Patent Assignment
Reel/Frame 052544/0224
Change of Name
Recorded: 2020-04-30
Pages: 9
Assignor
NANOMETRICS INCORPORATED
Executed: 2019-10-25
Assignee
ONTO INNOVATION INC.
16 JONSPIN ROAD, WILMINGTON, MASSACHUSETTS, 01887
Covered Properties
(112)
Method of Measuring Dishing Using Relative Height Measurements
Patent:
6,700,670 →
Application:
09/576,756 →
Method of Measuring Dishing
Patent:
6,710,888 →
Application:
09/578,798 →
Film Thickness Measurements Using Light Absorption
Patent:
6,573,999 →
Application:
09/615,964 →
Method of Measuring Dishing Using Relative Height Measurement
Patent:
6,568,290 →
Application:
09/636,264 →
Apparatus and Method for the Measurement of Diffracting Structures
Patent:
7,115,858 →
Application:
09/670,000 →
Method and Device for Determining the Dependence of a First Measured Quantity on a Second Measured Quantity
Patent:
6,526,372 →
Application:
09/720,951 →
Profiling Method
Patent:
6,633,389 →
Application:
09/724,813 →
Method and Apparatus for Measuring Lateral Variations in Thickness or Refractive Index of a Transparent Film on a Substrate
Patent:
6,801,321 →
Application:
09/762,473 →
Measurement of Diffracting Structures Using One-Half of the Non-Zero Diffracted Orders
Patent:
6,898,537 →
Application:
09/844,559 →
Surface Profiling Using a Differential Interferometer
Patent:
6,580,515 →
Application:
09/870,350 →
Edge Gripped Substrate Loading and Unloading Method
Patent:
6,485,253 →
Application:
09/875,420 →
Correcting the System Polarization Sensitivity of a Metrology Tool Having a Rotatable Polarizer
Patent:
6,522,406 →
Application:
09/877,363 →
Alignment of a Rotatable Polarizer with a Sample
Patent:
6,665,070 →
Application:
09/878,069 →
Combination of Normal and Oblique Incidence Polarimetry for the Characterization of Gratings
Patent:
6,713,753 →
Application:
09/898,641 →
Determination of Center of Focus by Diffraction Signature Analysis
Structure Identification Using Scattering Signatures
Spectroscopically Measured Overlay Target
Patent:
7,061,615 →
Application:
09/960,892 →
Differential Numerical Aperture Methods and Device
Method for Automatic De-Skewing of Multiple Layer Wafer for Improved Pattern Recognition
Patent:
7,433,509 →
Application:
09/974,721 →
Method and Apparatus for Measuring Stress in Semiconductor Wafers
Method of Measuring Small Pads on a Substrate
Patent:
6,859,279 →
Application:
10/058,263 →
Line Profile Asymmetry Measurement Using Scatterometry
Measuring an Alignment Target with Multiple Polarization States
Patent:
6,949,462 →
Application:
10/116,798 →
Method and Apparatus for Using an Alignment Target with Designed in Offset
Patent:
6,982,793 →
Application:
10/116,863 →
Positioning Two Elements Using an Alignment Target with a Designed Offset
Patent:
7,046,361 →
Application:
10/116,964 →
Dual Spot Confocal Displacement Sensor
Patent:
6,657,216 →
Application:
10/173,726 →
Edge Grip Chuck
Patent:
7,032,287 →
Application:
10/198,948 →
Stage with Two Substrate Buffer Station
Patent:
6,854,948 →
Application:
10/219,569 →
Method and Apparatus for Inspecting Defects on Polishing Pads to Be Used with Chemical Mechanical Polishing Apparatus
Measuring an Alignment Target with a Single Polarization State
Patent:
6,992,764 →
Application:
10/261,547 →
Method and Apparatus for Thickness Decomposition of Complicated Layer Structures
Leveling a Measured Height Profile
Patent:
6,925,860 →
Application:
10/370,912 →
Optical Method and Apparatus for Inspecting Large Area Planar Objects
