Heat transfer device with anisotropic heat dissipating and absorption structures
Anisotropic thermal conducting materials are arranged in a heat dissipating device to create directional adiabatic heat transfer. In one embodiment, a preferential heat conduction is provided between a cooling substance and a dissipation layer, between a heat source and an absorption layer, and between an absorption layer and a cooling substance.
1 . A heat transfer device comprising:
a heat dissipation layer having a first face and a second face on opposite sides of the layer; wherein said first face is made for contacting a cooling substance;
a means for directing a cooling substance to or away from said first face;
wherein a structure or a layer, comprising an anisotropic thermal conducting substance, is made in close contact with said first face.
2 . The device according to claim 1 wherein said anisotropic thermal conducting substance is arranged to have a thermal conductivity substantially higher in the direction perpendicular to said first face than parallel.
3 . The device according to claim 1 wherein said anisotropic heat conducting substance comprises a plurality of micro or nanostructures.
4 . The device according to claim 1 further comprising a structure or a layer containing anisotropic thermal conducting substance placed in contact with said second face of the dissipation layer.
5 . The device according to claim 4 wherein said anisotropic thermal conducting substance is arranged to have a thermal conductance preferentially higher in the direction perpendicular to said second face than parallel to the second face.
6 . A heat transfer device comprising
an absorption section comprising at least an absorption layer having a first face and a second face on opposite sides of said absorption layer; wherein said first face of the absorption layer is made for contacting a heat source;
a dissipation section comprising a dissipation layer having a first face and a second face, wherein said first face of the dissipation layer is made for contacting a cooling substance;
a means for directing a cooling substance to or away from said absorption layer, and a means for directing said cooling substance to or away from said dissipation section;
wherein a structure or a layer, comprising an anisotropic thermal conducting substance, is disposed at said first face of the heat dissipation layer; wherein said anisotropic thermal conducting substance provides a thermal conductance substantially higher in one direction (longitudinal) than in a direction perpendicular to said longitudinal direction.
7 . The device according to claim 6 wherein said longitudinal direction of higher thermal conductance is arranged substantially perpendicular to said first face.
8 . The heat transfer device according to claim 6 wherein said anisotropic heat conducting substance comprises a plurality of micro or nanostructures.
9 . The device according to claim 7 wherein said longitudinal direction of higher thermal conductance is arranged to be substantially perpendicular to said second face.
10 . The device according to claim 6 further comprising a structure or a layer or a structure, containing anisotropic thermal conducting substance, placed in closed contact with said second face of the dissipation layer.
11 . The device according to claim 6 wherein a structure or a layer, comprising an anisotropic thermal conducting substance, is made in direct contact with said second face.
12 . A heat transfer device comprising
an absorption section comprising at least an absorption layer for contacting a heat source;
a dissipation section comprising a dissipation layer having a first face and a second face, wherein said first face of the dissipation layer is made for contacting a cooling substance;
a means for directing a cooling substance between said absorption section and dissipation section;
a layer or a structure, containing anisotropic thermal conducting substance, placed in closed contact with said second face of the dissipation layer;
wherein said anisotropic thermal conducting substance provides a thermal conductance substantially higher in one direction (the longitudinal direction) than at lest one other direction.
13 . The heat transfer device according to claim 12 wherein said anisotropic heat conducting substance comprises a plurality of micro or nanostructures.
14 . The device according to claim 12 wherein said longitudinal direction of higher thermal conductance is arranged to be substantially perpendicular to said second face.
15 . The device according to claim 12 wherein said absorption layer comprises a first face and a second face; wherein a layer or a structure comprising an anisotropic heat conducting substance is placed on or in close contact with said second face of said absorption layer.
16 . The device according to claim 12 wherein said absorption layer comprises a first face and a second face; wherein a layer or a structure comprising an anisotropic heat conducting substance is placed on or in close contact with said first face of said absorption layer.
17 . The device according to claim 15 wherein said anisotropic heat conducting substance is arranged in a manner that the thermal conductance of the anisotropic thermal conducting substance is substantially higher along a direction perpendicular to said second face of said absorption layer than parallel to said second face.
18 . The device according to claim 16 wherein said anisotropic heat conducting substance is arranged in a manner that the thermal conductance of the anisotropic thermal conducting substance is substantially higher along a direction perpendicular to said first face of said absorption layer than parallel to said first face.