Extending the field of view of a mask-inspection image

1. A computer-implemented method for determining a disposition of a possible defect in a photo-mask, comprising:

receiving a first image of a first region around the possible defect in the photo-mask, wherein the photo-mask corresponds to a target mask pattern;

generating, via the computer, a second image based on the first image to extend the field of view of a measurement device that acquired the first image, wherein the second image includes the first region and a second region surrounding the first region, and wherein the second region is based on the target mask pattern;

calculating a simulated mask pattern based on the second image using an inverse optical calculation in which the second image is at an image plane in a model of an optical system and the simulated mask pattern is at an object plane in the model of the optical system, wherein the second region in the second image reduces optical proximity effects in the simulated mask pattern associated with a boundary of the first region;

simulating a wafer pattern in a photo-lithographic process based on the simulated mask pattern; and

determining the disposition of the possible defect based on the simulated wafer pattern and a target wafer pattern.

2. The method of claim 1 , wherein generating the second region in the second image involves filtering a portion of the target mask pattern based on an optical transfer function associated with the optical system; and

wherein, if needed, generating the second region in the second image involves averaging information in the first region in the first image with information in the second region at a boundary between the first region and the second region.

3. The method of claim 1 , wherein the optical system includes a photo-mask inspection system.

4. The method of claim 1 , wherein simulating the wafer pattern involves a forward optical calculation in which the simulated mask pattern is at an object plane in a model of a photo-lithographic system and the simulated wafer pattern is at an image plane in the model of the photo-lithographic system.

5. The method of claim 4 , wherein simulating the wafer pattern involves simulating development of a photo-resist.

6. The method of claim 1 , wherein determining the disposition involves comparing the simulated wafer pattern and the target wafer pattern.

7. The method of claim 6 , wherein determining the disposition involves identifying whether or not the possible defect is an actual defect based on the comparison.

8. The method of claim 1 , wherein determining the disposition involves calculating a manufacturing yield associated with the photo-mask.

9. The method of claim 1 , wherein determining the disposition involves calculating a process window associated with the photo-mask.

10. The method of claim 1 , wherein the first image includes information associated with a transmission imaging mode in the optical system.

11. A computer-program product for use in conjunction with a computer system, the computer-program product comprising a non-transitory computer-readable storage medium and a computer-program mechanism embedded therein for determining a disposition of a possible defect in a photo-mask, the computer-program mechanism including:

instructions for receiving a first image of a first region around the possible defect in the photo-mask, wherein the photo-mask corresponds to a target mask pattern;

instructions for generating a second image based on the first image to extend the field of view of a measurement device that acquired the first image, wherein the second image includes the first region and a second region surrounding the first region, and wherein the second region is based on the target mask pattern;

instructions for calculating a simulated mask pattern based on the second image using an inverse optical calculation in which the second image is at an image plane in a model of an optical system and the simulated mask pattern is at an object plane in the model of the optical system, wherein the second region in the second image reduces optical proximity effects in the simulated mask pattern associated with a boundary of the first region;

instructions for simulating a wafer pattern in a photo-lithographic process based on the simulated mask pattern; and

instructions for determining the disposition of the possible defect based on the simulated wafer pattern and a target wafer pattern.

12. The computer-program product of claim 11 , wherein generating the second region in the second image involves filtering a portion of the target mask pattern based on an optical transfer function associated with the optical system; and

wherein, if needed, generating the second region in the second image involves averaging information in the first region in the first image with information in the second region at a boundary between the first region and the second region.

13. The computer-program product of claim 11 , wherein the optical system includes a photo-mask inspection system.

14. The computer-program product of claim 11 , wherein simulating the wafer pattern involves a forward optical calculation in which the simulated mask pattern is at an object plane in a model of a photo-lithographic system and the simulated wafer pattern is at an image plane in the model of the photo-lithographic system.

15. The computer-program product of claim 11 , wherein determining the disposition involves comparing the simulated wafer pattern and the target wafer pattern.

16. The computer-program product of claim 15 , wherein determining the disposition involves identifying whether or not the possible defect is an actual defect based on the comparison.

17. The computer-program product of claim 11 , wherein determining the disposition involves calculating a manufacturing yield associated with the photo-mask.

18. The computer-program product of claim 11 , wherein determining the disposition involves calculating a process window associated with the photo-mask.

19. The computer-program product of claim 11 , wherein the first image includes information associated with a transmission imaging mode in the optical system.

20. A computer system, comprising:

at least one processor;

at least one memory; and

at least one program module, the program module stored in the memory and configured to be executed by the processor to determine a disposition of a possible defect in a photo-mask, the program module including:

instructions for receiving a first image of a first region around the possible defect in the photo-mask, wherein the photo-mask corresponds to a target mask pattern;

instructions for generating a second image based on the first image to extend the field of view of a measurement device that acquired the first image, wherein the second image includes the first region and a second region surrounding the first region, and wherein the second region is based on the target mask pattern;

instructions for calculating a simulated mask pattern based on the second image using an inverse optical calculation in which the second image is at an image plane in a model of an optical system and the simulated mask pattern is at an object plane in the model of the optical system, wherein the second region in the second image reduces optical proximity effects in the simulated mask pattern associated with a boundary of the first region;

instructions for simulating a wafer pattern in a photo-lithographic process based on the simulated mask pattern; and

instructions for determining the disposition of the possible defect based on the simulated wafer pattern and a target wafer pattern.