Monitoring Apparatus and Method for Improving the Accuracy and Repeatability of Electrochemical Capacitance Voltage (Ecv) Measurements
Apparatus and Method for Electrical Characterization by Selecting and Adjusting the Light for a Target Depth of a Semiconductor
Detection Method and Apparatus Metal Particulates on Semiconductors
Line Profile Asymmetry Measurement
Focusing System and Method
Accurate Thickness Measurement of Thin Conductive Film
Patent:
7,005,306 →
Application:
10/618,155 →
Transferring, Buffering and Measuring a Substrate in a Metrology System
Patent:
7,301,623 →
Application:
10/738,190 →
Local Process Variation Correction for Overlay Measurement
Patent:
7,508,976 →
Application:
10/748,829 →
Characterizing Residue on a Sample
Patent:
7,362,448 →
Application:
10/937,248 →
Overlay Measurement Target
Darkfield Defect Inspection with Spectral Contents
Patent:
7,433,034 →
Application:
11/156,073 →
Multi-Layer Alignment and Overlay Target and Measurement Method
Measurement of a Sample Using Multiple Models
Patent:
7,465,590 →
Application:
11/173,315 →
Apparatus and Method for Non-Contact Assessment of a Constituent in Semiconductor Substrates
Scatterometry Method with Characteristic Signatures Matching
Methods and Systems for Determining Overlay Error Based on Target Image Symmetry
Scatterometer Having a Computer System That Reads Data from Selected Pixels of the Sensor Array
Apparatus and Method for Enhanced Critical Dimension Scatterometry
Apparatus and Method for Enhanced Critical Dimension Scatterometry
Method for Evaluating Microstructures on a Workpiece Based on the Orientation of a Grating on the Workpiece
Photoluminescence Imaging with Preferential Detection of Photoluminescence Signals Emitted from a Specified Material Layer of a Wafer or Other Workpiece
Differential Wavelength Photoluminescence for Non-Contact Measuring of Contaminants and Defects Located Below the Surface of a Wafer or Other Workpiece
Method for Correlating a Structural Parameter of a Plurality of Gratings and Method for Determining a Structural Parameter Value of an Unknown Grating Using the Same
Method for Measuring Dimensions and Optical System Using the Same
Spectrometer Measurement of Diffracting Structures
Patent:
7,372,565 →
Application:
11/540,990 →
Method for Inspecting a Grating Biochip
Scanning Focal Length Metrology
Patent:
7,697,135 →
Application:
11/624,182 →
Method and Apparatus for Process Control with in-Die Metrology
Correction of Optical Metrology for Focus Offset
Patent:
7,450,225 →
Application:
11/735,266 →
Method for Designing Gratings
Non-Contact Apparatus and Method for Measuring a Property of a Dielectric Layer on a Wafer
Method and Apparatus for Measuring Thickness and Optical Properties of a Thin-Film on a Substrate
Patent:
7,492,467 →
Application:
11/823,452 →
Imaging Tool Calibration Artifact and Method
Patent:
7,473,502 →
Application:
11/833,304 →
In-Plane Optical Metrology
Modeling Conductive Patterns Using an Effective Model
Overlay Measurement Target
Method for Automatically De-Skewing of Multiple Layer Wafer for Improved Pattern Recognition
Measurement of a Sample Using Multiple Models
Patent:
8,062,910 →
Application:
12/270,776 →
Determining Overlay Error Using an in-Chip Overlay Target
Line Profile Asymmetry Measurement
Simulating Two-Dimensional Periodic Patterns Using Compressed Fourier Space
Automated System Check for Metrology Unit
Patent:
8,825,444 →
Application:
12/555,721 →
Optical Metrology on Textured Samples
