Radiation-sensitive resin composition
A radiation-sensitive resin composition includes (A) an acid labile group-containing resin which becomes alkali-soluble by an action of an acid, (B) a radiation-sensitive acid generator, and (C) a solvent. The resin (A) includes repeating units shown by formulas (1) and (2), wherein R 1 and R 2 represent a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, R 3 represents a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, X represents a hydrogen atom, a hydroxyl group, or an acyl group, m represents an integer from 1 to 18, and n represents an integer from 4 to 8.
1. A radiation-sensitive resin composition comprising:
(A) an acid labile group-containing resin, which becomes alkali-soluble by an action of an acid, and which comprises a repeating unit having a lactone skeleton;
(B) a radiation-sensitive acid generator; and
(C) a solvent,
the resin (A) comprising repeating units shown by formulas (1) and (2),
wherein R 1 represents a hydrogen atom or an unsubstituted methyl group, X represents a hydroxyl group, and m represents an integer from 1 to 18,
wherein, R 2 represents a hydrogen atom or an unsubstituted methyl group, R 3 represents a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, and n represents an integer from 4 to 8,
wherein a content of the repeating unit shown by formula (1) in the resin (A) is from 5 to 20 mol %, a content of the repeating unit shown by formula (2) in the resin (A) is from 5 to 50 mol %, and a content of the repeating unit having a lactone skeleton in the resin (A) is not more than 41.9 mol %,
wherein the repeating unit shown by the formula (2) comprises at least one repeating unit selected from repeating units derived from compounds shown by formulas (M-2-1) and (M-2-2),
wherein R 2 represents a hydrogen atom or an unsubstituted methyl group,
wherein the repeating unit having a lactone skeleton in the resin (A) is derived from a compound shown by a formula (M-3),
2. The composition according to claim 1 , wherein the resin (A) further comprises at least one repeating unit selected from repeating units shown by formulas (3-1), (3-2), (3-3), and (3-4),
wherein R 4 represents a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, R 5 represents a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, and, if plural R 5 groups exist in a single repeating unit among the repeating units, the plural R 5 groups are either same or different.
3. The composition according to claim 2 , wherein the composition is used for forming a contact hole pattern.
4. The composition according to claim 1 , wherein the composition is used for forming a contact hole pattern.
5. The composition according to claim 1 , wherein the solvent (C) comprises at least one of linear or branched ketones, cyclic ketones, propylene glycol monoalkyl ether acetates, alkyl 2-hydroxypropionates, alkyl 3-alkoxypropionates, and γ-butyrolactone.
6. The composition according to claim 1 , further comprising: an acid diffusion controller.
7. The composition according to claim 6 , wherein the acid diffusion controller comprises a nitrogen-containing compound.
8. A pattern forming method comprising:
applying the composition according to claim 1 to a substrate to form a resist film; and
exposing and developing the resist film.
9. The pattern forming method according to claim 8 , wherein the resist film is heated after exposure.
10. The pattern forming method according to claim 8 , wherein the resist film is exposed using a liquid immersion lithographic method, and wherein a liquid immersion protective film is provided on the resist film.