IP Library › Granted Patent US 8,555,809
Granted Patent B2
US 8,555,809 · App. 12/687,288 · Granted Oct 15, 2013

Method for constant concentration evaporation and a device using the same

Inventors: Egbert Woelk (North Andover, MA); Ronald L. DiCarlo, Jr. (Danville, NH)
Assignee: Rohm and Haas Electronic Materials, LLC
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Quick Facts
Patent No.
US 8,555,809
App. No.
12/687,288
Granted
Oct 15, 2013
Kind
B2
Abstract

Disclosed herein is a device comprising an evaporator; and a heat exchanger; the heat exchanger being in fluid communication with evaporator; evaporator comprising an outer casing; and an inner casing that is disposed within the outer casing; the inner casing contacting a plate; wherein the inner casing encloses a first conduit that is operative to introduce a carrier fluid into evaporator; and a second conduit that is operative to remove carrier fluid entrained with a precursor; wherein the outer casing is detachably attached to the plate; the plate contacting a first precursor conduit that is operative to introduce the precursor into evaporator from the heat exchanger; where the heat exchanger is disposed proximate to evaporator at a distance effective to maintain the precursor in evaporator at a substantially constant temperature when the ambient temperature around the heat exchanger and evaporator fluctuates by an amount of up to about ±35° C.

Claims (41)

1. A device comprising:

an evaporator; and

a heat exchanger; the heat exchanger being in fluid communication with the evaporator;

the evaporator comprising:

an outer casing; and

an inner casing that is disposed within the outer casing; the inner casing contacting a plate; wherein the inner casing encloses:

a first conduit that is operative to introduce a carrier fluid into the evaporator;

wherein the first conduit is an inverted U-shaped conduit that has one end in fluid communication with a first port for introducing the carrier fluid into the evaporator and an opposing end in fluid communication with a sparger; and

a second conduit that is operative to remove the carrier fluid entrained with a precursor; wherein the outer casing is detachably attached to the plate; the plate contacting a first precursor conduit that is operative to introduce the precursor into the evaporator from the heat exchanger; where the heat exchanger is disposed proximate to the evaporator at a distance effective to maintain the precursor in the evaporator at a substantially constant temperature when the ambient temperature around the heat exchanger and the evaporator fluctuates by an amount of up to about ±35° C.

2. The device of claim 1 , wherein the second conduit is an inverted J-shaped conduit that has one end in fluid communication with a second port for removing the carrier fluid entrained with a precursor from the evaporator and an opposing end in fluid communication with a splash shield.

3. The device of claim 1 , wherein the proximity of the heat exchanger to the evaporator is effective to maintain a ratio of the carrier fluid to the precursor that does not change by an amount of greater than or equal to about 0.5% when the ambient temperature around the heat exchanger and the evaporator fluctuates by an amount of up to about ±35° C.

4. The device of claim 1 , wherein the proximity of the heat exchanger to the evaporator is effective to maintain a variation in temperature of the precursor in a fluid path from the heat exchanger to the evaporator to be less than or equal to about ±0.1° C.

5. The device of claim 1 , wherein the inverted U-shaped conduit is disposed in the evaporator via a hole in the plate.

6. The device of claim 2 , wherein the inverted J-shaped conduit is disposed in the evaporator via a hole in the plate.

7. A method comprising:

heating or cooling a precursor in a heat exchanger;

discharging the precursor from the heat exchanger to an evaporator; the evaporator comprising:

an outer casing; and

an inner casing that is disposed within the outer casing; the inner casing contacting a plate; wherein the inner casing encloses:

a first conduit; wherein the first conduit is an inverted U-shaped conduit that has one end in fluid communication with a first port for introducing a carrier fluid into the evaporator and an opposing end in fluid communication with a sparger; and

a second conduit; wherein the second conduit is an inverted J-shaped conduit that has one end in fluid communication with a second port for removing the carrier fluid entrained with a precursor from the evaporator and an opposing end in fluid communication with a splash shield;

introducing a carrier fluid into the evaporator via the first conduit;

sparging the precursor with the carrier fluid; and

removing the carrier fluid entrained with the precursor from the evaporator via the second conduit; where the proximity of the heat exchanger to the evaporator is effective to maintain the precursor in the evaporator at a substantially constant temperature when the ambient temperature around the heat exchanger and the evaporator fluctuates by an amount of up to about ±35° C.

8. The method of claim 7 , further comprising circulating a fluid in a space between the outer casing and the inner casing.

9. A method for manufacturing a device comprising:

disposing an inverted U-shaped conduit in a first hole, an inverted J-shaped conduit in a second hole and a first precursor conduit in a third hole on a plate; the plate being affixed with a heat exchanger; and

disposing an inner casing and an outer casing on a side of the plate that is opposed to a side where the heat exchanger contacts the plate; the inner casing being contained in the outer casing; the inner casing enclosing the inverted U-shaped conduit, the inverted J-shaped conduit and the first precursor conduit.

10. A device comprising:

an evaporator; and

a heat exchanger; the heat exchanger being in fluid communication with the evaporator;

the evaporator comprising:

an outer casing; and

an inner casing that is disposed within the outer casing; the inner casing contacting a plate; wherein the inner casing encloses:

a first conduit that is operative to introduce a carrier fluid into the evaporator; and

a second conduit that is operative to remove the carrier fluid entrained with a precursor; wherein the outer casing is detachably attached to the plate; the plate contacting a first precursor conduit that is operative to introduce the precursor into the evaporator from the heat exchanger; where the heat exchanger is disposed proximate to the evaporator at a distance effective to maintain the precursor in the evaporator at a substantially constant temperature when the ambient temperature around the heat exchanger and the evaporator fluctuates by an amount of up to about ±35° C.; wherein the second conduit is an inverted J-shaped conduit that has one end in fluid communication with a second port for removing the carrier fluid entrained with a precursor from the evaporator and an opposing end in fluid communication with a splash shield.

11. The device of claim 10 , wherein the first conduit is an inverted U-shaped conduit that has one end in fluid communication with a first port for introducing the carrier fluid into the evaporator and an opposing end in fluid communication with a sparger.

12. The device of claim 10 , wherein the proximity of the heat exchanger to the evaporator is effective to maintain a ratio of the carrier fluid to the precursor that does not change by an amount of greater than or equal to about 0.5% when the ambient temperature around the heat exchanger and the evaporator fluctuates by an amount of up to about ±35° C.

13. The device of claim 10 , wherein the proximity of the heat exchanger to the evaporator is effective to maintain a variation in temperature of the precursor in a fluid path from the heat exchanger to the evaporator to be less than or equal to about ±0.1° C.

14. The device of claim 10 , wherein the first conduit is an inverted U-shaped conduit is disposed in the evaporator via a hole in the plate.

15. The device of claim 10 , wherein the inverted J-shaped conduit is disposed in the evaporator via a hole in the plate.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2023
From: CERES TECHNOLOGIES, INC.
To: EDWARDS SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 062741/0904 →
CORRECTION OF ADDRESS OF THE ASSIGNEE Recorded Jan 4, 2019
From: CERES TECHNOLOGIES, INC.
To: CERES TECHNOLOGIES, INC.
Reel/Frame 048010/0265 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2017
From: ROHM AND HAAS ELECTRONIC MATERIALS LLC
To: CERES TECHNOLOGIES, INC.
Reel/Frame 041159/0539 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2010
From: WOELK, EGBERT; DICARLO, RONALD L., JR.
To: ROHM AND HAAS ELECTRONIC MATERIALS, LLC
Reel/Frame 023783/0012 →
Continuity (1)
Related Publication 20110171383A1 · Jul 14, 2011