Electronic module with center mounting fasteners

1. An electronic module comprising:

a base comprising an upper insulating layer that does not substantially conduct electricity and a lower heat-dissipating layer both layers spanning across at least six heat-generating electronic components,

at least one peripheral fastener at each opposed end of said module,

at least one interiorly positioned, non-peripheral fastener between said at least one peripheral fastener at each opposed end of said module, said non-peripheral fastener positioned between said at least six electronic components,

wherein a top surface of said upper layer of said base comprises at least six electronic components, and

wherein said at least one interiorly positioned fastener is interposed between said at least two peripheral fasteners and said at least six electronic components and directly through said upper layer of said base and at least into or through said lower layer to maintain contacting engagement between said layers by said at least one interiorly positioned fastener to prevent bowing or warping between said layers of said module,

said module operating at between 40 to 900 volts

said module comprising at least six heat generating modules, at least three modules being coaxial along a longitudinal axis of said module.

2. The electronic module of claim 1 , wherein

said at least one interiorly positioned fastener is interposed between a pair of tangent lines from an innermost circumferential edge of said peripheral fasteners which perpendicularly intersect a side of said module.

3. The electronic module of claim 1 , wherein

said at least one interiorly positioned fastener attaches said central region of said electronic module to an object by a screw.

4. The electronic module of claim 3 , wherein

said screw applies a force of about forty eight to fifty two inch/pounds.

5. The electronic module of claim 1 , wherein

said lower heat-dissipating layer is a heat sink.

6. The electronic module of claim 5 , wherein

said heat sink comprises correspondingly positioned at least two peripheral fasteners and at least one interiorly positioned fastener.

7. The electronic module of claim 1 , wherein

said lower heat-dissipating layer is metallic.

8. The electronic module of claim 1 , wherein

wherein said upper insulating layer is a dielectric layer.

9. The electronic module of claim 1 , wherein

said base is three layers, wherein said three layers further comprises a first metallic layer, an intermediary dielectric layer, and a third metallic layer.

10. The electronic module of claim 9 , wherein

said first metallic layer further comprises a peripheral outer edge, wherein said peripheral outer edge is at least a minimum distance from sides of said third layer to create a non-conductive zone.

11. The electronic module of claim 10 , wherein

said at least one interiorly positioned fastener is located within said peripheral outer edge of said first metallic layer.

12. The electronic module of claim 1 , wherein

said at least one interiorly positioned fastener is two interiorly positioned fasteners.

13. The electronic module of claim 1 , wherein

said at least one interiorly positioned fastener is an opening.

14. The electronic module of claim 13 , wherein

said opening is a hole.

15. The electronic module of claim 1 , wherein

said at least one interiorly positioned fastener is located at a point near a center of said electronic module.

16. An electronic module comprising:

a base, said base comprising at least six heat-generating electronic modules,

at least two peripheral fasteners, each peripheral fastener positioned at opposed ends of said module,

at least one interiorly positioned fastener situated between said at least six electronic modules,

wherein said base comprises electronic components and further comprises at least one layer,

wherein said at least one layer of said base is three layers, said layers spanning between said at least six electronic modules, wherein said three layers further comprises a first metallic layer, an intermediary dielectric layer, and a third metallic layer,

wherein said first metallic layer further comprises a peripheral outer edge, wherein said peripheral outer edge is at least a minimum distance from sides of said third layer to create a non-conductive zone, and

wherein said at least one interiorly positioned fastener is interposed between said at least two peripheral fasteners and interiorly of said first metallic layer, said at least one interiorly positioned fastener at least partially securing a central region of said three layers to prevent bowing or warping,

said module operating at between 40 to 900 volts,

said module comprising at least six heat generating modules at least three modules being coaxial along a longitudinal axis of said module.

17. An electronic module comprising:

a base comprising an upper insulating layer that does not substantially conduct electricity and a lower heat-dissipating layer, both layers spanning across at least six heat-generating electronic components,

at least two peripheral fasteners each fastener positioned at an opposed peripheral edge of said base,

at least one interiorly positioned fastener situated in a non-peripheral region between said at least six electronic modules,

means for selecting a location for said at least one interiorly positioned fastener that at least partially secures a central region of said electronic module to a heat-dissipating object to prevent bowing or warping of said base,

means for attaching electronic components to said base, and wherein said base further comprises at least one layer,

means for securing said electronic module to said object.

18. An electronic module with at least one interiorly positioned fastener that at least partially secures a central region of said electronic module to an object to prevent bowing or warping, comprising:

a base comprising a heat sink essentially coextensive with said base and spanning at least six heat-generating electronic components and said at least one interiorly positioned fastener to fasten said base and said heat sink,

wherein said base comprises the at least six heat-generating electronic components and further comprises at least one layer, and

wherein said at least one interiorly positioned fastener is interposed between said at least two peripheral fasteners and between at least three of the six of said electronic components on said base.

19. The electronic module of claim 18 , wherein said module further comprises

at least two peripheral fasteners at opposed ends of said module.

20. The electronic module of claim 18 , wherein said at least one layer of said base is three layers, wherein said three layers further comprises

a first metallic layer,

an intermediary dielectric layer, and

a third metallic layer.