IP Library Granted Patent US 8,217,459
Granted Patent B2
US 8,217,459 · App. 12/756,699 · Granted Jul 10, 2012

Semiconductor device

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Quick Facts
Patent No.
US 8,217,459
App. No.
12/756,699
Granted
Jul 10, 2012
Kind
B2
Abstract

A distance “a” from a first gate electrode of a first transistor of a high-frequency circuit to a first contact is greater than a distance “b” from a second electrode of a second transistor of a digital circuit to a second contact. The first contact is connected to a drain or source of the first transistor, and the second contact is connected to a drain or source of the second transistor.

Claims (26)

1. A semiconductor device comprising:

a high-frequency circuit connected to a first power supply terminal and a first ground terminal;

a digital circuit connected to a second power supply terminal and a second ground terminal;

a first transistor constituting part of the high-frequency circuit;

a second transistor constituting part of the digital circuit;

a first contact connected to a source or drain of the first transistor; and

a second contact connected to a source or drain of the second transistor,

wherein a distance “a” from a first gate electrode that is a gate electrode of the first transistor to the first contact is greater than a distance “b” from a second gate electrode that is the gate electrode of the second transistor to the second contact.

2. The semiconductor device according to claim 1 ,

wherein thicknesses of gate insulation films of the first transistor and the second transistor are equal.

3. The semiconductor device according to claim 1 ,

wherein an impurity structure for the sources and drains of the first transistor and the second transistor are the same.

4. The semiconductor device according to claim 1 ,

wherein impurity structures for channels of the first transistor and the second transistor are the same.

5. The semiconductor device according to claim 1 ,

wherein the first contact is connected to the drain of the first transistor.

6. The semiconductor device according to claim 5 ,

further comprising a third contact connected to the source of the first transistor,

wherein a distance “c” between the third contact and the first gate electrode is shorter than the distance “a”.

7. The semiconductor device according to claim 5 ,

further comprising a third contact connected to the source of the first transistor,

wherein a distance “c” between the third contact and the first gate electrode is equal to the distance “a”.

8. The semiconductor device according to claim 1 ,

wherein the first transistor has a multi-finger structure.

9. The semiconductor device according to claim 1 ,

wherein all of the transistors constituting the high-frequency circuit are first transistors where the distance “a” is greater than the distance “b”.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025194/0905 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2010
From: KURAMOTO, TAKAFUMI; NAKASHIBA, YASUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024235/0710 →