Electronic member, electronic part and manufacturing method therefor
When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer.
1. An electronic part, comprising:
one or more connection terminals set up in a circuit board; and
one or more electrode terminals set up in an electronic member, wherein
said one or more electrode terminals are electrically bonded to said one or more connection terminals via a bonding layer,
said bonding layer being mainly composed of sintered silver whose crystalline particle diameter is smaller than 1000 nm,
entire or a partial surface of said electrode surface being a coarsely-grained layer of metallic silver or silver oxide, said electrode surface being in no contact with said bonding layer.
2. The electronic part according to claim 1 , wherein
a resin is charged into between said circuit board and said electronic member,
said entire or said partial surface of said electrode surface being bonded to said resin via said coarsely-grained layer of metallic silver or silver oxide, said electrode surface being in no contact with said bonding layer.
3. The electronic part according to claim 1 , wherein
said sintered silver is porous, a resin being charged into pores of said sintered silver.
4. The electronic part according to claim 1 , wherein
said connection terminals or said electrodes are composed of at least one material which is selected from a simple substance, an alloy, or a mixture of Ag, Au, Cu, Pt, Ni, Co, Ti, Mo, Fe, Al, Zn.
5. The electronic part according to claim 1 , wherein
said connection terminals or said electrodes are composed of at least one material which is selected from a simple substance of Sn, a Sn alloy, or a Sn mixture.
6. The electronic part according to claim 1 , wherein
bumps exist at said bonding portion of said electrodes and said connection terminals.