Silicon Filter for Photoluminescence Metrology
Method for Evaluating Microstructures on a Workpiece Based on the Orientation of a Grating on the Workpiece
Scatterometry Measurement of Asymmetric Structures
Apparatus and Method for Electrical Characterization by Selecting and Adjusting the Light for a Target Depth of a Semiconductor
Scanning Focal Length Metrology
Patent:
8,259,296 →
Application:
12/750,577 →
Simultaneous Measurement Of Multiple Overlay Errors Using Diffraction Based Overlay
Mueller Matrix Spectroscopy Using Chiroptic
Diffraction Based Overlay Linearity Testing
Scanning Focal Length Metrology
Patent:
8,259,297 →
Application:
13/074,774 →
Ellipsometer Focusing System
Local Stress Measurement
Thin Films and Surface Topography Measurement Using Reduced Library
In-Plane Optical Metrology
Measurement of a Sample Using Multiple Models
Patent:
8,252,608 →
Application:
13/301,317 →
Dark Field Diffraction Based Overlay
Apparatus and Method for Electrical Characterization by Selecting and Adjusting the Light for a Target Depth of a Semiconductor
Measurement of a Sample Using Multiple Models
Patent:
8,501,501 →
Application:
13/559,524 →
Image Based Overlay Measurement with Finite Gratings
Correction of Angular Error of Plane-of-Incidence Azimuth of Optical Metrology Device
Ellipsometer Focusing System
Optical Metrology System for Spectral Imaging of a Sample
Optical Metrology with Multiple Angles of Incidence and/or Azimuth Angles
Focusing System with Filter for Open or Closed Loop Control
Deconvolution to Reduce the Effective Spot Size of a Spectroscopic Optical Metrology Device
Via Characterization for Bcd and Depth Metrology
Simultaneous Measurement of Multiple Overlay Errors Using Diffraction Based Overlay
Optical Metrology Using Differential Fitting
Optical Metrology with Purged Reference Chip
Protected Lens Cover Plate for an Optical Metrology Device
Optical Critical Dimension Target Design
Optical Metrology System for Spectral Imaging of a Sample
Interferometric Characterization of Surface Topography
3D Target for Monitoring Multiple Patterning Process
Scanning White-Light Interferometry System for Characterization of Patterned Semiconductor Features
Deconvolution to Reduce the Effective Spot Size of a Spectroscopic Optical Metrology Device
Local Purge Within Metrology and Inspection Systems
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 23, 2000
From: PORIS, JAIME
To: NANOMETRICS INCORPORATED
Reel/Frame 010852/0585 →
Assignment of Assignor's Interest
May 23, 2000
From: PORIS, JAIME
To: NANOMETRICS INCORPORATED
Reel/Frame 010853/0175 →
Assignment of Assignor's Interest
Jul 14, 2000
From: YANG, FENG
To: NANOMETRICS INCORPORATED
Reel/Frame 010985/0411 →
Assignment of Assignor's Interest
Aug 10, 2000
From: PORIS, JAIME
To: NANOMETRICS INCORPORATED
Reel/Frame 011120/0112 →
Assignment of Assignor's Interest
Sep 25, 2000
From: HOLDEN, JAMES M.; MCGAHAN, WILLIAM; YARUSSI, RICHARD A.; ROVIRA, PABLO I.
To: NANOMETRIC INCORPORATED
Reel/Frame 011178/0048 →
Assignment of Assignor's Interest
Nov 28, 2000
From: PORIS, JAIME; RAMPOLDI, CLAUDIO L.
To: NANOMETRICS INCORPORATED
Reel/Frame 011336/0490 →
Assignment of Assignor's Interest
Feb 7, 2001
From: DU-NOUR, OFER
To: TEVET PROCESS CONTROL TECHNOLOGIES LTD
Reel/Frame 011563/0713 →
Assignment of Assignor's Interest
Apr 27, 2001
From: MCGAHAN, WILLIAM A.
To: NANOMETRICS INCORPORATED
Reel/Frame 011776/0466 →
Assignment of Assignor's Interest
May 29, 2001
From: LI, GUOGUANG; CHHIBBER, RAJESHWAR C.
