System for analyzing sensitivity of parasitic capacitance to variation of semiconductor design parameters

1. A sensitivity analysis system comprising:

a memory device in which an interconnect structure data indicating an interconnect structure included in a semiconductor device is stored, wherein said interconnect structure comprises:

a main interconnection formed in an interconnection layer; and

a contact structure electrically connected to said main interconnection and extending from said main interconnection toward a semiconductor substrate,

wherein a plurality of parameters contribute to parasitic capacitance of said interconnect structure, and

variation of each of said plurality of parameters from a design value caused by manufacturing variability is represented within a predetermined range;

a parameter setting unit configured to set said variation to a plurality of conditions within said predetermined range;

a capacitance calculation unit configured to calculate said parasitic capacitance of said interconnect structure in each of said plurality of conditions; and

a sensitivity analysis unit configured to analyze, based on said calculated parasitic capacitance, response of said parasitic capacitance to variation of said each parameter,

wherein said sensitivity analysis unit calculates variation of said parasitic capacitance from a design value in each of said plurality of conditions, and

said sensitivity analysis unit makes a comparison between the variation of said parasitic capacitance and a predetermined threshold value to analyze degree of contribution of said each parameter to said parasitic capacitance.

2. The sensitivity analysis system according to claim 1 ,

wherein said sensitivity analysis unit analyzes whether said parasitic capacitance increases or decreases in response to the variation of said each parameter.

3. The sensitivity analysis system according to claim 1 ,

wherein said semiconductor device comprises a memory,

said interconnect structure drives a cell transistor included in a memory cell of said memory, and

said main interconnection is a word line or a bit line that is connected to said cell transistor through said contact structure.

4. A sensitivity analysis system comprising:

a memory device in which an interconnect structure data indicating an interconnect structure included in a semiconductor device is stored, wherein said interconnect structure comprises:

a main interconnection formed in an interconnection layer; and

a contact structure electrically connected to said main interconnection and extending from said main interconnection toward a semiconductor substrate,

wherein a plurality of parameters contribute to parasitic capacitance of said interconnect structure, and

variation of each of said plurality of parameters from a design value caused by manufacturing variability is represented within a predetermined range;

a parameter setting unit configured to set said variation to a plurality of conditions within said predetermined range;

a capacitance calculation unit configured to calculate said parasitic capacitance of said interconnect structure in each of said plurality of conditions; and

a sensitivity analysis unit configured to analyze, based on said calculated parasitic capacitance, response of said parasitic capacitance to variation of said each parameter,

wherein a layer placed immediately above said interconnection layer is a first layer, and a layer placed immediately below said interconnection layer is a second layer,

wherein said plurality of parameters comprise:

a first film thickness that is a film thickness of an interlayer insulating film in said first layer; and

a second film thickness that is a film thickness of an interlayer insulating film in said second layer,

wherein the variation of said first film thickness from the design value is represented within a range from −δ1 to +δ1, and

the variation of said second film thickness from the design value is represented within a range from −δ2 to +δ2,

wherein said plurality of conditions comprise:

a first condition in which said plurality of parameters all are set to the design values;

a second condition in which the variation of said first film thickness and said second film thickness are set to +δ1 and +δ2, respectively; and

a third condition in which the variation of said first film thickness and said second film thickness are set to −δ1 and −δ2, respectively.

5. The sensitivity analysis system according to claim 4 ,

wherein said contact structure has a stacked structure in which conductors formed in respective layers below said interconnection layer are stacked,

wherein said plurality of parameters further comprise a third film thickness that is a film thickness of an interlayer insulating film in each layer among said respective layers other than said second layer, and

the variation of said third film thickness from the design value is represented within a range from −δ3 to +δ3, and

wherein said plurality of conditions further comprise:

a fourth condition in which the variation of said first film thickness, said second film thickness and said third film thickness are set to +δ1, +δ2 and +δ3, respectively; and

a fifth condition in which the variation of said first film thickness, said second film thickness and said third film thickness are set to −δ1, −δ2 and −δ3, respectively.

6. The sensitivity analysis system according to claim 5 ,

wherein a layer placed immediately above said first layer is a supra-interconnection layer, and a layer placed immediately below said second layer is a sub-interconnection layer,

wherein said plurality of parameters further comprise:

a first interconnect width and a first interconnect thickness that respectively are a width and a thickness of an interconnection formed in said supra-interconnection layer; and

a second interconnect width and a second interconnect thickness that respectively are a width and a thickness of an interconnection formed in said sub-interconnection layer,

wherein the variation of said first interconnect width from the design value is represented within a range from −δ4 to +δ4,

the variation of said first interconnect thickness from the design value is represented within a range from −δ5 to +δ5,

the variation of said second interconnect width from the design value is represented within a range from −δ6 to +δ6, and

the variation of said second interconnect thickness from the design value is represented within a range from −δ7 to +δ7, and

wherein said plurality of conditions further comprise:

a sixth condition in which the variation of said first film thickness, said second film thickness, said first interconnect width and said second interconnect width are set to −δ1, −δ2, +δ4 and +δ6, respectively; and

a seventh condition in which the variation of said first film thickness, said second film thickness, said first interconnect thickness and said second interconnect thickness are set to −δ1, −δ2, +δ5 and +δ7, respectively.

7. A non-transient computer readable medium storing a sensitivity analysis program that, when executed by a computer, causes the computer to perform a method comprising:

reading an interconnect structure data indicating an interconnect structure included in a semiconductor device from a memory device, wherein said interconnect structure comprises:

a main interconnection formed in an interconnection layer; and

a contact structure electrically connected to said main interconnection and extending from said main interconnection toward a semiconductor substrate,

wherein a plurality of parameters contribute to parasitic capacitance of said interconnect structure, and

variation of each of said plurality of parameters from a design value caused by manufacturing variability is represented within a predetermined range;

setting said variation to a plurality of conditions within said predetermined range;

calculating said parasitic capacitance of said interconnect structure in each of said plurality of conditions;

analyzing, based on said calculated parasitic capacitance, response of said parasitic capacitance to variation of said each parameter;

calculating a variation of said parasitic capacitance from a design value in each of said plurality of conditions; and

comparing between the variation of said parasitic capacitance and a predetermined threshold value to analyze degree of contribution of said each parameter to said parasitic capacitance.