressive stress of the buffering stress film is between −2.0 Gpa to −3.0 Gpa.
4. The strained-silicon transistor structure of claim 1 , wherein the thickness of the buffering stress film is between 1 angstrom to 200 angstroms.
5. The strained-silicon transistor structure of claim 4 , wherein the thickness of the buffering stress film is between 20 angstrom to 50 angstroms.
6. The strained-silicon transistor structure of claim 1 , wherein the buffering stress film and the compressive stress film are made of the same material.
7. The strained-silicon transistor structure of claim 1 , wherein the thickness of the buffering stress film is smaller than the thickness of the compressive film.