Patent Assignment
Reel/Frame 025194/0905
Change of Name
Recorded: 2010-10-26
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(91)
Semiconductor integrated circuit
Application:
12/662,712 →
Publication:
US 2010/0327951
Driver circuit
Application:
12/662,769 →
Publication:
US 2010/0328358
Driver Circuit
Image Processing Device, Image Processing Method and Non-Transitory Computer Readable Medium Recording Image Processing Program
Semiconductor device and method for manufacturing same
Application:
12/662,772 →
Publication:
US 2010/0314777
Display control circuit
Application:
12/662,773 →
Publication:
US 2010/0315407
Semiconductor Integrated Circuit
Semiconductor device and method for manufacturing the same
Application:
12/662,805 →
Publication:
US 2010/0327427
Display panel driving method, gate driver, and display apparatus
Application:
12/662,806 →
Publication:
US 2010/0315402
Semiconductor Device
Semiconductor device, designing method for semiconductor device, computer-readable medium, and manufacturing method for semiconductor device
Application:
12/662,906 →
Publication:
US 2010/0289150
Microcomputer System, Microcomputer, Power Control Method, and Power Control Program Product
Pattern division method, pattern division processing apparatus and information storage medium on which is stored a program
Application:
12/662,959 →
Publication:
US 2010/0296069
Process for Manufacturing Hydrophobized Microporous Film
Semiconductor Device Including a Mosfet Having a Gate Structure Including a Metal Gate Electrode and a Gate Insulating Film Including Hafnium
Application:
12/683,050 →
Publication:
US 2010/0176456
Fuse Element and Semiconductor Integrated Circuit with the Same
Application:
12/683,751 →
Publication:
US 2010/0176483
Semiconductor Device Where Logic Region and Dram Are Formed on Same Substrate
Patent:
8,575,701 →
Application:
12/685,413 →
Constant Current Circuit
Application:
12/685,972 →
Publication:
US 2010/0176786
Lead Frame and Method of Manufacturing Semiconductor Device
Application:
12/686,884 →
Publication:
US 2010/0187666
Semiconductor Device
Application:
12/687,365 →
Publication:
US 2010/0193864
Method of Designing Semiconductor Device and Design Program
System for Analyzing Sensitivity of Parasitic Capacitance to Variation of Semiconductor Design Parameters
Semiconductor Device Having Recess with Varying Width and Method of Manufacturing the Same
Semiconductor Device
Application:
12/689,741 →
Publication:
US 2010/0127404
Transimpedance Amplifier and Analog-Digital Converter Circuit
Electrical Testing Device and Electrical Testing Method with Control of Probe Contact Pressure
Failure Analysis Apparatus, Method
Semiconductor Memory Device and Test Method Therefor
Non-Volatile Semiconductor Memory Device with a Sense Amplifier Reference Circuit Having a Monos Transfer Transistor
Semiconductor Device with Reduced Pad Pitch
Duty Ratio Correction Circuit and Duty Ratio Correction Method
Non-Volatile Semiconductor Memory Device and Method of Manufacturing Same
Application:
12/697,767 →
Publication:
US 2010/0193855
Nonvolatile Semiconductor Memory Device and Method for Manufacturing the Same
Semiconductor Device and Method of Manufacturing the Same
Application:
12/699,076 →
Publication:
US 2010/0193883
Sram and Testing Method of Sram
Test Circuit and Test Method for Testing Differential Input Circuit
Method of Rear Surface Treatment, Analysis Method of Integrated Circuit from Rear Surface Side, and Rear Surface Treatment Apparatus
Application:
12/700,898 →
Publication:
US 2010/0193373
Semiconductor Device and Method of Manufacturing the Same
Application:
12/700,908 →
Publication:
US 2010/0193862
Semiconductor Integrated Circuit, Method of Testing Semiconductor Integrated Circuit, and Method of Designing Semiconductor Integrated Circuit
Application:
12/700,925 →
Publication:
US 2010/0205493
Semiconductor Device
Semiconductor Laser and Method of Manufacturing the Same
Semiconductor Storage Device and Control Method of the Same
Semiconductor Device with Solder Balls Having High Reliability
Semiconductor Device Including Metal-Insulator-Metal Capacitor Arrangement
A/D Conversion Circuit and a/D Conversion Method
Semiconductor Device and Manufacturing Method Thereof
Analog-Digital Converter
Color Ccd Linear Image Sensor
Application:
12/707,378 →
Publication:
US 2010/0208116
Method of Inspecting Mask Pattern and Mask Pattern Inspection Apparatus
Synchronous Processing Apparatus, Receiving Apparatus and Synchronous Processing Method
Application:
12/708,715 →
Publication:
US 2010/0215135
Level Shift Circuit and Switching Circuit Including the Same
Analog-To-Digital Conversion Apparatus and Method
System and Method for Supporting Design of Semiconductor Integrated Circuit Including Processing Scan Chains
Semiconductor Laser and Method of Manufacturing Semiconductor Laser
Data Protection Circuit, Data Protection Method, and Data Processing Apparatus
Application:
12/714,999 →
Publication:
US 2010/0223527
Wiring Structure and Method for Manufacturing the Same
Method of Cutting Electrical Fuse
Semiconductor Device
Application:
12/715,712 →
Publication:
US 2010/0224914
Amplifier and Analog/Digital Converter
System and Method for Behavioral Synthesis
Application:
12/717,377 →
Publication:
US 2010/0229144
