IP Library › Granted Patent US 9,214,632
Granted Patent B2
US 9,214,632 · App. 12/721,110 · Granted Dec 15, 2015

Manufacturing apparatus and manufacturing method of lighting device

Inventor: Shunpei Yamazaki (Tokyo, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L51/001C23C14/12C23C14/228C23C14/246C23C14/566C23C14/568H01L51/56B29C65/7844B29C65/7879B29C66/00145B29C66/452H01L51/5036
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Quick Facts
Patent No.
US 9,214,632
App. No.
12/721,110
Granted
Dec 15, 2015
Kind
B2
Abstract

A manufacturing apparatus of a lighting device, including a vacuum chamber, an exhaust system by which the vacuum chamber is set to a reduced-pressure state, and a transfer chamber from which a substrate is transferred to the vacuum chamber is provided. The vacuum chamber of the manufacturing apparatus includes a plurality of deposition chambers in which a first electrode, a first light-emitting unit including at least a light-emitting layer, an intermediate layer, a second light-emitting unit including at least a light-emitting layer, a second electrode, a sealing film are formed, and a substrate transfer means by which the substrate is sequentially transferred to the deposition chambers.

Claims (49)

1. A method for manufacturing a lighting device, comprising the steps of:

transferring a substrate to a vacuum chamber having a deposition chamber comprising a container and a plate, the plate being provided inside an inner wall of the deposition chamber, the substrate being circular and having an opening portion in a central portion;

heating the container by a first heater provided in the deposition chamber;

heating the plate by a second heater provided along a periphery of the plate;

providing a mixed gas to the container;

transferring the substrate to the deposition chamber; and

forming at least one of layers included in a light-emitting element over the substrate,

wherein the step of transferring the substrate is performed by a substrate transfer means comprising a plurality of substrate holders,

wherein each of the plurality of substrate holders has a pawl to hold the substrate from an inner side of the opening portion,

wherein a temperature of the plate heated by the second heater is set to be higher by 10° C. or higher than a temperature of the substrate heated by the first heater, and

wherein the light-emitting element comprises a hole-injecting layer, a hole-transporting layer, a light-emitting layer, an electron-transporting layer and an electron injecting layer.

2. The method for manufacturing a lighting device according to claim 1 , wherein the mixed gas comprises an organic material and a carrier gas.

3. The method for manufacturing a lighting device according to claim 1 , wherein the pawl is used as a mask when the light-emitting element is formed.

4. A method for manufacturing a lighting device, comprising the steps of:

transferring a substrate to a vacuum chamber having a deposition chamber comprising a container, a nozzle and a plate, the plate being provided inside an inner wall of the deposition chamber, and the substrate being circular and having an opening portion in a central portion;

heating the container by a first heater provided in the deposition chamber;

heating the plate by a second heater provided along a periphery of the plate;

providing a mixed gas to the container from the nozzle through a supply tube;

transferring the substrate to the deposition chamber;

forming at least one of layers included in a light-emitting element over the substrate;

transferring the substrate with the light-emitting element to a sealing chamber in the vacuum chamber; and

sealing the substrate with at least one of sealing members in the sealing chamber,

wherein the step of transferring the substrate is performed by a substrate transfer means comprising a plurality of substrate holders,

wherein each of the plurality of substrate holders has a pawl to hold the substrate from an inner side of the opening portion,

wherein a temperature of the plate heated by the second heater is set to be higher by 10° C. or higher than a temperature of the substrate heated by the first heater,

wherein the deposition chamber is placed along a circumference of a circle inside the vacuum chamber, and

wherein the light-emitting element comprises a hole-injecting layer, a hole-transporting layer, a light-emitting layer, an electron-transporting layer and an electron injecting layer.

5. The method for manufacturing a lighting device according to claim 4 , wherein the mixed gas comprises an organic material and a carrier gas.

6. The method for manufacturing a lighting device according to claim 4 , wherein the pawl is used as a mask when the light-emitting element is formed.

7. A method for manufacturing a lighting device, comprising the steps of:

transferring substrates to a vacuum chamber having a plurality of deposition chambers each comprising a container and a plate, the plate being provided inside each inner wall of the plurality of deposition chambers, and each of the substrates being circular and having an opening portion in a central portion;

heating the container by a first heater provided in each of the plurality of deposition chambers;

heating the plate by a second heater provided along a periphery of the plate in each of the plurality of deposition chambers;

providing a mixed gas to the container in each of the plurality of deposition chambers;

transferring the substrates to the plurality of deposition chambers;

forming at least one of layers included in a light-emitting element over each of the substrates;

transferring each of the substrates to a next deposition chamber concurrently;

transferring the substrates with the light-emitting element to a sealing chamber in the vacuum chamber; and

sealing each of the substrates with at least one of sealing members in the sealing chamber,

wherein the steps of transferring the substrates are performed by a substrate transfer means comprising a plurality of substrate holders,

wherein each of the plurality of substrate holders has a pawl to hold each of the substrates from an inner side of the opening portion,

wherein a temperature of the plate heated by the second heater is set to be higher by 10° C. or higher than a temperature of the substrates heated by the first heater,

wherein the plurality of deposition chambers is placed along a circumference of a circle inside the vacuum chamber, and

wherein the light-emitting element comprises a hole-injecting layer, a hole-transporting layer, a light-emitting layer, an electron-transporting layer and an electron injecting layer.

8. The method for manufacturing a lighting device according to claim 7 , wherein the mixed gas comprises an organic material and a carrier gas.

9. The method for manufacturing a lighting device according to claim 7 ,

wherein one of the plurality of substrate holders is lowered to place one of the substrates on a deposition mask before the deposition treatment, and

wherein the one of the plurality of substrate holders lifts the one of the substrates from the deposition mask after the deposition treatment.

10. The method for manufacturing a lighting device according to claim 7 , wherein the pawl is used as a mask when the light-emitting element is formed.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2010
From: YAMAZAKI, SHUNPEI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 024059/0877 →
Priority Claims (1)
JP 2009-067048 · Mar 18, 2009 · national
Continuity (1)
Related Publication 20100236691A1 · Sep 23, 2010