To: NANOMETRICS INCORPORATED
Reel/Frame 011866/0026 →
Assignment of Assignor's Interest
Jul 3, 2001
From: ROVIRA, PABLO I.; ZHUANG, GUORONG VERA; HEATON, JOHN D.
To: NANOMETRICS INCORPORATED
Reel/Frame 011968/0386 →
Assignment of Assignor's Interest
Aug 31, 2001
From: ORSCHEL, BENNO; HELM, JAN; SROCKA, BERND
To: AOTI OPERATING COMPANY, INC.
Reel/Frame 012132/0331 →
Assignment of Assignor's Interest
Sep 20, 2001
From: LOWE-WEBB, ROGER R.
To: NANOMETRICS INCORPORATED
Reel/Frame 012230/0429 →
Corrective Assignment to Correct the Name and the Address of the Assignee Previously Recorded on Reel 01178 Frame 0048
Oct 9, 2001
From: HOLDEN, JAMES M.; MCGAHAN, WILLIAM A.; YARUSSI, RICHARD A.; ROVIRA, PABLO I.
To: NANOMETRICS INCORPORATED
Reel/Frame 012251/0889 →
Assignment of Assignor's Interest
Nov 26, 2001
From: DU-NOUR, OFER; ISH-SHALOM, YARON
To: TEVET PROCESS CONTROL TECHNOLOGIES LTD.
Reel/Frame 012326/0158 →
Assignment of Assignor's Interest
Jan 2, 2002
From: ZHOU, JIAN; CHU, HUA
To: NANOMETRICS INCORPORATED
Reel/Frame 012445/0478 →
Assignment of Assignor's Interest
Jan 14, 2002
From: LITTAU, MICHAEL EUGENE; RAYMOND, CHRISTOPHER J.
To: ACCENT OPTICAL TECHNOLOGIES, INC.
Reel/Frame 012987/0228 →
Assignment of Assignor's Interest
Jan 25, 2002
From: TABET, MILAD F.
To: NANOMETRICS, INCORPORATED
Reel/Frame 012547/0549 →
Assignment of Assignor's Interest
Feb 8, 2002
From: KRUKAR, RICHARD H.; RAYMOND, CHRISTOPHER J.; FARRER, STEVE W.
To: ACCENT OPTICAL TECHNOLOGIES, INC.
Reel/Frame 012594/0284 →
Assignment of Assignor's Interest
Feb 8, 2002
From: SANDUSKY, JOHN V.
To: ACCENT OPTICAL TECHNOLOGIES, INC.
Reel/Frame 012593/0516 →
Assignment of Assignor's Interest
Apr 4, 2002
From: YANG, WEIDONG; LOWE-WEBB, ROGER R.
To: NANOMETRICS INCORPORATED
Reel/Frame 012773/0615 →
Assignment of Assignor's Interest
Jul 9, 2002
From: RAYMOND, CHRISTOPHER J.
To: ACCENT OPTICAL TECHNOLOGIES, INC.
Reel/Frame 013066/0874 →
Corrective Assignment to Add Assignor Previously Omitted from the Cover Sheet Recorded at Reel 012594 Frame 0284.
Oct 28, 2002
From: KRUKAR, RICHARD H.; RAYMOND, CHRISTOPHER J.; FARRER, STEVE W.; WILSON, SCOTT R.
To: ACCENT OPTICAL TECHNOLOGIES, INC.
Reel/Frame 013425/0724 →
Security Agreement
Mar 18, 2003
From: ACCENT OPTICAL TECHNOLOGIES, INC.
To: COMERCIA BANK-CALIFORNIA
Reel/Frame 013862/0518 →
Release of Security Interest
Aug 9, 2006
From: COMERICA BANK
To: ACCENT OPTICAL TECHNOLOGIES, INC.
Reel/Frame 018075/0243 →
Assignment of Assignor's Interest
Feb 2, 2007
From: ACCENT OPTICAL TECHNOLOGIES NANOMETRICS, INC.
To: NANOMETRICS INCORPORATED
Reel/Frame 018847/0138 →