Backlight unit equipped with light emitting diodes
View Patent ↗Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.
1. A backlight unit equipped with Light-Emitting Diodes (LEDs), comprising:
an insulating substrate provided with predetermined circuit patterns on one surface thereof;
a plurality of LED packages mounted above the insulating substrate and electrically connected to the circuit patterns;
an upper heat dissipation plate formed on the insulating substrate, and configured to come into contact with the circuit patterns and to dissipate heat generated in the LED packages, the upper heat dissipation plate has rectangular cross section;
a lower heat dissipation plate formed on a remaining surface of the insulating substrate, and configured to transmit heat transmitted through the upper heat dissipation plate; and
a chassis disposed in the remaining surface of the insulating substrate and fixedly combined with the insulating substrate,
wherein the upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole that passes through the insulating substrate and is plated with plating material on an inner wall thereof, and the through hole is directly connected to the upper heat dissipation plate and the lower heat dissipation plate,
wherein the LED packages comprise an LED chip, the LED chip is not disposed on the upper heat dissipation plate.
2. The backlight unit as set forth in claim 1 , wherein the upper heat dissipation plate and the lower heat dissipation plate are made of copper and each have a thickness of about 0.35 μm.
3. The backlight unit as set forth in claim 1 , wherein the area ratio of the through hole and the upper heat dissipation plate ranges from 1:10 to 1:300.
4. The backlight unit as set forth in claim 1 , wherein the insulating substrate is provided with an insulating film, and the insulating film is configured to cover the lower heat dissipation plate.
5. The backlight unit as set forth in claim 4 , wherein the insulating film has a thickness of about 0.35 μm.
6. The backlight unit as set forth in claim 1 , wherein the insulating substrate is provided with the circuit patterns on an epoxy resin.
7. The backlight unit as set forth in claim 1 , wherein the LED packages comprising:
two LED electrodes connected to the circuit patterns;
an LED chip mounted on one of the LED electrodes;
a plastic mold casing protecting the LED electrode and the LED chip from the outside; and
a lens covering the plastic mold casing.
8. The backlight unit as set forth in claim 1 , wherein the chassis is made of metallic material having thermal conductivity.