Method for evaluating microstructures on a workpiece based on the orientation of a grating on the workpiece
View Patent ↗In a measuring system, a method for evaluating parameters of a workpiece includes measuring a periodic structure, such as a grating, on the workpiece to produce image data. An orientation of features in the image data, produced by higher order diffractions from the periodic structure, is identified. An orientation of the periodic structure is determined based on the orientation of the features in the image data. The image data is then modified, based on the orientation of the periodic structure, to correlate with, and for comparison to, simulated image data to ascertain parameters of the workpiece. Alternatively, optical components in the measuring system, or the workpiece itself, are adjusted to provide a desired alignment between the optical components and the periodic structure. A microstructure on the workpiece may then be measured, and the resulting image data may be compared to the simulated image data to ascertain parameters of the microstructure.
1. A method for evaluating parameters of a workpiece, comprising:
measuring a periodic structure on the workpiece to produce image data;
identifying an orientation of a feature in the image data produced by higher-order diffractions from the periodic structure;
determining an orientation of the periodic structure based on the orientation of the feature in the image data; and
performing a comparison of the image data with simulated image data to ascertain parameters of the periodic structure, wherein the determined orientation of the periodic structure is used to produce a correlation between the compared image data and simulated image data.
2. The method of claim 1 , where the simulated image data is generated in advance of the measurement.
3. The method of claim 1 , where the simulated image data is generated via a regression optimization.
4. The method of claim 1 wherein the determined orientation of the periodic structure is used to produce a correlation between the compared image data and simulated image data by a software program.
5. The method of claim 1 wherein the determined orientation of the periodic structure is used to produce a correlation between the compared image data and simulated image data by modifying the image data based on the orientation of the periodic structure.
6. The method of claim 1 further comprising imaging a microstructure on the workpiece, after the orientation of the periodic structure is determined, to produce measurement image data.
7. The method of claim 6 wherein performing a comparison of the image data with simulated image data to ascertain parameters of the periodic structure uses the measurement image data.
8. The method of claim 1 wherein measuring is performed by a scatterometer.
9. The method of claim 1 wherein the workpiece is supported on one of an x-θ stage and an x-y-θ stage.
10. The method of claim 1 wherein the feature in the image data comprises at least one higher order streak.
11. A system for evaluating parameters of a workpiece, comprising:
means for measuring a periodic structure on the workpiece to produce image data;
means for identifying an orientation of a feature in the image data produced by higher-order diffractions from the periodic structure;
means for determining an orientation of the periodic structure, based on the orientation of the feature in the image data; and
means for correcting for the orientation of the periodic structure to produce a correlation between the compared image data and simulated image data; and
means for performing a comparison of the image data with the simulated image data to ascertain parameters of the periodic structure.
12. The system of claim 11 wherein the means for correcting for the orientation of the periodic structure to produce a correlation between the compared image data and simulated image data comprises a means for modifying the image data based on the orientation of the periodic structure.
13. The system of claim 11 further comprising means for polarizing return light from the workpiece.
14. The system of claim 11 further comprising means for supporting, moving, and rotating the workpiece.
15. An apparatus for evaluating parameters of a microstructure on a workpiece, comprising:
an irradiation source for producing a beam of radiation;
an optical system aligned with a path of the beam for focusing the beam at a focal plane;
a workpiece site for holding the workpiece with the microstructure positioned at the focal plane;
a detector for receiving a scattered radiation distribution diffracted from the microstructure;
a computer including a computer operable medium containing instructions for:
identifying an orientation of a feature in image data produced by higher order diffractions from the microstructure;
determining an orientation of the microstructure based on the orientation of the feature in the image data; and
performing a comparison of the image data with simulated image data to ascertain parameters of the periodic structure, wherein the determined orientation of the periodic structure is used to produce a correlation between the compared image data and simulated image data.
16. The apparatus of claim 15 wherein the computer operable medium further contains instructions for modifying the image data based on the orientation of the microstructure to correct for the orientation of the periodic structure.
17. The apparatus of claim 15 wherein the workpiece site comprises one of an x-θ stage and an x-y-θ stage.
18. The apparatus of claim 15 further comprising a polarizer in a return path of the higher order diffractions.
19. The apparatus of claim 15 wherein the optical system comprises an optics assembly for conditioning the beam, and an object lens assembly for focusing the conditioned beam.