Patterning on surface with high thermal conductivity materials
The present invention provides for high thermal conductivity paper that comprises a host matrix ( 10 ), and high thermal conductivity materials ( 12 ) added to a surface of the host matrix in a specific pattern ( 12 ). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
1. A method of making high thermal conductivity paper comprising:
adding high thermal conductivity materials and a solvent for the high thermal conductivity materials onto or within a substrate consisting essentially of mica;
evaporating the solvent such that the high thermal conductivity materials form a specific pattern on or within the substrate; and
producing a mica paper product from the substrate;
wherein the produced mica paper product comprises portions having the specific pattern of high thermal conductivity materials and portions comprising mica without the specific pattern; and
wherein the plurality of high thermal conductivity materials comprises at least one of nanofillers, diamond like coatings on the paper product, or diamond like coatings on nanofillers.
2. The method of claim 1 , wherein the high thermal conductivity materials comprise 5-80% of a surface area of a surface of the paper product after the producing.
3. The method of claim 1 , wherein multiple specific patterns are added to the mica paper layer.
4. The method of claim 1 , wherein the specific pattern comprises at least one of a grid, edging, banding, centering, or combinations thereof.
5. The method of claim 1 , wherein the high thermal conductivity materials have an aspect ratio in a range of from 3 to 100.
6. A method of making high thermal conductivity paper comprising:
adding high thermal conductivity materials onto at least one of a mica substrate consisting essentially of mica or a mica paper product consisting essentially of mica in a specific pattern; and
prior to or after the adding the high thermal conductivity fillers, producing a paper product from the mica substrate;
wherein the produced mica paper product comprises portions having the specific pattern of high thermal conductivity materials and portions comprising mica without the specific pattern.
7. The method of claim 6 , wherein the high thermal conductivity materials are added onto a surface of the mica paper after producing the mica paper.
8. The method of claim 6 , wherein the mica substrate comprises dry mica flakelets, wherein the high thermal conductivity materials are added to the dry mica flakelets in the specific pattern during the adding, and wherein the paper product is formed after the adding.
9. The method of claim 6 , wherein the mica substrate comprises a mica slurry, wherein the high thermal conductivity materials are added to the mica slurry in the specific pattern during the adding, and wherein the paper product is formed after the adding.
10. The method of claim 6 , wherein the specific pattern comprises at least one of a grid, edging, banding, centering, or combinations thereof.
11. The method of claim 6 , wherein the high thermal conductivity materials comprise at least one of nanofillers, diamond-like coatings on the mica paper product, and nanofillers having diamond like coatings.
12. The method of claim 11 , wherein the high thermal conductivity materials have an aspect ratio in a range of from 3 to 100.
13. The method of claim 6 , wherein said adding is done at least twice to provide a staggering of the specific pattern during the producing when viewed in cross-section.
14. The method of claim 6 , wherein the high thermal conductivity materials comprise dendrimers.