CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
The present invention provides a conductor package structure that comprises a conductive base. An adhesive layer is formed on the conductive base. An electronic element is formed on the adhesive layer. Conductors form a signal connection between the surface of a filling material and the bottom of the filling material, wherein the filling material is filled in the space between the electronic element and the conductors.
1 . A conductor package structure, comprising:
a base;
an adhesive layer formed on said base;
at least one electronic element formed on said adhesive layer;
a plurality of conductors forming a signal connection between the surface of a filling material and the bottom of said filling material, wherein said filling material is filled in the space between said plurality of conductors and around said electric element; and
a re-distribution (RDL) layer formed over said electronic element and connecting between said electronic element and said connectors.
2 . The structure of claim 1 , wherein said base has at least one opening formed therein.
3 . The structure of claim 1 , wherein said base is formed between said conductors, and the bottom of said conductors and the bottom of said base are coplanar.
4 . The structure of claim 1 , wherein said adhesive layer comprises conductive material.
5 . The structure of claim 1 , wherein said filling material is adjacent to the side wall of said electronic element and said base, and cover the active side of said electronic element.
6 . The structure of claim 1 , wherein said filling material is exposed the top surface and the bottom surface of said conductors.
7 . The structure of claim 1 , further comprising a conductive layer formed between said electronic element and said adhesive layer.
8 . The structure of claim 1 , further comprising a conductive material formed under said conductors and said base.
9 . The structure of claim 1 , further comprising a dielectric layer formed under said re-distribution layer (RDL).
10 . The structure of claim 9 , further comprising a protective layer formed over said dielectric layer.
11 . The structure of claim 10 , further comprising a marking layer formed over said protective layer.
12 . The structure of claim 10 , wherein material of said protective layer includes silicone rubber, elastic material, photosensitive material or dielectric material.
13 . The structure of claim 10 , further comprising a second electronic element formed on said protective layer formed over said dielectric layer.
14 . The structure of claim 13 , wherein a die of said second electronic element is connected to said signal channels through a wire bonding.
15 . The structure of claim 10 , further comprising an Electromagnetic Interference shielding layer formed over bottom of said conductor package structure.
16 . The structure of claim 10 , further comprising an Electromagnetic Interference shielding layer formed over sidewall of said conductor package structure.
17 . The structure of claim 10 , further comprising an antenna structure formed over bottom of said conductor package structure.
18 . The structure of claim 1 , wherein the material of said base includes alloy or metal.
19 . The structure of claim 1 , wherein bottom of said conductors has a concave shape portion formed therein.
20 . The structure of claim 1 , wherein said electronic element comprises a die, a chip, a chip size package or a packaged element.