Semiconductor constructions
View Patent ↗Some embodiments include methods of forming semiconductor constructions. Oxide is formed over a substrate, and first material is formed over the oxide. Second material is formed over the first material. The second material may be one or both of polycrystalline and amorphous silicon. A third material is formed over the second material. A pattern is transferred through the first material, second material, third material, and oxide to form openings. Capacitors may be formed within the openings. Some embodiments include semiconductor constructions in which an oxide is over a substrate, a first material is over the oxide, and a second material containing one or both of polycrystalline and amorphous silicon is over the first material. Third, fourth and fifth materials are over the second material. An opening may extend through the oxide; and through the first, second, third, fourth and fifth materials.
1. A semiconductor construction, comprising:
a silicon dioxide-containing material over a semiconductor substrate;
a first material over the silicon dioxide-containing material;
a second material over the first material, the second material consisting of one or both of polycrystalline silicon and amorphous silicon;
a third material over the second material;
a fourth material over the third material;
a fifth material over the fourth material;
openings extending to the substrate through the silicon dioxide-containing material, first material, second material, third material, fourth material and fifth material; and
wherein the fourth material is identical in composition to the second material.
2. The construction of claim 1 wherein the first, third and fifth materials consist of silicon nitride.
3. The construction of claim 2 further comprising:
capacitor storage node material within the openings;
capacitor dielectric material over the capacitor storage node material; and
capacitor plate material over the capacitor dielectric material.
4. The construction of claim 1 wherein the first and third materials consist of silicon nitride; and wherein the fifth material is electrically conductive.
5. The construction of claim 4 further comprising capacitor storage node material within the openings, and capacitor dielectric material over the capacitor storage node material; and wherein the electrically conductive fifth material is capacitor plate material for capacitors comprising the capacitor storage node material and the dielectric material.
6. A semiconductor construction, comprising:
a silicon dioxide-containing material over a semiconductor substrate;
a first material over and directly against the silicon dioxide-containing material, the first material consisting of silicon nitride;
a second material over and directly against the first material, the second material consisting of one or both of polycrystalline silicon and amorphous silicon;
a third material over the second material, and having a different composition than the second material;
a patterned mask over the third material, the patterned mask having a plurality of openings extending therethrough; and
a pattern from the patterned mask extending through the first material, second material, third material, and silicon dioxide-containing material due to the openings extending through the first material, second material, third material, and silicon dioxide-containing material.
7. The construction of claim 6 wherein the third material consists of silicon nitride.
8. The construction of claim 6 wherein the third material comprises a composition other than silicon nitride.
9. The construction of claim 8 wherein the third material comprises an electrically conductive composition.
10. A semiconductor construction, comprising:
an oxide over a semiconductor substrate, the oxide having a thickness of at least about 10,000 Å;
an electrically insulative nitride over the oxide;
silicon-containing material over the nitride, the silicon-containing material consisting of one or both of polycrystalline silicon and amorphous silicon, the silicon-containing material having a thickness of at least about 3,000 Å;
a capping material over the silicon-containing material;
a patterned mask over the capping material, the patterned mask having a plurality of openings extend therethrough; and
a pattern from the patterned mask extending through the capping material, silicon-containing material, nitride, and oxide due to the openings extending through the capping material, silicon-containing material, nitride, and oxide.
11. The construction of claim 10 wherein the capping material is electrically conductive.
12. The construction of claim 10 wherein the capping material is electrically insulative.
13. The construction of claim 10 wherein the silicon-containing material is directly against the nitride; wherein the capping material is directly against the silicon-containing material, and wherein the capping material comprises an electrically insulative nitride.