Track-And-Hold Circuit and a/D Converter
Switch Circuit
Application:
12/718,661 →
Publication:
US 2010/0225377
Semiconductor Device
Esd Protection Element
Semiconductor Device Which Can Transmit Electrical Signals Between Two Circuits
Differential Sense Amplifier
Semiconductor Storage Device
Method of Semiconductor Circuit Device
Application:
12/726,010 →
Publication:
US 2010/0242004
Optical Module
Amplifying Device and Its Control Method
Semiconductor Device and Method of Manufacturing the Same
Application:
12/727,403 →
Publication:
US 2010/0244146
Semiconductor Device
Application:
12/727,430 →
Publication:
US 2010/0252888
Semiconductor Image Device
Application:
12/728,330 →
Publication:
US 2010/0265376
Radio Communication Device and Transmission Power Measurement Method of Radio Communication Device
Substrate and Semiconductor Device
Power Supply Voltage Detection Circuit
Inspection Tool for Top Guides of a Boiling Water Reactor
Dma Controller, Information Processing Device and Dma Management Method
Application:
12/732,897 →
Publication:
US 2010/0257289
Flash Memory and Data Erasing Method of the Same
Web Content Distribution System
Application:
12/751,326 →
Publication:
US 2011/0246557
Pll Circuit with Vco Gain Control
Erase Method of Nonvolatile Semiconductor Memory Device
Application:
12/752,573 →
Publication:
US 2010/0259984
Semiconductor Integrated Circuit, Information Processing Device, and Control Method for Semiconductor Integrated Circuit
Application:
12/752,654 →
Publication:
US 2010/0257334
Semiconductor Device and Method of Manufacturing the Same
Application:
12/753,961 →
Publication:
US 2010/0258863
Image Processing Method and Image Processing Apparatus
Application:
12/754,286 →
Publication:
US 2010/0253845
Performance Evaluation Device and Performance Evaluation Method
Application:
12/755,071 →
Publication:
US 2010/0262402
Nonvolatile Semiconductor Memory and Method of Manufacturing the Same
A/D Conversion Device
Semiconductor Device and Method of Manufacturing the Same
Application:
12/756,399 →
Publication:
US 2010/0258873
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Application:
12/757,177 →
Publication:
US 2010/0258955
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 7, 2010
From: IGUCHI, MANABU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023747/0876 →
Assignment of Assignor's Interest
Jan 13, 2010
From: YOKOSAWA, KOUJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023772/0576 →
Assignment of Assignor's Interest
Jan 13, 2010
From: INOUE, KEN
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023771/0013 →
Assignment of Assignor's Interest
Jan 15, 2010
From: TOKUDA, SATORU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023794/0203 →
Assignment of Assignor's Interest
Jan 19, 2010
From: YAMADA, KOJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023808/0812 →
Assignment of Assignor's Interest
Mar 5, 2010
From: IKENO, DAISUKE; NAKAJIMA, KAZUAKI; IIZUKA, TOSHIHIRO; MANABE, KENZO
To: KABUSHIKI KAISHA TOSHIBA; NEC ELECTRONICS CORPORATION
Reel/Frame 024036/0106 →
Assignment of Assignor's Interest
Mar 10, 2010
From: ASAI, YOSHIHIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024056/0668 →
Assignment of Assignor's Interest
Mar 10, 2010
From: ASAI, YOSHIHIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024056/0687 →
Assignment of Assignor's Interest
Mar 26, 2010
From: CHIKAKI, SHINICHI; NAKAYAMA, TAKAHIRO
To: NEC ELECTRONICS CORPORATION; ULVAC INC.
Reel/Frame 024144/0857 →
Assignment of Assignor's Interest
Apr 29, 2010
From: FUKUOKA, ATSUHISA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024377/0895 →
Assignment of Assignor's Interest
May 3, 2010
From: MIURA, MAKOTO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024371/0350 →
Assignment of Assignor's Interest
May 3, 2010
From: SASAKI, TSUNEKI; KUNIE, SHUICHI; KAWASAKI, TATSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024370/0766 →
Assignment of Assignor's Interest
May 3, 2010
From: ODA, NORIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024370/0829 →
Assignment of Assignor's Interest
May 3, 2010
From: KUBO, SATORU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024371/0360 →
Assignment of Assignor's Interest
May 3, 2010
From: KATOU, YUSUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024556/0254 →
Assignment of Assignor's Interest
May 3, 2010
From: MORI, TAKESHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024556/0257 →
Assignment of Assignor's Interest
May 4, 2010
From: ODA, NORIAKI; CHIKAKI, SHINICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024378/0092 →
Assignment of Assignor's Interest
May 4, 2010
From: HASHIMOTO, YOSHIHARU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024378/0174 →
Assignment of Assignor's Interest
May 4, 2010
From: KIMURA, TAKEHIRO; KURITA, YOICHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024378/0106 →
Assignment of Assignor's Interest
May 11, 2010
From: HAMANAKA, NOBUAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024408/0051 →
Assignment of Assignor's Interest
May 12, 2010
From: UMEZU, TOMOAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024420/0034 →
Assignment of Assignor's Interest
May 13, 2010
From: MATSUURA, SEIJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024420/0038 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →