Biasing a pre-metalized non-conductive substrate
Methods and apparatus are provided for static-biasing a pre-metalized non-conductive substrate within a process chamber. A substrate holder that holds a pre-metalized non-conductive substrate is engaged by a lift mechanism that provides movement of the substrate in a first, upward direction to a contact position within the process chamber and in a second direction to a non-contact position. When the substrate holder is moved to the contact position, the substrate electrically engages a conductive spring-loaded compliance mechanism that is mounted in a fixed position within the process chamber. The spring-loaded compliance mechanism is connected to a bias-voltage feed-through for the process chamber that applies a bias voltage to the substrate via the spring-loaded compliance mechanism.
1. An apparatus comprising:
a substrate holder adapted for holding a pre-metalized non-conductive substrate;
a conductive spring-loaded compliance mechanism connected to a bias voltage, wherein the conductive spring-loaded compliance mechanism is operable to apply the bias voltage to the substrate when the substrate is brought into contact with the conductive spring-loaded compliance mechanism; and
a lift mechanism, wherein
the lift mechanism is operable to move the substrate holder in a first direction to bring the substrate into contact with the spring-loaded compliance mechanism, thereby connecting the spring-loaded compliance mechanism through the substrate to the lift mechanism, and
the lift mechanism is operable to move the substrate holder in a second direction to disconnect the substrate from the spring-loaded compliance mechanism, thereby disconnecting the spring loaded compliance mechanism from the lift mechanism through the substrate.
2. An apparatus as in claim 1 , wherein the substrate comprises a glass substrate.
3. An apparatus as in claim 1 , wherein the substrate includes a chromium-containing alloy formed on a surface thereof.
4. The apparatus of claim 1 , wherein the spring-loaded compliance mechanism comprises:
at least one conductive spring-loaded contact for engagement with the pre-metalized non-conductive substrate when the substrate is brought into contact with the spring-loaded compliance mechanism.
5. The apparatus of claim 4 , wherein the at least one conductive spring-loaded contact comprises a leaf spring.
6. The apparatus of claim 4 further comprising:
a conductive top radial contactor that includes a push-rod; and
a spring operable to apply force to the push-rod for establishing electrical contact between the conductive top radial contactor and the premetalized non-conductive substrate when the substrate becomes in contact with the spring-loaded compliance mechanism.
7. The apparatus as in claim 6 , wherein the top radial contactor as an arc radius that is substantially the same as arc radius of the substrate.
8. The apparatus as in claim 6 , wherein the conductive top radial contactor comprises stainless steel.
9. The apparatus as in claim 6 , wherein the spring comprises spring-tempered steel wire.
10. The apparatus as in claim 4 , wherein the at least one conductive spring-loaded contact comprises BeCu.
11. The apparatus as in claim 4 , wherein the at least one conductive spring-loaded contact is approximately 0.005 inch thick and approximately 0.16 inch wide.
12. An apparatus comprising:
a bias voltage feed through component configured to receive a bias voltage and further configured to apply the bias voltage to a pre-metalized non-conductive substrate when the pre-metalized non-conductive substrate is brought into contact with the apparatus;
a lift mechanism, wherein
the lift mechanism is operable move a substrate holder in a first direction to bring the pre-metalized non-conductive substrate into contact with a spring-loaded compliance mechanism, thereby connecting the spring-loaded compliance mechanism through the pre-metalized non-conductive substrate to the lift mechanism, and
the lift mechanism is operable to move the substrate holder in a second direction to disconnect the pre-metalized non-conductive substrate from the spring-loaded compliance mechanism, thereby disconnecting the spring loaded compliance mechanism from the lift mechanism through the pre-metalized non-conductive substrate.
13. The apparatus as in claim 12 , wherein the substrate comprises a glass substrate.
14. The apparatus as in claim 12 , wherein the substrate includes a chromium-containing alloy formed on a surface thereof.
15. The apparatus of claim 12 , wherein the means for applying force comprises:
at least one conductive spring-loaded contact for engagement with the pre-metalized non-conductive substrate when the substrate is brought into contact with the apparatus.
16. The apparatus of claim 15 , wherein the at least one conductive spring-loaded contact comprises a leaf spring.
17. The apparatus of claim 15 further comprising:
a conductive top radial contactor that includes a push-rod, and wherein the means from applying force is operable to apply force to the push-rod for establishing electrical contact between the conductive top radial contactor and the premetalized non-conductive substrate when the substrate becomes in contact with the conductive top radial contactor.
18. The apparatus as in claim 12 , wherein the top radial contactor has an arc radius that is substantially the same as arc radius of the substrate.
19. The apparatus as in claim 12 , wherein the conductive top radial contactor comprises stainless steel.
20. The apparatus as in claim 15 , wherein the at least one conductive spring-loaded contact comprises BeCu.