Interferometric characterization of surface topography
An interferometric metrology device characterizes a surface topography of a sample at different length scales by combining the interferometric data into blocks of different length scales or by filtering the interferometric data at different length scales and then determining statistical moments or surface properties of the surface topography at the different length scales. The interferometric metrology device determines a best focus position for a processing tool based on different length scales and/or based on weighting functions that are based on the structure-dependent focus budget and a variable local topography. Additionally, the topography data may be used by itself or combined with design data, design simulation depth-of-focus data and lithography scanner focus data to define regions of interest for additional characterization with a different metrology device.
1. A method comprising:
obtaining topography data from a sample using an interferometric metrology device;
identifying regions of interest from the topography data from the sample for additional characterization; and
providing the regions of interest identified from the topography data to a different metrology device, wherein an additional inspection of only the regions of interest of the sample is performed using the different metrology device;
wherein excursions regions in the topography data or differential topography data are used to identify the regions of interest of the sample for additional characterization, wherein the differential topography data is a topography of a surface of the sample minus a topography of a nominal surface, wherein the nominal surface is one of a model surface, a surface of a calibration sample, or a mean value of the surface of the sample.
2. The method of claim 1 , wherein the different metrology device comprises one of a brightfield metrology device, darkfield metrology device, Atomic Force Microscope, Scanning Electron Microscope or X-Ray fluorescence Scanning Electron Microscope.
3. A method comprising:
obtaining topography data from a sample using an interferometric metrology device;
identifying regions of interest from the topography data from the sample for additional characterization;
providing the regions of interest identified from the topography data to a different metrology device, wherein an additional inspection of only the regions of interest of the sample is performed using the different metrology device; and
combining the topography data from the sample with at least one of design data, design simulation depth-of-focus data and lithography scanner focus data;
wherein identifying regions of interest uses the topography data combined with the at least one of the design data, the design simulation depth-of-focus data and the lithography scanner focus data.
4. The method of claim 3 , wherein combining the topography data from the sample with at least one of the design data, the design simulation depth-of-focus data and the lithography scanner focus data comprises overlaying design macro data on excursion regions in the topography data or differential topography data, wherein the regions of interest are design macros.
5. The method of claim 3 , wherein combining the topography data from the sample with at least one of the design data, the design simulation depth-of-focus data and the lithography scanner focus data comprises overlaying full-field simulated depth-of-focus data for individual design layouts on excursion regions in the topography data or differential topography data.
6. The method of claim 3 , wherein combining the topography data from the sample with at least one with the design data, the design simulation depth-of-focus data and the lithography scanner focus data comprises after a lithography exposure, overlaying scanner data logs, including focus data, on excursion regions in the topography data or differential topography data.