Method and system for automated generation of masks for spacer formation from a desired final wafer pattern
View Patent ↗Methods and systems for generating masks for spacer formation are disclosed. As a part of a disclosed method, a predefined final wafer pattern is accessed, areas related to features in the predefined final wafer pattern are identified and a template mask is formed based on the identified areas for forming spacers on a wafer. Subsequently, a mask is formed for use in the removal of portions of the spacers to form an on wafer pattern that corresponds to the predefined final wafer pattern.
1. A method for generating two mask patterns and corresponding masks for spacer formation using an indirect double patterning process, the method comprising:
using a processor of a computer system, accessing a fixed final wafer pattern provided to the computer system;
using a processor of a computer system, separating the fixed final wafer pattern into a first layer and a second layer,
wherein the first layer comprises first features of the fixed final wafer pattern,
wherein the second layer comprises second features of the fixed final wafer pattern,
wherein the first features alternate with the second features in the fixed final wafer pattern;
using the processor of the computer system, identifying areas in the fixed final wafer pattern,
wherein each of the areas comprises one of the first features and one of the second features adjacent to the one of the first features,
wherein the first features and the second features are parallel lines, and
wherein a distance between the one of the first features and the one of the second features adjacent to the one of the first features is less than a minimum patterning space;
generating a template mask pattern for forming spacers on a wafer,
wherein the template mask pattern comprises the areas identified for the fixed final wafer pattern;
forming on a wafer a plurality of spacers using a first mask having the template mask pattern,
wherein each of the plurality of spacers comprises;
using the processor of the computer system, generating one of a field mask pattern or a cut mask pattern based on a difference between the plurality of spacers formed on the wafer and the fixed final wafer pattern;
forming on the wafer a second mask based on the one of the field mask pattern or the cut mask pattern; and
removing portions of the plurality of spacers using the second mask while remaining portions of said plurality of spacers are retained as the features representing the fixed final wafer pattern.
2. The method of claim 1 , wherein the areas are selected from the group consisting of lines and spaces.
3. The method of claim 1 further comprising verifying the fixed wafer pattern for compliance with minimum process design rules for line, space, proximity, and overlap.
4. The method of claim 1 , wherein a distance between the one of the first features and another one of the first features adjacent to the one of the first features is greater than the minimum patterning space of forming the plurality of spacers.
5. The method of claim 1 , wherein a distance between the one of the second features and another one of the second features adjacent to the one of the second features is greater than the minimum patterning space of forming the plurality of spacers.
6. The method of claim 1 , wherein the areas comprises a space between the one of the first features and the one of the second features adjacent to the one of the first features.
7. An apparatus comprising:
a computer readable memory unit; and
a processor coupled to the memory unit,
the processor for executing a method for generating two mask patterns and corresponding masks for spacer formation using an indirect double patterning process, the method comprising:
using the processor, separating a fixed final wafer pattern into a first layer and a second layer,
wherein the first layer comprises first features of the fixed final wafer pattern,
wherein the second layer comprises second features of the fixed final wafer pattern,
wherein the first features alternate with the second features in the fixed final wafer pattern;
using the processor, identifying areas in the fixed final wafer pattern,
wherein each of the areas comprises one of the first features and one of the second features adjacent to the one of the first features,
wherein the first features and the second features are parallel lines, and
wherein a distance between the one of the first features and the one of the second features adjacent to the one of the first features is less than a minimum patterning space;
generating a template mask pattern for forming spacers on a wafer,
wherein the template mask pattern comprises the areas identified for the fixed final wafer pattern;
generating one of a field mask pattern or a cut mask pattern based on a difference between a plurality of spacers formed on the wafer and the fixed final wafer pattern.
8. The apparatus of claim 7 , wherein the areas are selected from the group consisting of lines and spaces.
9. The apparatus of claim 7 , wherein the method further comprising verifying the fixed wafer pattern for compliance with minimum process design rules for line, space, proximity, and overlap.
10. The apparatus of claim 7 , wherein a distance between the one of the first features and another one of the first features adjacent to the one of the first features is greater than the minimum patterning space of forming the plurality of spacers.
11. The apparatus of claim 7 , wherein a distance between the one of the second features and another one of the second features adjacent to the one of the second features is greater than the minimum patterning space of forming the plurality of spacers.
12. The apparatus of claim 7 , wherein the areas comprises a space between the one of the first features and the one of the second features adjacent to the one of the first features.