Microphone apparatus
A microphone apparatus includes a mounting substrate, and at least two MEMS microphone elements mounted on the mounting substrate. The mounting substrate is provided with respective sound holes located directly under the MEMS microphone elements.
1. A stereo microphone apparatus comprising:
a mounting substrate;
at least two MEMS microphone elements mounted on the mounting substrate; and
a cover formed on the mounting substrate to cover the MEMS microphone elements, wherein
the mounting substrate is provided with respective sound holes in the mounting substrate located directly under the MEMS microphone elements, and
the MEMS microphone elements share a single chamber defined by the mounting substrate and the cover.
2. The stereo microphone apparatus of claim 1 , further comprising:
a first output wire and a second output wire, wherein
the at least two MEMS microphone elements comprise a first MEMS microphone element and a second MEMS microphone element, and
the first output wire and the second output wire corresponding to the first MEMS microphone element and the second MEMS microphone element respectively are connected to the substrate.
3. The stereo microphone apparatus of claim 2 , wherein
the MEMS microphone elements are arranged in two pairs, and
the alignment of one pair is orthogonal to the alignment of the other pair.
4. The stereo microphone apparatus of claim 3 , wherein
a part of the vibrating film is made of an electret material.
5. The stereo microphone apparatus of claim 3 , wherein
the vibrating film is made of polysilicon, and
the fixed film is made of an insulating film and polysilicon.
6. The stereo microphone apparatus of claim 2 , wherein
each of the MEMS microphone elements includes a semiconductor substrate, a vibrating film formed on the semiconductor substrate, and a fixed film formed to face the vibrating film.
7. The stereo microphone apparatus of claim 2 , wherein
each of the MEMS microphone elements has a single path passing through each of the sound holes directly under the MEMS microphone elements respectively.
8. The stereo microphone apparatus of claim 1 , wherein
the chamber and the sound holes are acoustically separated by the each of the MEMS microphone elements mounted on the mounting substrate.
9. The stereo microphone apparatus of claim 1 , wherein
a bonding material is applied to the entire periphery of each of the MEMS microphone elements so that the chamber and the sound holes are acoustically separated by the each of the MEMS microphone elements.
10. The stereo microphone apparatus of claim 9 , wherein
the MEMS microphone elements are arranged in two pairs, and
the alignment of one pair is orthogonal to the alignment of the other pair.
11. The stereo microphone apparatus of claim 9 , wherein
each of the MEMS microphone elements includes a semiconductor substrate, a vibrating film formed on the semiconductor substrate, and a fixed film formed to face the vibrating film.
12. The stereo microphone apparatus of claim 1 , wherein the cover is made of a conductive material.
13. The stereo microphone apparatus of claim 1 , wherein the cover is fixed to the mounting substrate with a conductive adhesive.
14. The stereo microphone apparatus of claim 1 , wherein
the MEMS microphone elements include are arranged in two pairs, and
the alignment of one pair is orthogonal to the alignment of the other pair.
15. The stereo microphone apparatus of claim 1 , wherein
each of the MEMS microphone elements includes a semiconductor substrate, a vibrating film formed on the semiconductor substrate, and a fixed film formed to face the vibrating film.
16. The stereo microphone apparatus of claim 1 , further comprising
a signal processor mounted on the mounting substrate, and performing given arithmetic processing in accordance with an output signal from each of the MEMS microphone elements.
17. The stereo microphone apparatus of claim 16 , wherein the signal processor and the MEMS microphone elements are integrated in a single chip.
18. The stereo microphone apparatus of claim 16 , wherein
the signal processor and the mounting substrate are electrically coupled to each other with a through electrode.
19. The stereo microphone apparatus of claim 16 , wherein
the signal processor is flip-chip mounted on the mounting substrate.
20. The stereo microphone apparatus of claim 1 , wherein
each of the MEMS microphone elements has a single path passing through each of the sound holes directly under the MEMS microphone elements respectively.