METHOD OF FORMING A TEMPLATE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE TEMPLATE
A method of manufacturing a semiconductor device using a template on which a pattern is formed beforehand is disclosed. An error between a position of the pattern formed on the template and a reference position where the pattern is to be formed is obtained. An outer shape of the template is processed in accordance with the obtained error. The error of the template is corrected by distorting the template through application of pressure to a side face of the template whose outer shape is processed. The pattern is transferred onto a transfer layer formed on a semiconductor substrate by using the template in which the error is corrected.
1 . A method of forming a template that transfers a pattern onto a transfer layer formed on a semiconductor substrate, the method comprising:
obtaining an error between a position of the pattern formed on the template and a reference position where the pattern is to be formed; and
processing an outer shape of the template in accordance with the obtained error.
2 . The method according to claim 1 , wherein
the reference position is formed on the semiconductor substrate.
3 . The method according to claim 1 , wherein
the reference position is decided by an absolute position measuring apparatus.
4 . The method according to claim 1 , wherein
a correction coefficient to correct the position of the pattern is calculated from the error, and the outer shape of the template is processed on the basis of the correction coefficient.
5 . The method according to claim 4 , wherein
the pattern has a position evaluating mark, and
the correction coefficient indicates coefficients of terms when a value of an equation (2) becomes minimum, the value of the equation (2) being obtained by substituting an equation (1) described below indicating the corrected position of the position evaluating mark into the equation (2) that is a square sum of a difference between the corrected position of the position evaluating mark and the error between an actual position of the position evaluating mark and the reference position of the position evaluating mark:
dxi
′
=
k
1
+
k
3
×
xi
+
k
5
×
yi
+
k
7
×
xi
2
+
k
11
×
yi
2
+
k
13
×
xi
3
+
k
19
×
yi
3
dyi
′
=
k
2
+
k
6
×
xi
+
k
4
×
yi
+
k
12
×
xi
2
(
1
)
E
=
∑
k
=
1
m
[
(
dxi
′
-
dxi
)
2
]
+
[
(
dyi
′
-
dyi
)
2
]
(
2
)
wherein the coefficient k 1 indicates a positional deviation component in an x axis direction of the template, the coefficient k 2 indicates a positional deviation component in a y axis direction of the template, the coefficient k 3 indicates a scale component in the x axis direction, the coefficient k 4 indicates a scale component in the y axis direction, the coefficient k 5 indicates a rotational deviation component with respect to the x axis direction, the coefficient k 6 indicates a rotational deviation component with respect to the y axis direction, the coefficient k 7 indicates an eccentricity ratio component, the coefficient k 11 indicates an arched component with respect to the y axis, the coefficient k 12 indicates an arched component with respect to the x axis, the coefficient k 13 indicates a tertiary magnification component with respect to the x axis, the coefficient k 19 indicates a tertiary magnification component with respect to the y axis, i indicates an evaluation portion of the each of the position evaluating marks, m indicates a number of the position evaluating marks whose position is evaluated, xi indicates the reference position of the position evaluating mark in the x axis direction, yi indicates the reference position of the position evaluating mark in the y axis direction, dxi indicates the error between the reference position of the position evaluating mark and the actual position of the position evaluating mark in the x axis direction, dyi indicates the error between the reference position of the position evaluating mark and the actual position of the position evaluating mark in the y axis direction, dxi′ indicates the position of the position evaluating mark in the x axis direction after the correction, and dyi′ indicates the position of the position evaluating mark in the y axis direction after the correction.
6 . The method according to claim 5 , wherein
the outer shape of the template is processed in accordance with the correction coefficient having the maximum value.
7 . The method according to claim 1 , wherein
the side face of the template is processed in accordance with the error.
8 . The method according to claim 1 , wherein
the front surface of the template on which the pattern is formed is processed in accordance with the error.
9 . The method according to claim 1 , wherein
the back surface of the template that is opposite to the front surface of the template is processed in accordance with the error.
10 . A method of manufacturing a semiconductor device using a template on which a pattern is formed beforehand, the method comprising:
obtaining an error between a position of the pattern formed on the template and a reference position where the pattern is to be formed;
processing an outer shape of the template in accordance with the obtained error;
correcting the error of the template by distorting the template through application of pressure to a side face of the template whose outer shape is processed; and
transferring the pattern onto a transfer layer formed on a semiconductor substrate by using the template in which the error is corrected.
11 . The method according to claim 10 , wherein
the reference position is formed on the semiconductor substrate.
12 . The method according to claim 10 , wherein
the reference position is decided by an absolute position measuring apparatus.
13 . The method according to claim 12 , wherein
the pressure to the side face of the template is applied by a clamper that holds the template.
14 . The method according to claim 12 , wherein
the side face of the template is processed in accordance with the error.
15 . The method according to claim 12 , wherein
the front surface of the template on which the pattern is formed is processed in accordance with the error.
16 . The method according to claim 12 , wherein
the back surface of the template that is opposite to the front surface of the template is processed in accordance with the error.
17 . The method according to claim 10 , wherein
a correction coefficient to correct the position of the pattern is calculated from the error, and the outer shape of the template is processed on the basis of the correction coefficient.
18 . The method according to claim 17 , wherein
the pattern has a position evaluating mark, and
the correction coefficient indicates coefficients of terms when a value of an equation (2) becomes minimum, the value of the equation (2) being obtained by substituting an equation (1) described below indicating the corrected position of the position evaluating mark into the equation (2) that is a square sum of a difference between the corrected position of the position evaluating mark and the error between an actual position of the position evaluating mark and the reference position of the position evaluating mark:
dxi
′
=
k
1
+
k
3
×
xi
+
k
5
×
yi
+
k
7
×
xi
2
+
k
11
×
yi
2
+
k
13
×
xi
3
+
k
19
×
yi
3
dyi
′
=
k
2
+
k
6
×
xi
+
k
4
×
yi
+
k
12
×
xi
2
(
1
)
E
=
∑
i
=
1
m
[
(
dxi
′
-
dxi
)
2
]
+
[
(
dyi
′
-
dyi
)
2
]
(
2
)
wherein the coefficient k 1 indicates a positional deviation component in an x axis direction of the template, the coefficient k 2 indicates a positional deviation component in a y axis direction of the template, the coefficient k 3 indicates a scale component in the x axis direction, the coefficient k 4 indicates a scale component in the y axis direction, the coefficient k 5 indicates a rotational deviation component with respect to the x axis direction, the coefficient k 6 indicates a rotational deviation component with respect to the y axis direction, the coefficient k 7 indicates an eccentricity ratio component, the coefficient k 11 indicates an arched component with respect to the y axis, the coefficient k 12 indicates an arched component with respect to the x axis, the coefficient k 13 indicates a tertiary magnification component with respect to the x axis, the coefficient k 19 indicates a tertiary magnification component with respect to the y axis, i indicates an evaluation portion of the each of the position evaluating marks, m indicates a number of the position evaluating marks whose position is evaluated, xi indicates the reference position of the position evaluating mark in the x axis direction, yi indicates the reference position of the position evaluating mark in the y axis direction, dxi indicates the error between the reference position of the position evaluating mark and the actual position of the position evaluating mark in the x axis direction, dyi indicates the error between the reference position of the position evaluating mark and the actual position of the position evaluating mark in the y axis direction, dxi′ indicates the position of the position evaluating mark in the x axis direction after the correction, and dyi′ indicates the position of the position evaluating mark in the y axis direction after the correction.
19 . The method according to claim 18 , wherein
the outer shape of the template is processed in accordance with the correction coefficient having the maximum value.