INLINE-TYPE WAFER CONVEYANCE DEVICE
A structure is provided in which a load lock chamber ( 51 ) for carrying in and out a wafer, a first conveyance module ( 53 a ) having a first conveyance mechanism ( 54 a ), a first process module ( 52 a ), a second conveyance module ( 53 b ) having a second conveyance mechanism ( 54 b ), and a second process module ( 52 b ) are sequentially connected in series. A wafer ( 55 ) is conveyed between the load lock chamber and the first process module by the first conveyance mechanism and conveyed between the first process module and the second process module by the second conveyance mechanism.
1 . An inline-type wafer conveyance device in which:
a load lock chamber for carrying in and out a wafer;
a first conveyance module having a first conveyance mechanism;
a first process module;
a second conveyance module having a second conveyance mechanism; and
a second process module are sequentially connected in series, wherein:
the first conveyance mechanism is adapted to convey a wafer between the load lock chamber and the first process module and the second conveyance mechanism is adapted to convey a wafer between the first process module and the second process module;
the load lock chamber comprises a load chamber for carrying in an unprocessed wafer from outside and an unload chamber for carrying out a processed wafer to outside; and
the first conveyance mechanism and the second conveyance mechanism convey the unprocessed wafer carried in from the load chamber to the first process module and the second process module, and carry out the processed wafer having been processed in the first process module and the second process module to the unload chamber.
2 . (canceled)
3 . A method of conveying a substrate comprising the steps of:
carrying an unprocessed wafer into a load chamber included in a load lock chamber and evacuating the inside of the load chamber into a vacuum state;
opening a first gate valve between a first conveyance chamber connected to the load lock chamber and the load lock chamber, and a second gate valve between the first conveyance chamber and a first process module connected to the first conveyance chamber, conveying an unprocessed wafer within the load lock chamber to the first process module using a first conveyance mechanism within the first conveyance chamber, closing the first and second gate valves that have been opened, and performing first processing on the unprocessed wafer;
opening a third gate valve between the first process module and a second conveyance chamber connected to the first process module, and a fourth gate valve between the second conveyance chamber and a second process module connected to the second conveyance chamber, conveying the wafer having been subjected to the first processing within the first process module to the second process module using a second conveyance mechanism within the second conveyance chamber, closing the third and fourth gate valves that have been opened, and performing second processing on the wafer having been subjected to the first processing; and
conveying the processed wafer from the second process module to the first process module using the second conveyance mechanism, and further conveying the processed wafer from the first process module to the unload chamber within the load lock chamber and carrying out the processed wafer to outside using the first conveyance mechanism.
4 . A method of conveying a substrate according to claim 3 , wherein processing time in the first and second process modules is the same.