Bonding silicon silicon carbide to glass ceramics
A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.
1. A method of forming a wafer chuck for use in a lithographic apparatus, comprising:
disposing silicon dioxide onto a surface of a silicon silicon carbide layer;
disposing aluminum oxide onto a surface of said silicon dioxide;
disposing a bonding solution onto a portion of one or both of a glass ceramic substrate and a surface of said aluminum oxide; and
bonding said glass ceramic substrate and the surface of said aluminum oxide together.
2. The method of claim 1 , wherein said bonding solution comprises silicate.
3. The method of claim 1 , wherein said bonding solution comprises an aqueous hydroxide solution selected from the group consisting of lithium hydroxide, sodium hydroxide, potassium hydroxide, rubidium hydroxide, cesium hydroxide, beryllium hydroxide, magnesium hydroxide, calcium hydroxide, strontium hydroxide and barium hydroxide.